System and method for dispensing liquid spin-on glass (SOG) onto semiconductor wafers

Patent metadata

Field	Value
Publication number	US-10446390-B2
Application number	US-201313929964-A
Country	US
Kind code	B2
Filing date	Jun 28, 2013
Priority date	Jun 28, 2013
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

A device and method for dispensing liquid spin-on glass (SOG) onto semiconductor wafers. The method includes dispensing liquid SOG through a dispenser nozzle, detecting liquid SOG outside of the dispenser nozzle, indicating the presence of liquid SOG in an abnormal length relative to the dispenser nozzle and adjusting a suck back (SB) valve to withdraw liquid SOG from the abnormal length.

First claim

What is claimed is:

1. A method of controlling deposition of liquid spin-on glass (SOG) onto a semiconductor wafer, comprising:
detecting, using a first sensor, the liquid SOG outside of a dispenser nozzle in an abnormal length relative to the dispenser nozzle;
adjusting, using a controller, a suck back (SB) valve to withdraw liquid SOG from the abnormal length;
comparing a sensed amount of liquid SOG deposited onto the semiconductor wafer, from a second sensor, with at least one operating parameter prior to the adjusting;
pausing sensing of an amount of liquid SOG dispensed onto the semiconductor wafer based on the sensed amount of liquid SOG deposited being outside the at least one operating parameter; and
storing at least one signal from the second sensor in the controller based on the sensed amount of liquid SOG deposited being outside the at least one operating parameter.

2. The method of claim 1 , wherein the detecting comprises sensing the liquid SOG with a laser/photodetector pair by indicating a change in laser light received by the photodetector.

3. The method of claim 2 , wherein the laser light movably scans for the presence of liquid SOG.

4. The method of claim 1 , wherein the detecting comprises sensing liquid SOG outside of the dispenser nozzle by a change in detected sound, infrared light or radar.

5. The method of claim 1 , wherein the detecting comprises sensing liquid SOG outside of the dispenser nozzle by a change in a detected magnetic field or electric field.

6. The method of claim 1 , further comprising:
halting deposition of the liquid SOG onto the semiconductor wafer based on the sensed amount of liquid SOG deposited being outside the at least one operating parameter.

7. The method of claim 1 , further comprising:
activating an alarm based on the sensed amount of liquid SOG deposited being outside the at least one operating parameter.

8. The method of claim 1 , wherein the adjusting the SB valve to withdraw the liquid SOG from the abnormal length comprises activating the SB valve with an electromagnetic actuator.

9. The method of claim 1 , wherein the adjusting the SB valve to withdraw the liquid SOG from the abnormal length comprises transmitting a switch valve control signal to a first electromagnetic actuator and transmitting an adjustment valve control signal to a second electromagnetic actuator.

10. The method of claim 1 , wherein the adjusting comprises closing a switch valve in the SB valve and moving an adjustment valve in the SB valve.

11. The method of claim 1 , wherein adjusting the SB valve comprises adjusting the SB valve using a digital controller.

12. A method of manufacturing a semiconductor device, comprising:
detecting, using a sensor, liquid SOG outside of a dispenser nozzle in an abnormal length relative to the dispenser nozzle;
adjusting, using a controller, a suck back (SB) valve to withdraw liquid SOG from the abnormal length;
comparing a sensed amount of liquid SOG deposited onto the semiconductor wafer from the dispenser nozzle with at least one set operating parameter; and
pausing sensing of a duration of dispensing liquid SOG onto the semiconductor wafer based on the sensed amount of liquid SOG deposited being outside the at least one operating parameter; and
storing at least one signal in the controller based on the sensed amount of liquid SOG deposited being outside the at least one operating parameter.

13. The method of claim 12 , wherein the detecting comprises sensing the liquid SOG by detecting a change in light.

14. The method of claim 12 , wherein adjusting the SB valve comprises adjusting the SB valve using a digital controller.

15. A method of controlling deposition of liquid spin-on glass (SOG) onto a semiconductor wafer, the method comprising:
dispensing, for a duration, the liquid SOG onto the semiconductor wafer;
determining, after the duration, a length of the liquid SOG outside of a dispenser nozzle using a sensor;
adjusting, using a controller, a suck back (SB) valve to reduce the length of liquid SOG if the length is below a predetermined threshold;
comparing a sensed amount of liquid SOG deposited onto the semiconductor wafer from the dispensing with at least one set operating parameter; and
pausing sensing of a volume of liquid SOG dispensed onto the semiconductor wafer based on the sensed amount of liquid SOG deposited being outside the at least one operating parameter; and
storing at least one signal in the controller based on the sensed amount of liquid SOG deposited being outside the at least one operating parameter.

16. The method of claim 15 , further comprising transmitting an alarm signal if the length is equal to or greater than the predetermined threshold.

17. The method of claim 15 , wherein determining the length of the liquid SOG comprises measuring the length of the liquid SOG using an emitter/detector pair.

18. The method of claim 17 , wherein determining the length of the liquid SOG comprises translating the emitter/detector pair relative to the dispenser nozzle.

19. The method of claim 17 , wherein determining the length of the liquid SOG comprises optically scanning the emitter/detector pair along an axis of the dispensing nozzle, and maintaining a physical location of the emitter/detector pair.

20. The method of claim 15 , further comprising closing the SB valve if the length is greater than or equal to the predetermined threshold.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Liu Yung-Tsun

Classifications

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P14/6926

  the material comprising alkyl silsesquioxane, e.g. MSQ · CPC title

• H10P14/6922

  the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC · CPC title

• H10P14/6342 Primary

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

• B05D1/005

  Spin coating · CPC title