Chip resistor and methods of producing the same

Patent metadata

Field	Value
Publication number	US-10446302-B2
Application number	US-201615352263-A
Country	US
Kind code	B2
Filing date	Nov 15, 2016
Priority date	Dec 28, 2011
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

A chip resistor includes: a board having a device formation surface, a back surface opposite from the device formation surface and side surfaces connecting the device formation surface to the back surface, a resistor portion provided on the device formation surface, a first connection electrode and a second connection electrode provided on the device formation surface and electrically connected to the resistor portion, and a resin film covering the device formation surface with the first connection electrode and the second connection electrode being exposed therefrom. Intersection portions of the board along which the back surface intersects the side surfaces each have a rounded shape.

First claim

The invention claimed is:

1. A chip component production method, comprising:
forming a device in each of a plurality of chip component regions defined on a front surface of a substrate;
forming a trench in a boundary region defined between the chip component regions, the trench having a predetermined depth as measured from the front surface of the substrate, the trench having a side wall extending linearly along an entire height of the side wall of the trench from the front surface toward a back surface of the substrate;
forming a protective layer on the side wall; and
grinding the back surface of the substrate to the trench to divide the substrate into a plurality of chip components,
wherein the forming a trench step includes:
forming a resist pattern for the boundary region; and
etching the substrate by using the resist pattern as a mask to form the trench.

2. The chip component production method according to claim 1 , wherein the etching is plasma etching.

3. The chip component production method according to claim 1 ,
wherein the forming a device step includes forming a resistor portion,
wherein the chip components are chip resistors.

4. The chip component production method according to claim 3 ,
wherein the forming a resistor portion step includes:
forming a resistive film on the front surface of the substrate;
forming an interconnection film in contact with the resistive film; and
patterning the resistive film and the interconnection film to form a plurality of resistor elements;

the method further comprising:
forming an external connection electrode for external connection of the device on the substrate; and
forming a plurality of fuses disconnectably connecting the resistor elements to the external connection electrode on the substrate.

5. The chip component production method according to claim 1 ,
wherein the forming a device step includes forming a capacitor portion,
wherein the chip components are chip capacitors.

6. The chip component production method according to claim 5 ,
wherein the forming a capacitor portion step includes:
forming a capacitive film on the front surface of the substrate;
forming an electrode film in contact with the capacitive film;
dividing the electrode film into a plurality of electrode film portions to form a plurality of capacitor elements in association with the electrode film portions;
forming an external connection electrode for external connection of the device on the substrate; and
forming a plurality of fuses disconnectably connecting the capacitor elements to the external connection electrode on the substrate.

7. The chip component production method according to claim 1 , wherein the chip component regions each have a rectangular plan shape defined by two orthogonally intersecting edges, one of which has a length of not greater than 0.4 mm and the other of which has a length of not greater than 0.2 mm.

8. The chip component production method according to claim 1 , wherein a zonal boundary region having a width of 1 μm to 60 μm is provided between the chip component regions.

9. A chip component, comprising:
a board;
a plurality of device elements provided on a front surface of the board;
an external connection electrode provided on the front surface of the board; and
a plurality of fuses provided on the front surface of the board, disconnectably connecting the device elements to the external connection electrode,
wherein the board has a rough outer side surface having an irregular pattern, the rough outer side surface extending linearly along an entire height of the outer side surface between the front surface and a back surface of the board, the rough outer side surface being covered by a protective layer.

10. The chip component according to claim 9 ,
wherein the chip component is a chip resistor,
wherein the device elements are resistor elements which each include a resistive film provided on the front surface of the board, and an interconnection film provided on the resistive film in contact with the resistive film.

11. The chip component according to claim 9 ,
wherein the chip component is a chip capacitor,
wherein the device elements are capacitor elements which each include a capacitive film provided on the front surface of the board, and an electrode film provided in contact with the capacitive film.

12. The chip component according to claim 9 , wherein the chip component is a chip inductor.

13. The chip component according to claim 9 , wherein the chip component is a chip diode.

Assignees

• Rohm Co Ltd

Inventors

• Nukaga Eiji
• Tamagawa Hiroshi
• Kondo Yasuhiro
• Matsuura Katsuya

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H10W20/493

  Fuses, i.e. interconnections changeable from conductive to non-conductive · CPC title

• H10W20/43

  Layouts of interconnections · CPC title

• H01C17/06

  adapted for coating resistive material on a base · CPC title