Automated ceramic matrix composite ply layup

US10443386B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10443386-B2
Application numberUS-201615146132-A
CountryUS
Kind codeB2
Filing dateMay 4, 2016
Priority dateMay 4, 2016
Publication dateOct 15, 2019
Grant dateOct 15, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Methods for forming ceramic matrix composite (CMC) components are provided. In one exemplary embodiment, a method comprises automatically laying up CMC plies. Laying up plies includes transferring a CMC ply to a layup tool; applying heat to the CMC ply; and stacking the CMC ply with at least one other CMC ply. In various embodiments, CMC plies may be laid up using an automated machine. In some embodiments, a CMC ply may be transferred to a layup tool using an automated machine and the CMC ply may be stacked with at least one other CMC ply using the automated machine.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for forming a ceramic matrix composite (CMC) component, the method comprising: forming pieces of a pre-impregnated CMC tape; drying the pieces of the pre-impregnated CMC tape to produce CMC plies; and automatically laying up the CMC plies, wherein laying up the CMC plies includes transferring a CMC ply to a layup tool; applying heat to the CMC ply via the layup tool and molding the CMC ply to a desired contour; heating the molded CMC ply for a first period of time in a covered state, to increase flexibility, tackiness, and adhesiveness of the molded CMC ply, wherein the molded CMC ply is heated via the layup tool; stacking the molded CMC ply with at least one other CMC ply; and heating the stacked CMC plies via the layup tool for a second period of time in a covered state, to increase the flexibility, tackiness, and adhesiveness of the stacked CMC plies. 2. The method of claim 1 , wherein covering the molded CMC ply for the first period of time and covering the stacked CMC plies for the second period of time is by a shrink wrap. 3. The method of claim 1 , wherein the first period of time is up to about 20 minutes. 4. The method of claim 1 , wherein the second period of time is up to about 30 minutes. 5. The method of claim 1 , further comprising, after heating the stacked CMC plies for the second period of time, removing the heat from the stacked CMC plies. 6. The method of claim 1 , wherein transferring the CMC ply to the layup tool comprises transferring a plurality of CMC plies to the layup tool, wherein applying heat to the CMC ply comprises applying heat to the plurality of CMC plies, and wherein stacking the molded CMC ply comprises stacking the plurality of CMC plies. 7. The method of claim 1 , further comprising, while applying heat to the CMC ply, molding the CMC ply to the desired contour. 8. The method of claim 7 , wherein an automated machine molds the CMC ply to the desired contour. 9. The method of claim 1 , wherein an automated machine transfers the CMC ply to the layup tool. 10. The method of claim 1 , wherein an automated machine stacks the molded CMC ply with the at least one other CMC ply. 11. The method of claim 1 , further comprising, after stacking the molded CMC ply with at least one other CMC ply, repeating transferring a CMC ply to the layup tool, applying heat to the CMC ply, and stacking the CMC ply with at least one other CMC ply. 12. The method of claim 11 , wherein, as transferring, applying, and stacking are repeated, stacking the CMC ply with at least one other CMC ply includes stacking the CMC ply with previously stacked CMC plies. 13. The method of claim 11 , wherein transferring a CMC ply to the layup tool, applying heat to the CMC ply, and stacking the CMC ply with at least one other CMC ply are repeated until a component preform is formed. 14. The method of claim 13 , further comprising processing the component preform in an autoclave at an elevated temperature and an elevated pressure. 15. The method of claim 14 , further comprising densifying the component preform. 16. A method for forming a ceramic matrix composite (CMC) component, the method comprising: laying up CMC plies using an automated machine, wherein laying up CMC plies includes transferring a CMC ply to a layup tool; applying heat to the CMC ply via the layup tool and molding the CMC ply to a desired contour; heating the molded CMC ply for a first period of time in a covered state, to increase flexibility, tackiness, and adhesiveness of the molded CMC ply, wherein the molded CMC ply is heated via the layup tool; stacking the molded CMC ply with at least one other CMC ply; and heating the stacked CMC plies via the layup tool for a second period of time in a covered state, to increase the flexibility, tackiness, and adhesiveness of the stacked CMC plies, wherein the CMC plies are formed from a pre-impregnated CMC tape. 17. The method of claim 16 , wherein the CMC plies are formed from a dried pre-impregnated CMC tape. 18. The method of claim 16 , wherein transferring a CMC ply to the layup tool, applying heat to the CMC ply and molding, covering and heating the molded CMC ply for the first period of time, stacking the molded CMC ply with at least one other CMC ply, and covering and heating the stacked CMC plies for the second period of time are repeated until a component preform is formed. 19. A method for forming a ceramic matrix composite (CMC) component, the method comprising: forming CMC plies from pre-impregnated CMC tape and laying up the CMC plies, wherein laying up the CMC plies includes transferring a CMC ply to a layup tool using an automated machine; applying heat to the CMC ply via the layup tool and molding the CMC ply to a desired contour; heating the molded CMC ply for a first period of time in a covered state, to increase flexibility, tackiness, and adhesiveness of the molded CMC ply, wherein the molded CMC ply is heated via the layup tool; stacking the molded CMC ply with at least one other CMC ply using the automated machine; and heating the stacked CMC plies via the layup tool for a second period of time in a covered state, to increase the flexibility, tackiness, and adhesiveness of the stacked CMC plies. 20. The method of claim 19 , wherein forming the CMC plies comprises: forming the pre-impregnated CMC tape; winding the pre-impregnated CMC tape on a drum; removing pieces of the pre-impregnated CMC tape from the drum; drying the pieces of removed pre-impregnated CMC tape to form the CMC plies, wherein the CMC plies are dried pieces of the pre-impregnated CMC tape.

Assignees

Inventors

Classifications

  • Ceramic products containing macroscopic reinforcing agents (C04B35/66 takes precedence {; infiltration of a porous ceramic matrix with a material forming a non-ceramic phase C04B41/00, reaction infiltration with Si in order to form SiC C04B35/573, in order to form Si3N4 C04B35/591}) · CPC title

  • Selecting composite materials, e.g. blades with reinforcing filaments · CPC title

  • directly with other burned ceramic articles · CPC title

  • essentially without removing material · CPC title

  • characterised by their solids loadings, i.e. the percentage of solids · CPC title

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What does patent US10443386B2 cover?
Methods for forming ceramic matrix composite (CMC) components are provided. In one exemplary embodiment, a method comprises automatically laying up CMC plies. Laying up plies includes transferring a CMC ply to a layup tool; applying heat to the CMC ply; and stacking the CMC ply with at least one other CMC ply. In various embodiments, CMC plies may be laid up using an automated machine. In some …
Who is the assignee on this patent?
Gen Electric
What technology area does this patent fall under?
Primary CPC classification F01D5/02. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Oct 15 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).