Electronic device manufacturing device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10449730-B2
Application number	US-201214426905-A
Country	US
Kind code	B2
Filing date	Sep 13, 2012
Priority date	Sep 13, 2012
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

When manufacturing three-dimensional electronic device by layering multiple layer cross sections sliced at a predetermined thickness of three-dimensional electronic device which is the target for forming, first, each layer cross section using multiple types of materials is formed by being layered on top of the layer cross section underneath, and each time a layer cross section is formed, the cross section is cured or sintered by being exposed to ultraviolet light, a laser beam, visible light, and so on. The forming method for each cross section may be forming cross section by discharging a binder via a droplet discharge method such as inkjet printing or dispensing, or by spreading a layer of powdered material and bonding the powdered material by discharging a binder or sintering it by exposing it to a laser beam.

First claim

The invention claimed is:

1. An electronic device manufacturing device for manufacturing a three-dimensional electronic device, comprising:
a plurality of material application units, each of the plurality of material application units hold a different one of multiple types of materials and being configured to apply the different one of the multiple types of materials;
at least two light energy sources positioned next to one another, each of the at least two light energy sources configured to emit a different one of ultraviolet light, a laser beam, visible light, or an electron beam; and
a controller programmed to:
operate the plurality of material application units to form each layer cross section of multiple layer cross sections using multiple types of materials by disposing the multiple types of materials on top of another layer cross section, and
each time a layer cross section is formed, operate the at least two light energy sources to cure or sinter the multiple types of materials, which have not been cured or sintered, of the layer cross section by exposing the layer cross section to at least two of the ultraviolet light, the laser beam, the visible light, and the electron beam.

2. The electronic device manufacturing device according to claim 1 , wherein each of the plurality of application units holds a different liquid material and is configured to apply the different liquid material.

3. The electronic device manufacturing device according to claim 1 , wherein
the plurality of material application units includes a plate-shaped container and a droplet discharger, and
the electronic device manufacturing device further includes a squeegee.

4. The electronic device manufacturing device according to claim 1 wherein the plurality of material application units are inkjet heads.

5. The electronic device manufacturing device according to claim 1 , wherein the multiple types of materials include at least two of conductive material, insulating material, dielectric material, resistor body material, and semiconductor material.

6. An electronic device manufacturing method for manufacturing a three-dimensional electronic device, comprising:
forming each layer cross section of multiple layer cross sections using multiple types of materials by disposing the multiple types of materials on top of another layer cross section, at least one of the multiple layer cross sections forming an electronic component; and
each time a layer cross section is formed, curing or sintering the multiple types of materials, which have not been cured or sintered, of the layer cross section by exposing the layer cross section to at least two of ultraviolet light, a laser beam, visible light, and an electron beam,
wherein the multiple types of materials include at least two of ink containing metal nanoparticles, an ultraviolet curable resin, a resin containing conductive filler, ferroelectric particles, and an organic semiconductor.

7. The electronic device manufacturing method according to claim 6 , wherein the multiple types of materials are liquid materials.

8. The electronic device manufacturing method according to claim 6 , wherein the multiple types of materials include at least two of conductive material, insulating material, dielectric material, resistor body material, and semiconductor material.

9. The electronic device manufacturing method according to claim 6 , wherein each time the layer cross section is formed, curing or sintering the multiple types of materials, which have not been cured or sintered, of the layer cross section by exposing the layer cross section to at least two of ultraviolet light, a laser beam, visible light, and an electron beam includes exposing the layer cross section to at least three of ultraviolet light, a laser beam, visible light, and an electron beam.

10. The electronic device manufacturing method according to claim 6 , wherein the multiple types of materials include at least three of ink containing metal nanoparticles, an ultraviolet curable resin, a resin containing conductive filler, ferroelectric particles, and an organic semiconductor.

11. The electronic device manufacturing method according to claim 6 , wherein the multiple types of materials include at least four of ink containing metal nanoparticles, an ultraviolet curable resin, a resin containing conductive filler, ferroelectric particles, and an organic semiconductor.

12. The electronic device manufacturing method according to claim 6 , wherein the multiple types of materials include ink containing metal nanoparticles, an ultraviolet curable resin, a resin containing conductive filler, ferroelectric particles, and an organic semiconductor.

13. The electronic device manufacturing method according to claim 6 , wherein the electronic component is formed by a plurality of the multiple layer cross section.

14. The electronic device manufacturing method according to claim 6 , wherein the electronic component includes at least one of a wiring, a resistor, a capacitor, and a coil.

15. The electronic device manufacturing method according to claim 6 , wherein the electronic component includes a wiring, a resistor, a capacitor, and a coil.

Assignees

• Kodama Seigo
• Tsukada Kenji
• Fujita Masatoshi
• Fuji Corp

Inventors

• Kodama Seigo
• Tsukada Kenji
• Fujita Masatoshi

Classifications

• B22F12/67

  Blades · CPC title

• B22F12/45

  Two or more · CPC title

• B22F10/14

  by jetting of binder onto a bed of metal powder · CPC title

• B22F10/28

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

• B29L2031/34

  Electrical apparatus, e.g. sparking plugs or parts thereof · CPC title