Light emitting diode heat sink

Patent metadata

Field	Value
Publication number	US-10448459-B2
Application number	US-201916259464-A
Country	US
Kind code	B2
Filing date	Jan 28, 2019
Priority date	Sep 30, 2016
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

In some examples, a heating apparatus includes a light emitting diode (LED) array comprising an LED to heat a target object, and a heat sink thermally coupled to the LED array, to dissipate heat from the LED array, the heat sink comprising a plurality of refrigerant paths to pass a refrigerant through the heat sink in a plurality of different directions.

First claim

What is claimed is:

1. A heating apparatus comprising:
a light emitting diode (LED) array comprising an LED to heat a target object; and
a heat sink thermally coupled to the LED array, to dissipate heat from the LED array, the heat sink comprising a plurality of refrigerant paths to pass a refrigerant through the heat sink in a plurality of different directions, wherein a refrigerant path of the plurality of refrigerant paths comprises a conduit that extends from outside the heat sink and that extends through an inner portion of the heat sink, wherein an outer surface of the conduit is in thermal contact with an inner surface of the heat sink.

2. The heating apparatus of claim 1 , wherein a refrigerant path of the plurality of refrigerant paths comprises a through hole formed in the heat sink.

3. The heating apparatus of claim 1 , wherein a refrigerant path of the plurality of refrigerant paths comprises a channel formed in a surface of the heat sink.

4. The heating apparatus of claim 1 , wherein a refrigerant path of the plurality of refrigerant paths is curved within the heat sink.

5. The heating apparatus of claim 1 , wherein a refrigerant path of the plurality of refrigerant paths extends in a zig-zag manner within the heat sink.

6. The heating apparatus of claim 1 , wherein the plurality of refrigerant paths extends in a serpentine manner within the heat sink.

7. The heating apparatus of claim 1 , wherein the plurality of refrigerant paths comprises a continuous conduit extending within the heat sink in a serpentine manner.

8. The heating apparatus of claim 1 , wherein the LED array is attached to the heat sink through a thermally conductive layer.

9. The heating apparatus of claim 1 , wherein the conduit is a single component that extends from outside the heat sink and that extends through the inner portion of the heat sink.

10. An assembly comprising:
a light emitting diode (LED) array comprising an LED to heat a target object;
a heat sink thermally coupled to the LED array, the heat sink comprising a plurality of refrigerant paths to pass a refrigerant through the heat sink in a plurality of different directions, wherein a refrigerant path of the plurality of refrigerant paths comprises a conduit that extends from outside the heat sink and that extends through an inner portion of the heat sink, wherein an outer surface of the conduit is in thermal contact with an inner surface of the heat sink; and
a refrigeration system configured to:
cool the refrigerant within the refrigeration system, and
pass the cooled refrigerant through the plurality of refrigerant paths such that heat from the LED array is transferred to the cooled refrigerant via the heat sink.

11. The assembly of claim 10 , wherein the conduit is connected between the refrigeration system and the heat sink.

12. The assembly of claim 10 , wherein a refrigerant path of the plurality of refrigerant paths comprises a through hole formed in the heat sink.

13. The assembly of claim 10 , wherein a refrigerant path of the plurality of refrigerant paths comprises a channel formed in a surface of the heat sink.

14. The assembly of claim 10 , wherein the conduit is curved within the heat sink.

15. The assembly of claim 10 , wherein the conduit extends in a zig-zag manner within the heat sink.

16. The assembly of claim 10 , wherein the plurality of refrigerant paths extends in a serpentine manner within the heat sink.

17. The assembly of claim 16 , wherein the plurality of refrigerant paths comprises a continuous through hole extending within the heat sink in a serpentine manner.

18. The assembly of claim 10 , wherein the refrigeration system comprises:
a condenser to condense the refrigerant using air, and
a fan to direct heated air caused by the condensing of the refrigerant to the target object.

19. The assembly of claim 18 , wherein the refrigeration system further comprises compressor to compress the refrigerant and to provide the compressed refrigerant to the condenser.

20. The assembly of claim 19 , wherein the refrigeration system further comprises an expansion valve to expand the condensed refrigerant output by the condenser.

Assignees

• Hp Scitex Ltd

Inventors

• Veis Alex

Classifications

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• H05B3/0033

  Heating devices using lamps · CPC title

• H05B3/0066

  for photocopying · CPC title

• B41J11/00

  Devices or arrangements  {of selective printing mechanisms, e.g. ink-jet printers or thermal printers,} for supporting or handling copy material in sheet or web form (script supports connected to the typewriter or printer B41J29/15) · CPC title

• F27D11/12

  with electromagnetic fields acting directly on the material being heated · CPC title