Method for producing an electrical component

Patent metadata

Field	Value
Publication number	US-10446298-B2
Application number	US-201615741286-A
Country	US
Kind code	B2
Filing date	Jun 28, 2016
Priority date	Jul 1, 2015
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

A method for producing an electrical component is disclosed. In an embodiment the method includes providing a carrier element providing a material having a temperature-dependent resistance, applying the material on a surface of the carrier element for producing a resistance layer on the carrier element and subsequently sintering the resistance layer for linking the resistance layer to the carrier element.

First claim

The invention claimed is:

1. A method for producing an electrical component, the method comprising:
providing a carrier element;
providing a material having a temperature-dependent resistance;
applying the material on a surface of the carrier element for producing a resistance layer on the carrier element; and
subsequently sintering the resistance layer for linking the resistance layer to the carrier element,
wherein the material of the resistance layer is provided as a screen-printable ceramic paste before the resistance layer is applied onto the carrier element, and
wherein a structure of the resistance layer is printed onto the carrier element before the resistance layer is sintered by a screen printing method.

2. The method according to claim 1 , further comprising applying electrodes for applying a voltage to the resistance layer, wherein the electrodes are arranged on a surface of the resistance layer.

3. The method according to claim 1 , wherein the carrier element comprises a non-electrically conductive material having a thermal conductivity of at least W/K.

4. The method according to claim 1 , wherein the carrier element comprises a material composed of aluminum oxide, aluminum nitride or combinations thereof.

5. The method according to claim 1 , wherein the material is applied a calcined metal oxide.

6. The method according to claim 1 , wherein the resistance layer comprises a material composed of nickel oxide, manganese oxide, copper oxide, zinc oxide or composed of combinations thereof.

7. The method according to claim 2 , wherein applying the electrodes comprises applying the electrodes by a screen printing or sputtering method onto the surface of the resistance layer.

8. The method according to claim 1 ,
wherein the resistance layer is applied onto a top side of the carrier element, and
wherein an adhesive layer is applied onto an underside of the carrier element in order to adhesively bond the electrical component onto a support.

9. The method according to claim 1 ,
wherein the resistance layer is applied onto a top side of the carrier element,
wherein a silver layer is applied onto an underside of the carrier element in order to solder the electrical component onto a support.

10. The method according to claim 1 , wherein the carrier element has a thickness between 100 μm and 17 mm inclusive, and wherein the resistance layer has a layer thickness of between 5 μm and 15 μm inclusive.

11. The method according to claim 1 ,
wherein the carrier element contains a material composed of aluminum oxide or aluminum nitride or combinations thereof, and
wherein the resistance layer comprises a calcined metal oxide.

Assignees

• Epcos Ag

Inventors

• Mörth Josef
• Landfahrer Gilbert
• Kloiber Gerald
• Moshammer Anna

Classifications

• H01C7/043 Primary

  Oxides or oxidic compounds · CPC title

• H01C17/065

  by thick film techniques, e.g. serigraphy · CPC title

• H01C7/044

  Zinc or cadmium oxide · CPC title

• H01C1/144

  the terminals or tapping points being welded or soldered · CPC title

• H01C17/28

  adapted for applying terminals · CPC title