Composite electronic component and board having the same mounted thereon

Patent metadata

Field	Value
Publication number	US-10446322-B2
Application number	US-201815880169-A
Country	US
Kind code	B2
Filing date	Jan 25, 2018
Priority date	Nov 16, 2016
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

A composite electronic component includes: a composite including a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with respective dielectric layers interposed therebetween, external electrodes extending from third and fourth surfaces of the capacitor body to portions of the first, second, fifth, and sixth surfaces, respectively, a discharge layer disposed between the external electrodes on the second surface of the capacitor body, and a protective layer disposed on the discharge layer; and conductive resin layers overlapping the third and fourth surfaces and portions of the first, second, fifth, and sixth surfaces, respectively. Widths of portions of the external electrodes formed on the first surface of the capacitor body are greater than widths of portions of the first and second conductive resin layers overlapping the first surface of the capacitor body.

First claim

What is claimed is:

1. A composite electronic component comprising:
a composite including:
a capacitor body including a plurality of dielectric layers, a plurality of first internal electrodes and a plurality of second internal electrodes alternately disposed with at least one of the plurality of dielectric layers interposed therebetween, and a first surface and a second surface opposing each other, a third surface and a fourth surface connecting the first surface and the second surface and opposing each other, and a fifth surface and a sixth surface connecting the first surface and the second surface, and connecting the third surface and the fourth surface, while opposing each other, and in which the plurality of first internal electrodes and the plurality of second internal electrodes are exposed to the third surface and the fourth surface, respectively,
a first external electrode extending from the third surface of the capacitor body to portions of the first surface, the second surface, the fifth surface, and the sixth surface, and a second external electrode extending from the fourth surface of the capacitor body to portions of the first surface, the second surface, the fifth surface, and the sixth surface,
a discharge layer disposed between the first external electrode and the second external electrode on the second surface of the capacitor body, and
a protective later disposed on the first external electrode, the second external electrode, and the discharge layer, on the second surface of the capacitor body;
a first conductive resin layer overlapping the third surface and portions of the first surface, the second surface, the fifth surface, and the sixth surface; and
a second conductive resin layer overlapping the fourth surface and portions of the first surface, the second surface, the fifth surface, and the sixth surface;
wherein widths of portions of the first external electrode and the second external electrode formed on the first surface of the capacitor body are greater than widths of portions of the first conductive resin layer and the second conductive resin layer overlapping the first surface of the capacitor body, respectively,
wherein B/A is 0.03 to 0.98 in which A is widths of portions of the first external electrode and the second external electrode formed on the first surface of the capacitor body, and B is widths of portions of the first conductive resin layer and the second conductive resin layer overlapping the first surface of the capacitor body, and
wherein the first and second internal electrodes are formed of a conductive paste containing nickel, copper, palladium, or alloys thereof.

2. The composite electronic component of claim 1 , further comprising: a first plating layer and a second plating layer formed on exposed portions of the first conductive resin layer and the second conductive resin layer, and the first external electrode and the second external electrode.

3. The composite electronic component of claim 2 , wherein in each of the first plating layer and the second plating layer, a width of a portion overlapping the first surface is greater than a width of a portion overlapping the second surface.

4. The composite electronic component of claim 2 , wherein in each of the first plating layer and the second plating layer, a width of a portion overlapping the first surface is equal to a width of a portion overlapping the second surface.

5. The composite electronic component of claim 1 , wherein in each of the first external electrode and the second external electrode, a width of a portion formed on the second surface is greater than a width of a portion formed on the first surface.

6. The composite electronic component of claim 1 , wherein the discharge layer includes a conductive polymer.

7. The composite electronic component of claim 6 , wherein the conductive polymer is a silicone-based resin.

8. The composite electronic component of claim 1 , wherein the first and second conductive resin layers include an epoxy resin.

9. A board having a composite electronic component mounted thereon, comprising:
a board having a plurality of electrode pads on an upper part thereof;
the composite electronic component of claim 1 installed above the board; and
solder connecting an electrode pad of the plurality of electrode pads to the composite electronic component.

10. A composite electronic component comprising:
a composite including:
a capacitor body including a plurality of dielectric layers, a plurality of first internal electrodes and a plurality of second internal electrodes alternately disposed with at least one of the plurality of dielectric layers interposed therebetween, and a first surface and a second surface opposing each other, a third surface and a fourth surface connecting the first surface and the second surface and opposing each other, and a fifth surface and a sixth surface connecting the first surface and the second surface, and connecting the third surface and the fourth surface, while opposing each other, and in which the plurality of first internal electrodes and the plurality of second internal electrodes are exposed to the third surface and the fourth surface, respectively,
a first external electrode extending from the third surface of the capacitor body to portions of the first surface, the second surface, the fifth surface, and the sixth surface, and a second external electrode extending from the fourth surface of the capacitor body to portions of the first surface, the second surface, the fifth surface, and the sixth surface,
a discharge layer disposed between the first external electrode and the second external electrode on the second surface of the capacitor body, and
a protective later disposed on the first external electrode, the second external electrode, and the discharge layer, on the second surface of the capacitor body;
a first conductive resin layer overlapping the third surface and portions of the first surface, the second surface, the fifth surface, and the sixth surface; and
a second conductive resin layer overlapping the fourth, surface and portions of the first surface, the second surface, the fifth surface, and the sixth surface;
wherein widths of portions of the first external electrode and the second external electrode formed on the first surface of the capacitor body are greater than widths of portions of the first conductive resin layer and the second conductive resin layer overlapping the first surface of the capacitor body, respectively,
wherein B/A is 0.03 to 0.98 in which A is widths of portions of the first external electrode and the second external electrode formed on the first surface of the capacitor body, and B is widths of portions of the first conductive resin layer and the second conductive resin layer overlapping the first surface of the capacitor body, and
wherein the first and second external electrodes are formed of a conductive paste including nickel, copper, tin, or alloys thereof.

Assignees

• Samsung Electro Mech

Inventors

• Kim Ho Yoon

Classifications

• H05K2201/10015

  Non-printed capacitor · CPC title

• H01G4/40

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title