Resin composition, reflector, lead frame with reflector, and semiconductor light-emitting device

Patent metadata

Field	Value
Publication number	US-10454008-B2
Application number	US-201515111081-A
Country	US
Kind code	B2
Filing date	Jan 13, 2015
Priority date	Jan 14, 2014
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

A resin composition including an olefin resin, an alkenyl-containing alkoxy silane compound, and at least one inorganic filler selected from the group consisting of titanium oxide, alumina, talc, clay, aluminum, aluminum hydroxide, mica, iron oxide, graphite, carbon black, calcium carbonate, zinc sulfide, zinc oxide, barium sulfate, and potassium titanate; a reflector using the resin composition; a reflector-bearing lead frame; and a semiconductor light-emitting device. Accordingly, provided by the present invention are: a resin composition capable of expressing an excellent heat resistance (especially heat distortion resistance) even when it is made to a formed body; a reflector using the resin composition; a reflector-bearing lead frame; and a semiconductor light-emitting device.

First claim

The invention claimed is:

1. A resin composition comprising:
an olefin resin that is at least any one of polypropylene, polymethylpentene, and a homopolymer of polyethylene,
a trialkoxy silane compound containing an alkenyl group with a carbon number of 1 to 20, and
at least one inorganic filler selected from the group consisting of titanium oxide, alumina, talc, clay, aluminum, aluminum hydroxide, mica, iron oxide, graphite, carbon black, calcium carbonate, zinc sulfide, zinc oxide, barium sulfate, and potassium titanate,
wherein the composition comprises 200 to 600 parts by mass of the inorganic filler relative to 100 parts by mass of the olefin resin.

2. The resin composition according to claim 1 , wherein the resin composition further comprises silica.

3. The resin composition according to claim 1 , wherein the resin composition further comprises a flow improver.

4. A reflector comprising a hardened material of the resin composition according to claim 1 .

5. A reflector-bearing lead frame comprising a hardened material of the resin composition according to claim 1 .

6. A semiconductor light-emitting device, wherein
the semiconductor light-emitting device has on a substrate thereof an optical semiconductor element and a reflector which is arranged around the optical semiconductor element and reflects a light from the optical semiconductor element to a prescribed direction, and
a light reflecting surface of the reflector comprises a hardened material of the resin composition according to claim 1 .

7. The resin composition according to claim 1 , wherein the inorganic filler is titanium oxide.

8. The resin composition according to claim 1 , wherein the composition comprises 0.1 to 20 parts by mass of the trialkoxy silane compound relative to 100 parts by mass of the olefin resin.

9. The resin composition according to claim 1 , wherein the resin composition is an electron beam-hardenable resin composition.

10. The resin composition according to claim 3 , wherein the flow improver is triallyl isocyanurate.

11. A resin composition comprising:
an olefin resin that is at least any one of polypropylene, polymethylpentene, and a homopolymer of polyethylene,
a trialkoxy silane compound containing an alkenyl group with a carbon number of 1 to 20, and
titanium oxide.

12. The resin composition according to claim 1 , wherein the olefin resin is polymethylpentene.

13. The resin composition according to claim 11 , wherein the olefin resin is polymethylpentene.

14. The resin composition according to claim 1 , wherein the composition comprises 3 to 20 parts by mass of the trialkoxy silane compound relative to 100 parts by mass of the olefin resin.

15. The resin composition according to claim 11 , wherein the composition comprises 3 to 20 parts by mass of the trialkoxy silane compound relative to 100 parts by mass of the olefin resin.

16. The resin composition according to claim 1 , wherein the average particle diameter of the inorganic filler is from 0.21 μm to 100 μm.

17. The resin composition according to claim 11 , wherein the average particle diameter of the titanium oxide is from 0.21 μm to 100 μm.

Assignees

• Dainippon Printing Co Ltd

Inventors

• Sakai Toshiyuki
• Amagai Kei
• Kanke Satoru
• Kimura Aki
• Takarabe Toshimasa
• Sakayori Katsuya
• Sasou Tomoki

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• C08K5/5425 Primary

  containing at least one C=C bond · CPC title

• C08K5/541

  containing oxygen · CPC title

• C08K2003/2241

  Titanium dioxide · CPC title