Moldable adhesive wafers

US10449082B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10449082-B2
Application numberUS-201414907166-A
CountryUS
Kind codeB2
Filing dateMay 23, 2014
Priority dateJul 23, 2013
Publication dateOct 22, 2019
Grant dateOct 22, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed herein are methods and devices for coupling and securing a medical device appliance. In particular, one piece moldable adhesive structures are disclosed which allow customization of an attachment wafer to the size and shape of, for example, a stoma, while allowing flexibility and security for attaching a medical device, such as an ostomy pouch or other device to the subject.

First claim

Opening claim text (preview).

What is claimed is: 1. A moldable adhesive comprising: at least two adhesive layers; and at least one layer of thin, flexible, elastic film between two adjacent adhesive layers to form a composite adhesive structure; wherein a proximal surface of the moldable adhesive is attached to a distal surface of a wafer unit and the distal surface of the moldable adhesive faces away from a subject's body, wherein the moldable adhesive is capable of rolling or folding proximally towards the subject's body onto itself such that an inner surface of the composite adhesive structure formed upon rolling provides a counteracting force to allow an edge of the rolled composite adhesive structure to partially return to its original size and shape, and wherein a proximal surface of the wafer unit is configured to be attached to the subject's body. 2. The moldable adhesive of claim 1 , wherein the molded surface of the wafer unit has a layer of film extending partially across the molded surface, such that an inner opening of the layer of film is larger than an inner opening of the molded surface. 3. The moldable adhesive of claim 2 , wherein the layer of film is flexible. 4. The moldable adhesive of claim 2 , wherein the moldable adhesive provides an adhesive base of attachment for a faceplate of an ostomy pouch. 5. The moldable adhesive of claim 4 , wherein the faceplate is connected to the ostomy pouch as a separate element. 6. The moldable adhesive of claim 4 , wherein the faceplate is adhesive. 7. The moldable adhesive of claim 4 , wherein an outer edge of the composite adhesive structure is larger than an opening in the faceplate of the ostomy pouch. 8. The moldable adhesive of claim 1 , wherein the two adjacent adhesive layers comprise the same adhesive formulation. 9. The moldable adhesive of claim 1 , wherein the two adjacent adhesive layers comprise different adhesive formulations. 10. The moldable adhesive of claim 1 , wherein outer and inner edges of the composite adhesive structure are closed, non-intersecting geometric figures. 11. The moldable adhesive of claim 10 , wherein the closed, non-intersecting geometric figures comprise a conic figure. 12. The moldable adhesive of claim 10 , wherein the closed, non-intersecting geometric figures comprise a circle. 13. The moldable adhesive of claim 10 , wherein the closed, non-intersecting geometric figures comprise a polygon. 14. A moldable ostomy appliance comprising a moldable ostomy wafer and an ostomy pouch, wherein the moldable ostomy wafer comprises the moldable adhesive of claim 1 . 15. The moldable adhesive of claim 10 , wherein the proximal surface of the wafer unit is adhesive.

Assignees

Inventors

Classifications

  • Use of materials characterised by their function or physical properties · CPC title

  • Colostomy, {ileostomy or urethrostomy} devices (A61F5/441, A61F5/442, A61F5/443 take precedence) · CPC title

  • A61F5/448Primary

    Means for attaching bag to seal ring · CPC title

  • having {adhesive seals for securing to the body, e.g. of} hydrocolloid type seals, e.g. gels, starches, karaya gums · CPC title

  • characterised by the skin-adhering layer · CPC title

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What does patent US10449082B2 cover?
Disclosed herein are methods and devices for coupling and securing a medical device appliance. In particular, one piece moldable adhesive structures are disclosed which allow customization of an attachment wafer to the size and shape of, for example, a stoma, while allowing flexibility and security for attaching a medical device, such as an ostomy pouch or other device to the subject.
Who is the assignee on this patent?
Convatec Technologies Inc
What technology area does this patent fall under?
Primary CPC classification A61F5/448. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Oct 22 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).