Circuit assembly and electrical junction box

Patent metadata

Field	Value
Publication number	US-10448497-B2
Application number	US-201615758926-A
Country	US
Kind code	B2
Filing date	Sep 6, 2016
Priority date	Sep 11, 2015
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

A circuit assembly includes a circuit board on which a coil is mounted, a heat sink, and a heat spreading plate that is separate from this heat sink. A first insulating adhesive layer is interposed between the circuit board and the heat spreading plate, and the heat spreading plate and the heat sink are fixed by a first fixing hole for a heat sink and a bolt. Accordingly, warping of the circuit board is suppressed.

First claim

The invention claimed is:

1. A circuit assembly comprising:
a circuit board on which an electronic component is mounted;
a heat dissipation plate; and
a heat spreading plate that is separate from the heat dissipation plate,
wherein an insulating adhesive layer is interposed between the circuit board and the heat spreading plate,
the heat spreading plate and the heat dissipation plate are fixed to each other by fixing means, and
the heat dissipation plate is provided with a positioning portion for positioning the heat spreading plate, the positioning portion being defined by an inner wall recessed from a top surface of the heat dissipation plate, wherein the inner wall bounds an outer peripheral edge of the heat spreading plate, the positioning portion seated within the inner wall of the positioning portion.

2. The circuit assembly according to claim 1 ,
wherein the heat spreading plate is fixed to the heat dissipation plate in a state in which the heat spreading plate is pressed against the heat dissipation plate.

3. The circuit assembly according to claim 1 ,
wherein the circuit board and the heat spreading plate are fixed to the heat dissipation plate in a state in which the circuit board and the heat spreading plate are pressed against the heat dissipation plate.

4. The circuit assembly according to claim 1 ,
wherein the adhesive layer is made of a thermally conductive material.

5. The circuit assembly according to claim 1 ,
wherein the electronic component has a lead terminal,
the lead terminal is mounted passing through the circuit board, and
a lead terminal escape hole is provided in a region of the heat spreading plate that corresponds to at least the lead terminal.

6. The circuit assembly according to claim 5 ,
wherein the lead terminal escape hole passes through the heat spreading plate, and
the heat dissipation plate is provided with, in a region that is opposite to the lead terminal, an escape recess that is recessed away from the heat spreading plate.

7. The circuit assembly according to claim 1 ,
wherein the electronic component is a surface-mount type component.

8. An electrical junction box in which the circuit assembly according to claim 1 is accommodated in a case.

9. A circuit assembly comprising:
a circuit board on which an electronic component is mounted;
a heat dissipation plate having a recessed portion disposed on a top surface; and
a heat spreading plate that is separate from the heat dissipation plate,
wherein an insulating adhesive layer is interposed between the circuit board and the heat spreading plate,
the heat spreading plate and the heat dissipation plate are fixed to each other by fixing means, the heat spreading plate seated within the recessed portion of the heat dissipation plate,
the electronic component has a lead terminal,
the lead terminal is mounted passing through the circuit board, and
a lead terminal escape hole is provided in a region of the heat spreading plate that corresponds to at least the lead terminal, wherein a portion of the lead terminal is disposed within both the lead terminal escape hole and the recessed portion.

10. The circuit assembly according to claim 9 ,
the lead terminal escape hole passes through the heat spreading plate, and
the heat dissipation plate is provided with, in a region that is opposite to the lead terminal, an escape recess that is recessed away from the heat spreading plate.

Assignees

• Autonetworks Technologies Ltd
• Sumitomo Wiring Systems
• Sumitomo Electric Industries

Inventors

• Ota Takuya
• Yamane Shigeki
• Maeda Hirotoshi
• Tsuchida Toshiyuki
• TOZAWA Yoshihiro

Classifications

• H05K1/0271

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K2201/1009

  Electromotor · CPC title

• H05K2201/068

  wherein the coefficient of thermal expansion is important · CPC title

• H05K1/0204 Primary

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title