Wafer laminate and making method

Patent metadata

Field	Value
Publication number	US-10453732-B2
Application number	US-201615360418-A
Country	US
Kind code	B2
Filing date	Nov 23, 2016
Priority date	Nov 26, 2015
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

A wafer laminate has an adhesive layer ( 3 ) sandwiched between a transparent substrate ( 1 ) and a water ( 2 ), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer ( 3 ) includes a first cured resin layer ( 3 a ) disposed adjacent the substrate and having light-shielding properties and a second cured resin layer ( 3 b ) disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition.

First claim

The invention claimed is:

1. A wafer laminate comprising a transparent substrate, an adhesive layer formed on the substrate, and a wafer bonded to the adhesive layer, with a circuit-forming surface of the wafer facing the adhesive layer,
the adhesive layer including a first cured resin layer (A) disposed adjacent the substrate and having light-shielding properties and a second cured resin layer (B) disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition,
wherein the first cured resin layer (A) having light-shielding properties has a transmittance of up to 15% at wavelength 500 nm and substantial absorption at wavelength up to 500 nm.

2. The wafer laminate of claim 1 wherein the second cured resin layer (B) is a cured product of a thermosetting resin composition based on a silicone resin polymer and/or epoxy resin polymer, the cured product having a resin modulus of 10 to 1,000 MPa at 25° C.

3. The wafer laminate of claim 2 wherein the thermosetting resin composition is based on a phenol-modified silicone resin and/or epoxy-modified silicone resin.

4. The wafer laminate of claim 3 wherein the thermosetting resin composition based on a phenol-modified silicone resin is a composition comprising 100 parts by weight of a phenol-modified silicone resin comprising repeating units represented by the general formula (2) and having a weight average molecular weight of 3,000 to 500,000, and 0.1 to 50 parts by weight of at least one crosslinker which is selected from epoxy compounds having on average at least two epoxy groups per molecule,

wherein R 8 to R 11 are each independently a C 1 -C 8 monovalent hydrocarbon group, m is an integer of 1 to 100, B is a positive number, A is 0 or a positive number, A+B=1, and X is a divalent organic group having the general formula (3):

wherein Z is a divalent organic group selected from the following:

n is 0 or 1, R 12 and R 13 each are C 1 -C 4 alkyl or alkoxy, and k is 0, 1 or 2.

5. The wafer laminate of claim 3 wherein the thermosetting resin composition based on an epoxy-modified silicone resin is a composition comprising 100 parts by weight of an epoxy-modified silicone resin comprising repeating units represented by the general formula (4) and having a weight average molecular weight of 3,000 to 500,000, and 0.1 to 50 parts by weight of at least one crosslinker which is selected from phenol compounds having on average at least two phenol groups per molecule and epoxy compounds having on average at least two epoxy groups per molecule,

wherein R 8 to R 11 are each independently a C 1 -C 8 monovalent hydrocarbon group, m is an integer of 1 to 100, B is a positive number, A is 0 or a positive number, A+B=1, and Y is a divalent organic group having the general formula (5):

wherein V is a divalent organic group selected from the following:

p is 0 or 1, R 14 and R 15 each are C 1 -C 4 alkyl or alkoxy, and h is 0, 1 or 2.

6. The wafer laminate of claim 1 wherein the first cured resin layer (A) has a thickness of 0.1 to 30 μm, and the second cured resin layer (B) has a thickness of 1 to 200 μm.

7. A wafer laminate comprising a transparent substrate, an adhesive layer formed on the substrate, and a wafer bonded to the adhesive layer, with a circuit-forming surface of the wafer facing the adhesive layer,
the adhesive layer including a first cured resin layer (A) disposed adjacent the substrate and having light-shielding properties and a second cured resin layer (B) disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition,
wherein the first cured resin layer (A) is a cured product of a resin composition comprising a polymer comprising repeating units having the general formula (1):

wherein R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 are each independently hydrogen, hydroxyl, or a C 1 -C 20 monovalent organic group, at least one of R 1 to R 3 is hydroxyl, at least one of R 4 to R 6 is hydroxyl, R 7 is a single bond or a C 1 -C 20 divalent organic group, W is a single bond or a C 1 -C 30 divalent organic group, and q is such a natural number that the polymer has a weight average molecular weight of 500 to 500,000.

8. The wafer laminate of claim 7 wherein the resin composition of the first cured resin layer (A) further comprises at least one of a crosslinker, an acid generator and an organic solvent.

9. A method for preparing the wafer laminate of claim 1 by bonding the wafer at its circuit-forming surface to the transparent substrate through the adhesive layer, said method comprising the steps of:
(a) forming the first cured resin layer (A) having light-shielding properties or a resin composition layer (A′) for forming the first cured resin layer (A) directly on the transparent substrate,
(b) forming a thermosetting resin composition layer (B′) for forming the second cured resin layer (B) on the first cured resin layer (A) or resin composition layer (A′),
(c) bonding the wafer at its circuit-forming surface to the thermosetting resin composition layer (B′) under a reduced pressure,
(d) heat curing the thermosetting resin composition layer (B′) to form the second cured resin layer (B) and to bond it to the first cured resin layer (A), or when the resin composition layer (A′) is used, simultaneously heat curing the resin composition layer (A′) and the thermosetting resin composition layer (B′) to form the first and second cured resin layers (A) and (B) and bond them together, and
(e) grinding or polishing a non-circuit forming surface of the wafer bonded to the substrate.

10. A method for preparing the wafer laminate of claim 1 by bonding the wafer at its circuit-forming surface to the transparent substrate through the adhesive layer, said method comprising the steps of:
(a) forming the first cured resin layer (A) having light-shielding properties or a resin composition layer (A′) for forming the first cured resin layer (A) directly on the transparent substrate,
(b′) forming a thermosetting resin composition layer (B′) for forming the second cured resin layer (B) on the circuit-forming surface of the wafer,
(c′) bonding the first cured resin layer (A) or resin composition layer (A′) on the substrate and the thermosetting resin composition layer (B′) on the wafer under a reduced pressure,
(d) heat curing the thermosetting resin composition layer (B′) to form the second cured resin layer (B) and to bond it to the first cured resin layer (A), or when the resin composition layer (A′) is used, simultaneously heat curing the resin composition layer (A′) and the thermosetting resin composition layer (B′) to form the first and second cured resin layers (A) and (B) and bond them together, and
(e) grinding or polishing a non-circuit-forming surface of the wafer bonded to the substrate.

Assignees

• Shinetsu Chemical Co

Inventors

• Yasuda Hiroyuki
• Sugo Michihiro
• Kato Hideto

Classifications

• H10P72/7442

  Separation by peeling · CPC title

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title