Contact assembly for electrical devices and method for making

Patent metadata

Field	Value
Publication number	US-10446336-B2
Application number	US-201615381514-A
Country	US
Kind code	B2
Filing date	Dec 16, 2016
Priority date	Dec 16, 2016
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

A contact assembly for an electrical device and a method for making such an assembly are presented. The contact assembly comprises a substrate and a contact material disposed on the substrate. The contact material comprises a composite material comprising a refractory material and a matrix material. The matrix material has a higher ductility than the refractory material. The composite material further comprises a core region and an outer region bounding the core region, the core region having a higher concentration of the refractory material than the outer region. The method applies cold spraying a blended feedstock to produce a layer that includes the composite material described above.

First claim

The invention claimed is:

1. A contact assembly for an electrical device, the contact assembly comprising:
a substrate; and
a contact material disposed on the substrate,
wherein the contact material comprises a composite material comprising a refractory material and a matrix material, the matrix material having a higher ductility than the refractory material;
wherein the composite material further comprises a core region and an outer region bounding at least a portion of the core region, the core region having a higher concentration of the refractory material than the outer region.

2. The contact assembly of claim 1 , wherein the refractory material comprises metallic tungsten, a carbide, graphite, or a nitride.

3. The contact assembly of claim 1 , wherein the refractory material comprises tungsten.

4. The contact assembly of claim 1 , wherein the matrix material has an electrical conductivity of at least 3.0×10 7 siemens per meter.

5. The contact assembly of claim 1 , wherein the matrix material comprises silver, copper, gold, aluminum, or a combination including one or more of the foregoing metals.

6. The contact assembly of claim 1 , wherein the refractory material is present in the core region of the composite material at a concentration of at least 30 volume percent.

7. The contact assembly of claim 1 , wherein the refractory material is present in the core region of the composite material at a concentration of at least 35 volume percent.

8. The contact assembly of claim 1 , wherein the refractory material is present in the outer region at a concentration of less than 30 volume percent.

9. The contact assembly of claim 1 , wherein the outer region comprises the refractory material in a concentration range from 20 volume percent to 25 volume percent.

10. The contact assembly of claim 1 , wherein the refractory material comprises tungsten and the matrix material comprises silver.

11. The contact assembly of claim 10 , wherein the core region comprises from 35 volume percent to 40 volume percent tungsten and from 60 volume percent to 65 volume percent silver; and wherein the outer region comprises from 20 volume percent to 25 volume percent tungsten and from 75 volume percent to 80 volume percent silver.

12. The contact assembly of claim 1 , wherein the substrate comprises copper.

13. An electrical device comprising the contact assembly of claim 1 .

14. The electrical device of claim 13 , wherein the device is a circuit breaker.

Assignees

• Abb Schweiz Ag

Inventors

• Ajdelsztajn Leonardo
• Schoonover Jeffrey Jon
• Kim Samuel Stephen
• Jacobs Linda Yvonne
• Pean Maxime Michel
• Coughlin Katherine Marjorie

Classifications

• H01H1/021 Primary

  Composite material · CPC title

• C23C24/04

  Impact or kinetic deposition of particles · CPC title

• H01H1/025

  having copper as the basic material · CPC title

• H01H11/048

  by powder-metallurgical processes · CPC title

• H01H1/0233

  and containing carbides · CPC title