Diaphragm, pressure sensor using diaphragm, and diaphragm producing method

Patent metadata

Field	Value
Publication number	US-10451506-B2
Application number	US-201715678416-A
Country	US
Kind code	B2
Filing date	Aug 16, 2017
Priority date	Nov 29, 2016
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

Provided herein is a diaphragm that is highly durable, and that does not involve the risk of gas leakage, and a pressure sensor using such a diaphragm. The diaphragm is a metallic diaphragm that includes a plate-shaped pressure receiver, and a frame-like support member. The pressure receiver has a metal structure grown parallel to a flat plate surface of the plate-shaped pressure receiver.

First claim

What is claimed is:

1. A metallic diaphragm comprising a plate-shaped pressure receiver, and a frame-like support member,
wherein the pressure receiver has a metal structure grown parallel to a flat plate surface of the plate-shaped pressure receiver, and
wherein the pressure receiver comprises a Co—Ni-base alloy of a composition range containing, in mass %, Co: 28 to 42%, Ni: 15 to 40%, Cr: 10 to 27%, Mo: 3 to 12%, Ti: 0.1 to 1%, Mn: 1.5% or less, Fe: 0.1 to 26%, C: 0.1% or less, Nb: 3% or less, W: 5% or less, Al: 0.5% or less, and the balance unavoidable impurities.

2. The diaphragm according to claim 1 , wherein the pressure receiver is bonded to an end surface of the support member.

3. The diaphragm according to claim 1 , wherein the pressure receiver and the support member are integrally formed.

4. A pressure sensor using the diaphragm according to claim 1 .

5. A method for producing a metallic diaphragm that includes a plate-shaped pressure receiver, and a frame-like support member,
the method comprising:
flattening a raw material alloy ingot, and punching a flattened worked plate with a forming press to produce the pressure receiver having a metal structure grown parallel to a flat plate surface of the plate; and
bonding the pressure receiver to an end surface of the support member,
wherein the pressure receiver comprises a Co—Ni-base alloy of a composition range containing, in mass %, Co: 28 to 42%, Ni: 15 to 40%, Cr: 10 to 27%, Mo: 3 to 12%, Ti: 0.1 to 1%, Mn: 1.5% or less, Fe: 0.1 to 26%, C: 0.1% or less, Nb: 3% or less, W: 5% or less, Al: 0.5% or less, and the balance unavoidable impurities.

6. The method according to claim 5 , wherein the pressure receiver and the end surface of the support member are bonded to each other by diffusion bonding.

7. A method for producing a metallic diaphragm that includes a plate-shaped pressure receiver, and a frame-like support member,
the method comprising:
cold working a raw material alloy ingot into a rod shape to produce a rod body having a metal structure extending along the working direction;
cutting the rod body into a desired size to obtain a block unit, and machining the block unit to integrally form the pressure receiver and the support member in such an orientation that the growth direction of the metal structure is parallel to a flat plate surface of the plate-shaped pressure receiver.

8. The method according to claim 7 , wherein the pressure receiver comprises a Co—Ni-base alloy of a composition range containing, in mass %, Co: 28 to 42%, Ni: 15 to 40%, Cr: 10 to 27%, Mo: 3 to 12%, Ti: 0.1 to 1%, Mn: 1.5% or less, Fe: 0.1 to 26%, C: 0.1% or less, Nb: 3% or less, W: 5% or less, Al: 0.5% or less, and the balance unavoidable impurities.

9. The method according to claim 7 , wherein the pressure receiver comprises a duplex stainless steel of a composition range containing, in mass %, Cr: 24 to 26%, Mo: 2.5 to 3.5%, Ni: 5.5 to 7.5%, C: 0.03% or less, N: 0.08 to 0.3%, and the balance Fe and unavoidable impurities.

Assignees

• Seiko Instr Inc

Inventors

• Kobayashi Tomoo
• Sugawara Ryo

Classifications

• G01L9/0044 Primary

  Constructional details of non-semiconductive diaphragms · CPC title

• G01L9/0055

  bonded on a diaphragm · CPC title

• G01L7/082 Primary

  construction or mounting of diaphragms (of semiconductive diaphragms G01L9/0042) · CPC title

• B23K20/023

  Thermo-compression bonding · CPC title

• G01L9/0051 Primary

  using variations in ohmic resistance · CPC title