Optocoupler device and frame module thereof

Patent metadata

Field	Value
Publication number	US-10446708-B2
Application number	US-201715784923-A
Country	US
Kind code	B2
Filing date	Oct 16, 2017
Priority date	Jul 26, 2017
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

An optocoupler device for receiving a load voltage larger than or equal to 5 KV includes a carrier, a supporting frame connected to the carrier, a light emitter and a light receiver spacedly mounted on the carrier, an electrical isolator at least partially disposed on the supporting frame, a translucent encapsulate, and an opaque encapsulate. The electrical isolator is translucent and has a dielectric strength larger than or equal to 50 KV/mm. A shortest light transmitting path between the light emitter and the light receiver passes through the electrical isolator. The supporting frame, the light emitter, the light receiver, and at least part of the electrical isolator are embedded in the translucent encapsulate, and the translucent encapsulate is embedded in the opaque encapsulate.

First claim

What is claimed is:

1. An optocoupler device, comprising:
a first conductive frame including a first embedded portion, a first bonding portion extending from an edge of the first embedded portion, and a first exposing portion extending from the other edge of the first embedded portion, wherein the first bonding portion has a first surface and a second surface opposite to the first surface;
a second conductive frame including a second embedded portion, a second bonding portion extending from an edge of the second embedded portion, and a second exposing portion extending from the other edge of the second embedded portion, wherein the second bonding portion is substantially coplanar with the first bonding portion;
a supporting stand connected to the first bonding portion and having a communication space located at an inner side thereof, wherein the supporting stand and the first conductive frame are integrally formed as one piece, and the supporting stand is perpendicularly bent with respect to the first bonding portion and is arranged away from the first exposing portion;
a plurality of optical members respectively mounted on the first surface of the first bonding portion and the second bonding portion, wherein the optical members include a light emitter and a light receiver, and a height of each of the optical members with respect to the first conductive frame is lower than a height of the supporting stand with respect to the first conductive frame;
an L-shaped electrical isolator being translucent and having a dielectric strength larger than or equal to 50 KV/mm, wherein at least part of the electrical isolator is fixed on the second surface and the supporting stand, and shields the communication space, and wherein a shortest light transmitting path between the light emitter and the light receiver passes through a portion of the electrical isolator fixed on the supporting stand, and passes through the communication space;
a translucent encapsulate, wherein the first bonding portion, the second bonding portion, the supporting stand, the optical members, at least part of the electrical isolator are embedded in the translucent encapsulate; and
an opaque encapsulate, wherein the first embedded portion, the second embedded portion, and the translucent encapsulate are embedded in the opaque encapsulate.

2. The optocoupler device as claimed in claim 1 , wherein the electrical isolator includes a protruding portion arranged away from the supporting stand, the protruding portion is connected to a portion of the electrical isolator fixed on the second surface, and the protruding portion protrudes from the translucent encapsulate and is embedded in the opaque encapsulate.

3. The optocoupler device as claimed in claim 1 , wherein the opaque encapsulate has a reflecting surface; in a cross-section of the light emitter, the light receiver, and the reflecting surface, the reflecting surface is in an ellipse shape having two focal points, and the light emitter and the light receiver are respectively located at the two focal points.

4. The optocoupler device as claimed in claim 3 , wherein at least part of the electrical isolator is adhered to the supporting stand, and the electrical isolator does not contact the reflecting surface of the opaque encapsulate.

5. The optocoupler device as claimed in claim 1 , further comprising a driving member configured to activate the light emitter to emit light, wherein the driving member and the light emitter are mounted on the second bonding portion, and the light receiver is mounted on the first bonding portion.

6. The optocoupler device as claimed in claim 1 , wherein the first exposing portion and the second exposing portion of the optocoupler device are configured to connect to a load voltage larger than or equal to 5 KV.

7. An optocoupler device for receiving a load voltage larger than or equal to 5 KV, comprising:
a carrier;
a supporting stand perpendicularly connected to the carrier, wherein the supporting stand has a communication space located at an inner side thereof;
a light emitter and a light receiver spacedly mounted on the carrier, wherein a height of each of the light emitter and the light receiver with respect to the carrier is lower than a height of the supporting stand with respect to the carrier;
an electrical isolator being translucent and having a dielectric strength larger than or equal to 50 KV/mm, wherein at least part of the electrical isolator is fixed on the supporting stand and shields the communication space, and a shortest light transmitting path between the light emitter and the light receiver passes through the electrical isolator of the communication space;
a translucent encapsulate, wherein the supporting stand, the light emitter, the light receiver, and at least part of the electrical isolator are embedded in the translucent encapsulate; and
an opaque encapsulate, wherein the translucent encapsulate is embedded in the opaque encapsulate.

8. The optocoupler device as claimed in claim 7 , wherein the opaque encapsulate has a reflecting surface; in a cross-section of the light emitter, the light receiver, and the reflecting surface, the reflecting surface is in an ellipse shape having two focal points, and the light emitter and the light receiver are respectively located at the two focal points.

9. The optocoupler device as claimed in claim 8 , wherein at least part of the electrical isolator is adhered to the supporting stand, and the electrical isolator does not contact the reflecting surface of the opaque encapsulate.

10. A frame module of an optocoupler device, comprising:
a conductive frame having a first surface and a second surface opposite to the first surface;
a supporting stand integrally formed on the conductive frame, wherein the supporting stand is perpendicularly bent with respect to the first conductive frame, and the supporting stand has a communication space located at an inner side thereof; and
an L-shaped electrical isolator being translucent and having a dielectric strength larger than or equal to 50 KV/mm, wherein at least part of the electrical isolator is fixed on the second surface and the supporting stand and shields the communication space.

Assignees

• Anpec Electronics Corp

Inventors

• Hsiao Chien-Chung
• Chien Chih-Cheng

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H03K17/78

  using opto-electronic devices, i.e. light-emitting and photoelectric devices electrically- or optically-coupled · CPC title

• H04B10/802

  for isolation, e.g. using optocouplers · CPC title

• H01L33/62

  Electricity · mapped topic

• H01L31/147 Primary

  Electricity · mapped topic