Method of masking and de-masking

US10448519B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10448519-B2
Application numberUS-201715641138-A
CountryUS
Kind codeB2
Filing dateJul 3, 2017
Priority dateJul 1, 2016
Publication dateOct 15, 2019
Grant dateOct 15, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method of masking a feature of a substrate using a fixture includes removably coupling a fixture to a first side of the feature of the substrate, the fixture including walls configured to abut sides of the feature and extend beyond a top surface of the feature when the fixture is removably coupled to the first side. The method further includes applying a masking material to the top surface of the feature. The method further includes removably coupling the fixture to a second side of the feature, the second side opposing the first side, the walls of the fixture configured to abut the sides of the feature and extend beyond a bottom surface of the feature when the fixture is removably coupled to the second side. The method further includes applying the masking material to the bottom surface of the feature while the fixture is removably coupled.

First claim

Opening claim text (preview).

What is claimed: 1. A method of masking a feature of a substrate using a fixture, comprising: removably coupling a fixture to a first side of the feature of the substrate, the fixture comprising walls configured to abut sides of the feature and extend beyond a top surface of the feature when the fixture is removably coupled to the first side, wherein the walls of the fixture extend through apertures of the substrate when the fixture is coupled to the first side of the feature of the substrate; applying a masking material to the top surface of the feature while the fixture is removably coupled to the first side of the feature; removably coupling the fixture to a second side of the feature, the second side opposing the first side, the walls of the fixture configured to abut the sides of the feature and extend beyond a bottom surface of the feature when the fixture is removably coupled to the second side; and applying the masking material to the bottom surface of the feature while the fixture is removably coupled to the second side of the feature. 2. The method of claim 1 , wherein the walls of the fixture extend through the apertures of the substrate when the fixture is coupled to the second side of the feature of the substrate. 3. The method of claim 2 , wherein the walls of the fixture extend perpendicular to a base of the fixture. 4. The method of claim 3 , wherein removably coupling the fixture to the first side of the feature of the substrate comprises forming a partial interference fit with the walls of the fixture on the sides of the feature. 5. The method of claim 1 , wherein the walls of the fixture comprises a first wall and a second wall, wherein the first wall is parallel to the second wall. 6. The method of claim 5 , wherein removably coupling the fixture to the first side of the feature of the substrate comprises inserting the first wall through a first aperture of the substrate and inserting the second wall through a second aperture of the substrate. 7. The method of claim 1 , wherein applying the masking material to the top surface of the feature comprises applying a glue to the top surface of the feature. 8. A method of masking a feature of a substrate using a fixture, comprising: removably coupling a fixture to a first side of the feature of the substrate, the fixture comprising walls configured to abut sides of the feature and extend beyond a top surface of the feature when the fixture is removably coupled to the first side, wherein the walls of the fixture comprise a first wall and a second wall, wherein the first wall is parallel to the second wall, wherein removably coupling the fixture to the first side of the feature of the substrate comprises inserting the first wall through a first aperture of the substrate and inserting the second wall through a second aperture of the substrate; applying a masking material to the top surface of the feature while the fixture is removably coupled to the first side of the feature; removably coupling the fixture to a second side of the feature, the second side opposing the first side, the walls of the fixture configured to abut the sides of the feature and extend beyond a bottom surface of the feature when the fixture is removably coupled to the second side; and applying the masking material to the bottom surface of the feature while the fixture is removably coupled to the second side of the feature. 9. The method of claim 8 , wherein the walls of the fixture extend through apertures of the substrate when the fixture is coupled to the first side of the feature of the substrate. 10. The method of claim 9 , wherein the walls of the fixture extend through the apertures of the substrate when the fixture is coupled to the second side of the feature of the substrate. 11. The method of claim 8 , wherein removably coupling the fixture to the first side of the feature of the substrate comprises forming a partial interference fit with the walls of the fixture on the sides of the feature. 12. A method of masking a feature of a substrate using a fixture, comprising: removably coupling a fixture to a first side of the feature of the substrate, the fixture comprising walls configured to abut sides of the feature and extend beyond a top surface of the feature when the fixture is removably coupled to the first side, wherein the walls of the fixture extend through apertures of the substrate when the fixture is coupled to the first side of the feature of the substrate; and applying a masking material to the top surface of the feature while the fixture is removably coupled to the first side of the feature. 13. The method of claim 12 , wherein removably coupling the fixture to the first side of the feature of the substrate comprises forming a partial interference fit with the walls of the fixture on the sides of the feature. 14. The method of claim 12 , wherein the walls of the fixture extend through the apertures of the substrate when the fixture is coupled to the second side of the feature of the substrate. 15. The method of claim 12 , wherein the walls of the fixture comprises a first wall and a second wall, wherein the first wall is parallel to the second wall. 16. The method of claim 12 , wherein removably coupling the fixture to the first side of the feature of the substrate comprises inserting the first wall through a first aperture of the substrate and inserting the second wall through a second aperture of the substrate. 17. The method of claim 12 , wherein applying the masking material to the top surface of the feature comprises applying a glue to the top surface of the feature.

Assignees

Inventors

Classifications

  • Removable films used as masks · CPC title

  • Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure · CPC title

  • Cutting, sawing, milling or shearing · CPC title

  • Applying the material on both sides · CPC title

  • H05K3/4644Primary

    by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10448519B2 cover?
A method of masking a feature of a substrate using a fixture includes removably coupling a fixture to a first side of the feature of the substrate, the fixture including walls configured to abut sides of the feature and extend beyond a top surface of the feature when the fixture is removably coupled to the first side. The method further includes applying a masking material to the top surface of…
Who is the assignee on this patent?
Hzo Inc
What technology area does this patent fall under?
Primary CPC classification H05K3/4644. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 15 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).