Resistor trimming method

Patent metadata

Field	Value
Publication number	US-10446304-B2
Application number	US-201515516025-A
Country	US
Kind code	B2
Filing date	Jul 22, 2015
Priority date	Oct 3, 2014
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

The invention is to provide a resistor trimming method capable of adjusting a resistance value with ultrahigh precision and having excellent production efficiency. To achieve the object, a start point (S1) at a distance from a resistor (4) is irradiated with laser light while probes are brought into contact with a pair of surface electrodes (3) to measure a resistance value of the resistor (4). The place irradiated with the laser light is scanned so that a first trimming groove (5) extending in a direction perpendicular to a current direction can be formed in the resistor (4). Then, the place irradiated with the laser light is returned by a predetermined amount from an end point (first turning point (T1)) of the first trimming groove (5) to be set as a second turning point (T2). With the second turning point (T2) as a start point, scanning and cutting is performed to forma second trimming groove (6). Thus, the resistance value of the resistor (4) is adjusted to a target resistance value with high precision.

First claim

The invention claimed is:

1. A resistor trimming method for irradiating a resistor of a chip resistor with laser light to form a trimming groove in the resistor to thereby adjust a resistance value of the resistor, the chip resistor including an insulating substrate, a pair of front electrodes provided on a front surface of the insulating substrate, and the resistor connected to the pair of front electrodes, wherein:
after the laser light is applied linearly from one side surface of the resistor which is not connected to the front electrodes toward an opposite side surface of the resistor to form a first trimming groove, scan cutting is performed with the laser light, beginning at a point located a predetermined amount from an end point of the first trimming groove and intersecting the first trimming groove so as to extend in a direction toward the end point of the first trimming groove to thereby form a wide second trimming groove including at least the entire end point of the first trimming groove.

Assignees

• Koa Corp

Inventors

• Oka Naoto
• Sasaki Homare

Classifications

• B23K26/351

  for trimming or tuning of electrical components · CPC title

• H01C17/242 Primary

  by laser · CPC title

• H01C17/006

  adapted for manufacturing resistor chips · CPC title