Pattern formation method, lithography apparatus, lithography system, and article manufacturing method
US-2015008605-A1 · Jan 8, 2015 · US
US10451965B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10451965-B2 |
| Application number | US-201615063824-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 8, 2016 |
| Priority date | Mar 18, 2015 |
| Publication date | Oct 22, 2019 |
| Grant date | Oct 22, 2019 |
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The present invention provides an imprint system which performs an imprint process of forming a pattern of an imprint material on the substrate by using a mold, the system comprising a plurality of processing units each including a dispenser which supplies the imprint material onto the substrate and configured to perform the imprint process, a library configured to manage a plurality of pieces of layout information, and a control unit configured to, when the mold used by a first processing unit is used by a second processing unit, control the second processing unit, based on a difference in condition for the imprint process between the first and second processing units, by using layout information having a difference corresponding to the difference in condition for the imprint process with respect to layout information used by the first processing unit.
Opening claim text (preview).
What is claimed is: 1. An imprint system which performs an imprint process of forming a pattern of an imprint material on a substrate by using a mold, the system comprising: a plurality of processing units including a first processing unit and a second processing unit, each of the first processing unit and the second processing unit having a dispenser configured to supply an imprint material onto a shot region of a substrate and being configured to perform the imprint process; a library configured to manage a plurality of pieces of layout information which are different from each other, each of the plurality of pieces of layout information indicating a layout of the imprint material to be supplied from the dispenser onto a shot region; and controller configured to control the plurality of processing units, wherein in a case where the mold that has been used by the first processing unit is to be used by the second processing unit, the controller is configured to: select layout information different from first layout information which has been used by the first processing unit from among the plurality of pieces of layout information managed by the library, as second layout information to be used by the second processing unit, based on a difference in a condition for the imprint process between the first processing unit and the second processing unit, and control the second processing unit to supply an imprint material onto a shot region from the dispenser based on the selected second layout information. 2. The system according to claim 1 , wherein the condition for the imprint process includes at least one of an evaporation volume of imprint material per unit time in an imprint process and an amount and position accuracy of imprint material supplied from the dispenser to a shot region. 3. The system according to claim 1 , wherein the controller is configured to select the second layout information, further based on a change in a pattern shape of the mold over time, such that the change in the pattern shape of the mold over time is compensated by a difference between the first layout information and the second layout information. 4. The system according to claim 3 , wherein the controller is configured to obtain information concerning the change in the pattern shape of the mold over time from a result of measuring the pattern shape of the mold or a result of measuring a shape of an imprint material molded by the mold. 5. The system according to claim 3 , wherein the change in the pattern shape of the mold over time includes at least one of a change in the pattern shape of the mold caused by the imprint process in the first processing unit and a change in the pattern shape of the mold caused by a cleaning process for the mold. 6. The system according to claim 3 , wherein the change in the pattern shape of the mold over time includes at least one of changes in depth, taper angle, and line width of each of concave portions included in a concave-convex pattern formed on the mold. 7. The system according to claim 1 , wherein the library manages the plurality of pieces of layout information in association with a processing unit and a mold, and the controller is configured to select the second layout information from among the plurality of pieces of layout information managed by the library, based on the difference in the condition for the imprint process, in a case where the plurality of pieces of layout information include no layout information managed in association with the mold and the second processing unit. 8. The system according to claim 1 , wherein in a case where the plurality of pieces of layout information include no layout information as the second layout information capable of compensating the difference in the condition for the imprint process, the controller is configured to generate the second layout information by correcting the first layout information. 9. The system according to claim 8 , wherein the controller is configured to generate the second layout information by increasing or decreasing the number of imprint materials in the first layout information in accordance with the difference in the condition for the imprint process. 10. The system according to claim 1 , wherein the plurality of pieces of layout information are generated based on a dimension of a pattern formed on the mold and a residual layer thickness of the imprint material to be formed on a shot region after the imprint material is molded by the mold. 11. The system according to claim 10 , wherein the dimension of the pattern formed on the mold includes a desired value or an actual measured value of the pattern formed on the mold. 12. The system according to claim 1 , wherein each of the first processing unit and the second processing unit has a holder configured to hold a mold, and a stage configured to hold a substrate. 13. The system according to claim 1 , wherein the controller is configured to select, as the second layout information, layout information different from the first layout information by an amount of an imprint material capable of compensating the difference in the condition for the imprint process between the first processing unit and the second processing unit. 14. The system according to claim 13 , wherein the amount of the imprint material capable of compensating the difference in the condition for the imprint process is defined by the number of droplets of the imprint material to be supplied on a shot region. 15. The system according to claim 1 , wherein the controller is configured to select the second layout information, such that the difference in the imprint process between the first processing unit and the second processing unit is compensated by a difference between the first layout information and the second layout information.
Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography · CPC title
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor (using photoresist structures for special production processes, see the relevant places, e.g. B44C, H10P76/00, H05K) · CPC title
Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title
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