Die-cut patterns for blister package

US10450126B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10450126-B2
Application numberUS-201313950596-A
CountryUS
Kind codeB2
Filing dateJul 25, 2013
Priority dateJul 6, 2011
Publication dateOct 22, 2019
Grant dateOct 22, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A blister package is formed for retaining individual products. The package includes a receptacle substrate having a sealing flange and at least one receiving cell formed to retain product therein. A polymer top layer covers the cell and a portion thereof is sealed to the sealing flange. A score pattern is formed in at least one surface of the top layer and overlapping the cell. The score pattern is defined by a first plurality of score lines formed in a repeating pattern and a second plurality of score lines formed in a repeating pattern. The first and second plurality of rows overlap one another to define a plurality of intersections, with the overall score line pattern having a total linear length of the score lines per cell of at least 5 inches and a total number of score line intersections per cell of at least 10.

First claim

Opening claim text (preview).

What is claimed is: 1. A blister package for retaining individual products, the package comprising: a receptacle substrate, the receptacle substrate having a sealing flange and at least one receiving cell formed to retain product therein, the sealing flange surrounding the at least one receiving cell, and a cell area surrounded by and defined inwardly of the sealing flange, and a top layer covering the cell area of the at least one receiving cell and a portion thereof overlapping and sealed to the sealing flange, the top layer consisting essentially of a polymer material, and a score pattern formed in at least one surface of the top layer and overlapping the cell area of the at least one receiving cell, the score pattern formed for promoting propagation of a tear in the top layer upon application of a transverse push force of the product within the at least one receiving cell against the portion of the top layer overlapping the cell area of the at least one receiving cell, the score pattern defined by a first plurality of rows of score lines formed in a repeating pattern, the pattern of the first plurality of score lines including a series of elongated line segments each extending substantially continuously across the top layer overlapping the cell area of the at least one receiving cell and extending substantially continuously between spaced positions on the sealing flange that surrounds the cell area, and a second plurality of rows of spaced score lines formed in a repeating pattern across the top layer overlapping the cell area of the at least one receiving cell, the first and second plurality of rows overlapping one another to define a plurality of score intersections, and the score pattern having a total linear scored length of score lines per cell of at least 5 inches, and the total number of score intersections created by the score lines within the top layer covering the at least one receiving cell is at least 10. 2. A blister package as in claim 1 , wherein the portion of the top layer covering the cell area of the at least one receiving cell is less than 0.5 square inches. 3. A blister package as in claim 1 , wherein the second plurality of score lines includes a repeating pattern of circles. 4. A blister package as in claim 3 , wherein the circles vary in diameter within the pattern. 5. A blister package as in claim 1 , wherein the first plurality of score lines includes a repeating pattern of angled straight lines. 6. A blister package as in claim 1 , wherein the first plurality of score lines includes a repeating pattern of crossed straight lines. 7. A blister package as in claim 3 , wherein the repeating pattern of circles includes a plurality of concentric circles. 8. A blister package as in claim 1 , wherein one of the plurality of score lines includes a repeating pattern of angled straight lines. 9. A blister package as in claim 1 , wherein the first plurality of score lines includes a repeating pattern of chevrons. 10. A blister package as in claim 9 , wherein the second plurality of score lines includes a pattern of chevrons positioned in an opposing direction from the first plurality. 11. A blister package as in claim 1 , wherein the second plurality of score lines includes a repeating pattern of zig-zag lines. 12. A blister package as in claim 1 , wherein the second plurality of score lines includes a repeating pattern of curved lines formed in multiple rows across the at least one receiving cell. 13. A blister package as in claim 1 , wherein one of the pluralities of score lines includes a repeating pattern of parallel straight lines formed parallel to the machine direction during the formation of the top layer. 14. A blister package as in claim 1 wherein the top layer comprises a laminate composed of multiple layers of polymer material. 15. A blister package as in claim 1 wherein the top layer further comprises a seal coating, and wherein the top layer is heat sealed to the sealing flange of the receptacle substrate, the seal coating facilitating heat sealing of the top layer to the sealing flange. 16. A blister package for retaining individual products, the package comprising: a receptacle substrate, the receptacle substrate having at least one receiving cell formed to retain product therein and a sealing flange surrounding the at least one receiving cell, and a polymer top layer covering the at least one receiving cell and a portion thereof overlapping and sealed to the sealing flange, and a score pattern formed in at least one surface of the top layer and overlapping the at least one receiving cell, the score pattern formed for promoting propagation of a tear in the top layer upon application of a transverse push force of the product within the at least one receiving cell against the portion of the top layer overlapping the at least one receiving cell, the score pattern defined by a first plurality of score lines formed in a repeating pattern, the pattern of the first plurality of score lines including lines extending substantially continuously across the portion of the top layer overlapping the at least one receiving cell, from between at least two opposing, spaced positions adjacent the sealing flange, and a second plurality of score lines formed in an repeating pattern across the portion of the top layer overlapping the at least one receiving cell, the first and second pluralities of score lines overlapping one another to define a plurality of score intersections within the portion of the top layer overlapping the at least one receiving cell, wherein each of the score lines in the first plurality create within the continuous portion of the lines a plurality of score intersections with the score lines within the second plurality, wherein the score pattern comprises a total number of score intersections of at least 10, the score pattern comprises a total linear scored length of score lines overlapping the at least one cell of at least 5 inches, and the portion of the top layer inwardly of the sealing flange and overlapping the at least one receiving cell having an area of less than 0.5 square inches. 17. A blister package as in claim 16 wherein the score pattern comprises a total number of score intersections of at least 12. 18. A blister package as in claim 16 wherein the score pattern comprises a total linear length over the at least one receiving cell of at least 6 inches. 19. A blister package for retaining individual products, the package comprising: a receptacle substrate, the receptacle substrate having a sealing flange and a plurality of receiving cells, each receiving cell formed to retain product therein, and a portion of the sealing flange surrounding each receiving cell, and a polymer top layer covering the receptacle substrate, overlapping each receiving cell and a portion thereof sealed to the sealing flange for enclosing each receiving cell, and a score pattern formed in at least one surface of the top layer and overlapping each of the plurality of receiving cells, the score pattern formed for promoting propagation of a tear in the top layer upon application of a transverse push force of the product within a receiving cell against the portion of the top layer overlapping the receiving cell, the score pattern defined by a first plurality of elongated score lines formed in a repeating pattern, the pattern of the first plurality of score lines including multiple lines extending substantially continuously across a portion of the top layer overlapping each of the receiving cells and ea

Assignees

Inventors

Classifications

  • all the articles being stored in individual compartments · CPC title

  • Blister-type containers (blisters in general B65D75/36) · CPC title

  • and forming several compartments · CPC title

  • for applying, e.g. printing, code or date marks on material prior to packaging · CPC title

  • for single articles, e.g. tablets · CPC title

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Frequently asked questions

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What does patent US10450126B2 cover?
A blister package is formed for retaining individual products. The package includes a receptacle substrate having a sealing flange and at least one receiving cell formed to retain product therein. A polymer top layer covers the cell and a portion thereof is sealed to the sealing flange. A score pattern is formed in at least one surface of the top layer and overlapping the cell. The score patter…
Who is the assignee on this patent?
Sonoco Dev Inc
What technology area does this patent fall under?
Primary CPC classification B65D83/0445. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 22 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).