Touch sensing unit and display device including the same
US-12164734-B2 · Dec 10, 2024 · US
US10452214B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10452214-B2 |
| Application number | US-201715627435-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 19, 2017 |
| Priority date | Feb 16, 2017 |
| Publication date | Oct 22, 2019 |
| Grant date | Oct 22, 2019 |
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A manufacturing method of a single type touch panel structure includes steps as follows. A transparent metal oxide layer is configured on a substrate. The transparent metal oxide layer is patterned to form a first electrode pattern on the substrate. A transferable transparent conductive film is thermally laminated onto the first electrode pattern so that a photo sensitive layer is sandwiched between the transparent metal oxide layer and a transparent conductive coating layer. The transferable transparent conductive film is patterned for mutually forming a second electrode pattern on the transparent conductive coating layer and one surface of the photo sensitive layer adjoining the transparent conductive coating layer.
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What is claimed is: 1. A manufacturing method of a single type touch panel structure, comprising: configuring a transparent metal oxide layer on a substrate; patterning the transparent metal oxide layer to form a first electrode pattern on the substrate; thermally laminating a transferable transparent conductive film having a transparent conductive coating layer and a photo sensitive layer onto the first electrode pattern so that the photo sensitive layer is sandwiched between the transparent metal oxide layer and the transparent conductive coating layer; and patterning the transferable transparent conductive film for mutually forming a second electrode pattern on the transparent conductive coating layer and one surface of the photo sensitive layer adjoining the transparent conductive coating layer. 2. The manufacturing method of the single type touch panel structure of claim 1 , wherein the step of patterning the transferable transparent conductive film for mutually forming the second electrode pattern on the transparent conductive coating layer and the one surface of the photo sensitive layer adjoining the transparent conductive coating layer, further comprises: exposing and developing one surface of the transparent conductive coating layer opposite to the photo sensitive layer so that the same area of the transparent conductive coating layer and the one surface of the photo sensitive layer is partially removed. 3. The manufacturing method of the single type touch panel structure of claim 1 , wherein the step of forming the transparent metal oxide layer on the substrate, comprises: thermally laminating another transferable transparent conductive film having another transparent conductive coating layer and another photo sensitive layer onto one surface of the substrate so that the another photo sensitive layer is sandwiched between the one surface of the substrate and the another transparent conductive coating layer. 4. The manufacturing method of the single type touch panel structure of claim 3 , wherein the step of patterning the transparent metal oxide layer to form a first electrode pattern on the substrate, further comprising: exposing and developing the another transferable transparent conductive film so that the same area of the another transparent conductive coating layer and the one surface of the another photo sensitive layer is partially removed. 5. The manufacturing method of the single type touch panel structure of claim 1 , wherein the step of forming the transparent metal oxide layer on the substrate, comprises: forming a metal-oxide-semiconductor film on one surface of the substrate. 6. A single type touch panel structure, comprising: a substrate; a photo sensitive conductive film comprising a photo sensitive layer and a sensing electrode layer, wherein one surface of the photo sensitive layer is partially provided with a protrusive portion, and the protrusive portion and the sensing electrode layer are identical in pattern, and the sensing electrode layer is only located at one surface of the protrusive portion opposite to the photo sensitive layer, and fully covers on the one surface of the protrusive portion; and a transparent metal oxide layer sandwiched between the substrate and the photo sensitive layer, and the transparent metal oxide layer comprising another sensing electrode layer. 7. The single type touch panel structure of claim 6 , wherein the transparent metal oxide layer is another photo sensitive conductive film having another photo sensitive layer sandwiched between the sensing electrode layer and the another sensing electrode layer, one surface of the another photo sensitive layer is partially provided with another protrusive portion, and the another protrusive portion and the another sensing electrode layer are identical in pattern, and the another sensing electrode layer is only located at one surface of the another protrusive portion opposite to the another photo sensitive layer, and fully covers on the one surface of the another protrusive portion. 8. The single type touch panel structure of claim 7 , wherein a spacing layer is formed between the photo sensitive layer and the remaining area of the one surface of the another photo sensitive layer provided without the another protrusive portion. 9. The single type touch panel structure of claim 7 , wherein a minimum linear distance of a gap defined between the photo sensitive layer and the remaining area of the one surface of the another photo sensitive layer provided without the another protrusive portion is between 0-1 μm. 10. The single type touch panel structure of claim 6 , wherein the sensing electrode layer comprises nano metal wires. 11. The single type touch panel structure of claim 6 , wherein the transparent metal oxide layer is a metal-oxide-semiconductor film directly sandwiched between the substrate and the photo sensitive layer.
Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title
Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate · CPC title
by capacitive means · CPC title
using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes · CPC title
using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer · CPC title
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