LED device

Patent metadata

Field	Value
Publication number	US-10450504-B2
Application number	US-201916279154-A
Country	US
Kind code	B2
Filing date	Feb 19, 2019
Priority date	Jan 16, 2018
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.

First claim

The invention claimed is:

1. A LED device, comprising: an LED module including multiple LED chips mounted on a first terminal area and a second terminal area, the first terminal area and the second terminal area have different sizes and there are different numbers of the LED chips respectively placed on the first terminal area and the second terminal area; a first fluorescent layer with a first side facing to the LED module; and a package housing for holding the substrate and the first fluorescent layer.

2. The LED device of claim 1 , wherein the multiple LED chips emit a blue light, the first terminal area and the second terminal area are provided for respectively connected to a positive terminal and a negative terminal of a power source, there are wires electrically connected the LED chips on the first terminal area and the second terminal area.

3. The LED device of claim 1 , wherein the first fluorescent layer comprises red phosphor material contained in first silicone part, a second fluorescent layer upon the first fluorescent layer comprises green phosphor material contained in a second silicone part, and wherein a part of the green light excites the red phosphor if the green light hits the red phosphor.

4. The LED device of claim 3 , wherein a first volume ratio of the red phosphor to the first silicone part is larger than a second volume ratio of the green phosphor to the second silicone part.

5. The LED device of claim 3 , wherein a first volume ratio of the red phosphor to the first silicone part is smaller than a second volume ratio of the green phosphor to the second silicone part.

6. The LED device of claim 1 , wherein a thickness of the first fluorescent layer is larger than a thickness of the second fluorescent layer.

7. The LED device of claim 1 , wherein a thickness of the first fluorescent layer is smaller than a thickness of the second fluorescent layer.

8. The LED device of claim 1 , wherein the first fluorescent layer has better heat resisting feature than the second fluorescent layer.

9. The LED device of claim 1 , wherein the package housing has a bottom part fixed to the substrate and the package housing has a surrounding wall extended from the bottom part, the wall defines a containing space for holding the first fluorescent layer.

10. The LED device of claim 9 , wherein a second side of the second fluorescent layer has a curved surface.

11. The LED device of claim 10 , wherein an angle of edges of the first side and the second side of the second fluorescent layer is less than 60 degrees.

12. The LED device of claim 10 , wherein the curve surface forms a convex lens.

13. The LED device of claim 1 , wherein area of the second side of the second fluorescent layer is smaller than area of the second side of the first fluorescent layer.

14. The LED device of claim 13 , wherein a part of the second side of the first fluorescent layer is exposed and uncovered by the second fluorescent layer.

15. The LED device of claim 14 , wherein the second side of second fluorescent layer is surrounded by the second side of the first fluorescent layer from a top view.

16. The LED device of claim 1 , wherein the package housing has a ladder wall for engaging with a peripheral part of the second fluorescent layer.

17. The LED device of claim 16 , wherein the second side of the second fluorescent layer forms a flat surface.

18. The LED device of claim 16 , wherein the second side of second florescent layer forms a curve surface.

19. The LED device of claim 1 , wherein the second side of the second fluorescent layer has multiple convex part corresponding to multiple underlying LED chips of the LED module.

20. The LED device of claim 1 , wherein the LED module is mounted on the substrate with surface mount device (SMD) technology.

Assignees

• Leedarson Lighting Co Ltd

Inventors

• Chen Yanbiao
• Cao Liangliang
• Chen Huiwu
• Wang Qiyuan

Classifications

• H10W90/00

  Package configurations · CPC title

• C09K11/59

  containing silicon · CPC title

• F21K9/64

  using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer · CPC title

• C08K3/34

  Silicon-containing compounds · CPC title

• C09K11/0883 Primary

  Arsenides; Nitrides; Phosphides · CPC title