Method of forming a reed for reed switch

US10446347B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10446347-B2
Application numberUS-201615193151-A
CountryUS
Kind codeB2
Filing dateJun 27, 2016
Priority dateMar 18, 2014
Publication dateOct 15, 2019
Grant dateOct 15, 2019

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A reed for a reed switch and a reed switch are provided. The reed may include a first portion having a first thickness and a first length, a second portion having a second thickness and a second length, and a hinged portion disposed between the first portion and the second portion, the hinged portion having a third thickness and a third length, wherein the third length is less than 150% of the first thickness and the third thickness is less than each of the first thickness and the second thickness. The reed switch may include the reed disposed in an insulating housing with a reed deformer to deform the reed.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of forming a reed for a reed switch, the method comprising: providing an electrically conductive reed; and stamping the electrically conductive reed to form a hinged portion disposed between a first portion and a second portion, and a third portion extending directly from an end of the second portion opposite the hinged portion, in a direction away from the hinged portion, the third portion defining a terminal end of the reed, the first portion having a first thickness and a first length, the second portion having a second thickness and a second length, the hinged portion having a third thickness and a third length, wherein the third length is less than 150% of the first thickness and the third thickness is less than each of the first thickness and the second thickness, and the third portion having a fourth thickness and a fourth length, wherein the fourth thickness is less than the second thickness and greater than the third thickness, the hinged portion having a width that is less than a width of the third portion. 2. The method of claim 1 , wherein stamping the electrically conductive reed to form the hinged portion and the third portion is done in a single stamping operation.

Assignees

Inventors

Classifications

  • H01H1/5822Primary

    Flexible connections between movable contact and terminal · CPC title

  • Terminal arrangements {(for coils H01H50/443)} · CPC title

  • comprising a plurality of reed switches, e.g. selectors or joystick-operated · CPC title

  • Details of the shape of the contact springs · CPC title

  • H01H49/00Primary

    Apparatus or processes specially adapted to the manufacture of relays or parts thereof · CPC title

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Frequently asked questions

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What does patent US10446347B2 cover?
A reed for a reed switch and a reed switch are provided. The reed may include a first portion having a first thickness and a first length, a second portion having a second thickness and a second length, and a hinged portion disposed between the first portion and the second portion, the hinged portion having a third thickness and a third length, wherein the third length is less than 150% of the …
Who is the assignee on this patent?
Littelfuse Inc
What technology area does this patent fall under?
Primary CPC classification H01H1/5822. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 15 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).