Method for attaching wiring protective film layer, wiring structure and display panel

Patent metadata

Field	Value
Publication number	US-10446413-B2
Application number	US-201715745815-A
Country	US
Kind code	B2
Filing date	Jun 22, 2017
Priority date	Jul 1, 2016
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

The present disclosure provides a method for attaching a wiring protective film layer, a wiring structure and a display panel. The attaching method comprises: forming a protective structure comprising a protective film layer and a carrier layer disposed in stack on a wiring layer, wherein the wiring layer and the protective film layer are in contact; and removing the carrier layer and remaining the protective film layer.

First claim

What is claimed is:

1. A method for attaching a wiring protective film layer comprising:
step S 1 : forming a protective structure comprising a protective film layer and a carrier layer disposed in stack on a wiring layer, wherein the wiring layer and the protective film layer are in contact;
step S 2 : removing the carrier layer and remaining the protective film layer; and recovering the carrier layer by means of reel rotation.

2. The method for attaching a wiring protective film layer according to claim 1 ,
wherein after the step S 2 , the method for attaching a wiring protective film layer further comprises:
step S 3 : curing the protective film layer.

3. The method for attaching a wiring protective film layer according to claim 2 ,
wherein the step of curing the protective film layer is performed by UV curing.

4. The method for attaching a wiring protective film layer according to claim 2 ,
wherein the step of curing the protective film layer is performed by ozone curing.

5. The method for attaching a wiring protective film layer according to claim 2 ,
wherein after the step S 2 and before the step S 3 , the method for attaching a wiring protective film layer further comprises:
step S 42 : removing any bubble between the protective film layer and the wiring layer.

6. The method for attaching a wiring protective film layer according to claim 5 ,
wherein the step S 42 comprises:
removing the bubble using a resilient attaching roller rolling on the protective film layer.

7. The method for attaching a wiring protective film layer according to claim 1 ,
wherein the step S 1 comprises:
step S 11 : cutting a protective film to form the protective film layer, but not cutting a carrier film disposed in stack with the protective film, a part of the carrier film corresponding to the protective film layer being the carrier layer; and
step S 12 : attaching the protective film layer and the carrier layer disposed in stack onto the wiring layer.

8. The method for attaching a wiring protective film layer according to claim 7 ,
wherein the step S 12 comprises:
attaching the protective film layer and the carrier layer disposed in stack onto the wiring layer by a pressure head device.

9. The method for attaching a wiring protective film layer according to claim 1 ,
wherein after the step S 1 and before the step S 2 , the method for attaching a wiring protective film layer further comprises:
step S 41 : removing any bubble between the protective film layer and the wiring layer.

10. The method for attaching a wiring protective film layer according to claim 9 ,
wherein the step S 41 comprises:
removing the bubble using a resilient attaching roller rolling on the protective film layer.

11. The method for attaching a wiring protective film layer according to claim 1 ,
wherein the step S 2 comprises:
peeling off the carrier layer carrying the protective film layer by a peeling device comprising two peeling rods respectively provided on upper and lower sides of the carrier layer.

12. A wiring structure, comprising:
a wiring layer; and
a protective structure comprising a protective film layer and to be attached using the method for attaching a wiring protective film layer according to claim 1 so that the wiring layer and the protective film layer are in contact.

13. The wiring structure according to claim 12 ,
wherein the protective film layer has a thickness no greater than approximately 30 μm.

14. A display panel, comprising the wiring structure according to claim 12 .

15. The display panel according to claim 14 ,
wherein the wiring structure is located at a non-display area of the display panel.

Assignees

• Boe Technology Group Co Ltd
• Chengdu Boe Optoelect Tech Co

Inventors

• Zeng mu
• Wang Tao
• Wang Zhouping
• Yang Guowen

Classifications

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/01 Primary

  Manufacture or treatment · CPC title

• H10W74/019 Primary

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title