Display apparatus and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10453875-B2
Application number	US-201815911243-A
Country	US
Kind code	B2
Filing date	Mar 5, 2018
Priority date	Aug 31, 2015
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

A method of manufacturing a display apparatus includes separating a light-emitting diode (“LED”) chip from a base substrate; disposing the separated light-emitting diode chip in a solution; disposing a substrate including a first electrode thereon, in the solution; with the separated light-emitting diode chip and the substrate including the first electrode thereon in the solution, applying a negative voltage to the substrate to attract the separated light-emitting diode chip to the first electrode on the substrate; mounting the light-emitting diode chip attracted to the first electrode, on the first electrode; and removing the substrate with the light-emitting diode chip mounted on the first electrode from the solution and drying the removed substrate, to form the display apparatus.

First claim

What is claimed is:

1. A display apparatus comprising:
a substrate comprising a first recess and a second recess; and
a first light-emitting diode chip which emits a first color and is mounted on the first recess; and
a second light-emitting diode chip which emits a second color and is mounted on the second recess, the second color being different from the first color,
wherein
each of the first and second recesses includes a first electrode and a second electrode spaced apart from each other along a thickness direction of the substrate,
a shape of each of the first and second light-emitting diode chips corresponds to the arrangement of the first and second electrodes spaced apart from each other of the first and second recesses on which the first and second light-emitting diode chips are mounted, respectively,
each of the first and second light-emitting diode chips includes a first electrode pad and a second electrode pad, the first electrode pad and the second electrode pad being arranged along the thickness direction of the substrate, and
the first electrode pad is disposed closer to a bottom surface of the substrate than the second electrode pad.

2. The apparatus of claim 1 , wherein the first recess and the second recess have a same shape.

3. The apparatus of claim 1 , wherein the first recess and the second recess have different shapes from each other.

4. The apparatus of claim 1 , wherein
the first electrode contacts the first electrode pad, and
the second electrode contacts the second electrode pad.

5. The apparatus of claim 4 , further comprising a thin film transistor between the substrate, and each of the first and second recesses, respectively,
wherein one of the first electrode and the second electrode is electrically connected to the thin film transistor.

6. The apparatus of claim 5 , further comprising a bank between the second electrode and the thin film transistor in the direction toward the substrate, the bank covering an edge of the first electrode.

7. The apparatus of claim 1 , further comprising an encapsulation member which encapsulates the first light-emitting diode chip and the second light-emitting diode chip,
wherein the encapsulation member individually encapsulates each of the first light-emitting diode chip and the second light-emitting diode chip.

8. The apparatus of claim 1 , further comprising an encapsulation member which encapsulates the first light-emitting diode chip and the second light-emitting diode chip,
wherein the encapsulation member commonly encapsulates both of the first light-emitting diode chip and the second light-emitting diode chip.

9. A display apparatus comprising:
a substrate comprising a first recess, a second recess and a third recess;
a first light-emitting diode chip which is mounted on the first recess and emits a first color;
a second light-emitting diode chip which is mounted on the second recess and emits a second color different from the first color; and
a third light-emitting diode chip which is mounted on the third recess and emits a third color different from the first color and the second color,
wherein
each of a light-emitting diode chip among the first, second and third light-emitting diode chips includes a first electrode pad and a second electrode pad arranged spaced apart from each other along a thickness direction of the substrate,
a shape of a respective recess among the first, second and third recesses corresponds to the arrangement of the first and second electrodes spaced apart from each other of the light-emitting diode chip mounted thereon,
the display apparatus emits a white color as a mixture of the first, second and third colors,
each of the first and second light-emitting diode chips includes a first electrode pad and a second electrode pad, the first electrode pad and the second electrode pad being arranged along the thickness direction of the substrate, and
the first electrode pad is disposed closer to a bottom surface of the substrate than the second electrode pad.

10. A display apparatus comprising:
a substrate comprising a plurality of recesses each including a first electrode and a second electrode arranged spaced apart from each other; and
a plurality of light-emitting diode chips respectively mounted in the plurality of recesses,
wherein
each one light-emitting diode chip among the plurality of light-emitting diode chips, which is mounted in a recess among the plurality of recesses, comprises a first electrode pad and a second electrode pad which is disposed closer to a bottom surface of the substrate than the first electrode pad, and
along the thickness direction of the substrate, a shape of the each one light-emitting diode chip corresponds to positions of the first electrode and the second electrode spaced apart from each other.

Assignees

• Samsung Display Co Ltd

Inventors

• Bae Jongsung
• Kim Mugyeom

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W90/00

  Package configurations · CPC title

• H01L2224/95085

  Electricity · mapped topic

• H01L25/50

  Electricity · mapped topic

• H01L25/0753

  Electricity · mapped topic