System and method for securing sense die in force sensor

Patent metadata

Field	Value
Publication number	US-10444090-B2
Application number	US-201715595288-A
Country	US
Kind code	B2
Filing date	May 15, 2017
Priority date	May 15, 2017
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.

First claim

What is claimed is:

1. A force sensor comprising:
a substrate; and
a sense die comprising a top part and a bottom part, wherein the top part comprises a first surface and a second surface, and the bottom part comprises a third surface, wherein the third surface of the bottom part directly contacts the substrate, and wherein the second surface is spaced above the substrate to provide a space between the second surface of the top part of the sense die and the substrate when the third surface of the bottom part is in direct contact with the substrate; and
an adhesive extending into the space between the second surface of the top part of the sense die and the substrate to secure the sense die to the substrate.

2. The force sensor of claim 1 , wherein application of external force or pressure to at least part of the first surface of the top part of the sense die is configured to change an electrical property of a component of the sense die approximately linearly with respect to the applied external force or pressure.

3. The force sensor of claim 1 , wherein the bottom part of the sense die is formed by removing a portion of a perimeter of the sense die to reveal the second surface of the top part of the sense die, wherein the removed portion defines at least part of the space between the second surface of the top part of the sense die and the substrate.

4. The force sensor of claim 1 , further comprising an actuation element configured to transmit a force to part of the first surface of the top part of the sense die.

5. The force sensor of claim 1 , further comprising one or more sense elements supported by the first surface of the top part of the sense die.

6. The force sensor of claim 5 , wherein the one or more sense elements comprise one or more piezoresistive elements.

7. The force sensor of claim 1 , further comprising one or more electrical contacts supported by the first surface of the top part of the sense die, and wherein the one or more sense elements are electrically connected to the one or more electrical contacts.

8. The force sensor of claim 7 , wherein the substrate comprises electrical traces, and wherein the one or more electrical contacts are configured to be electrically coupled to the electrical traces of the substrate.

9. The force sensor of claim 8 , further comprising one or more bond pads, wherein the one or more electrical contacts are electrically coupled to the one or more bond pads.

10. The force sensor of claim 1 , wherein a length, a width, and a height of the top part of the sense die is greater than a length, a width, and a height of the bottom part of the sense die.

11. A method for detecting force using a force sensor, the method comprising:
applying a force to the force sensor, the force sensor comprising an actuation element, a substrate, and a sense die, wherein the actuation element is configured to transmit the force to the sense die, wherein the sense die comprises a top part and a bottom part, wherein the top part comprises a first surface and a second surface, and the bottom part comprises a third surface, wherein the third surface of the bottom part directly contacts the substrate, and wherein the second surface is spaced above the substrate to provide a space between the second surface of the top part of the sense die and the substrate when the third surface of the bottom part is in direct contact with the substrate, wherein an adhesive is disposed in the space between the second surface of the top part of the sense die and the substrate to help secure the sense die to the substrate, and wherein the sense die further comprises one or more sense elements;
stressing at least a portion of the one or more sense elements due to the force; and
changing an electrical property of the one or more sense elements in response to the stressing.

12. The method of claim 11 , wherein the third surface of the bottom part directly contacts the substrate at all times after the adhesive is cured.

13. The method of claim 11 , wherein applying a force to the force sensor results in flexing of at least a portion of the substrate.

Assignees

• Honeywell Int Inc

Inventors

• Patch Jason Dennis
• Eckhardt Todd
• Machir Jim
• Wade Richard
• Cook Jim

Classifications

• B06B1/0622

  on one surface · CPC title

• G01L1/18 Primary

  using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material · CPC title

• G01L9/0054

  integral with a semiconducting diaphragm · CPC title