Anisotropic conductive film and production method of the same

Patent metadata

Field	Value
Publication number	US-10442958-B2
Application number	US-201515126898-A
Country	US
Kind code	B2
Filing date	Jan 29, 2015
Priority date	Mar 20, 2014
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

An anisotropic conductive film contains conductive particles and spacers. The spacers are arranged at a central part of the film in a width direction. The central part of the film in the width direction represents 20 to 80% of the overall width of the film. The height of the spacers in the thickness direction of the anisotropic conductive film is larger than 5 μm and less than 75 μm. Such an anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer, wherein the conductive particles are dispersed in the first insulating adhesion layer, and the spacers are regularly arranged on a surface of the first insulating adhesion layer on a side of the second insulating adhesion layer.

First claim

The invention claimed is:

1. An anisotropic conductive film containing front and back surfaces, conductive particles, and insulating spacers, wherein:
the spacers are arranged at only a central part of the anisotropic conductive film in a width direction and embedded in the anisotropic conductive film so that, when the anisotropic conductive film is provided between an IC chip and a substrate, the spacers are not disposed between bumps of the IC chip and terminals of the substrate,
the central part of the film in the width direction has a width being 20% or more and 80% or less of an overall width of the film, and
at least one of the front and back surfaces along the entire anisotropic conductive film is substantially flat.

2. The anisotropic conductive film according to claim 1 , wherein the spacer has a height in a thickness direction of the anisotropic conductive film being more than 5 μm and less than 75 μm.

3. The anisotropic conductive film according to claim 1 , wherein the anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer, the conductive particles are dispersed in the first insulating adhesion layer, and the spacers are regularly arranged on a surface of the first insulating adhesion layer on a side of the second insulating adhesion layer.

4. A production method of the anisotropic conductive film according to claim 3 , the method comprising: storing each of the spacers in a first opening for storing a spacer of a transfer mold having the first opening at a position corresponding to the central part of the anisotropic conductive film in the width direction; pushing the first insulating adhesion layer that constitutes the anisotropic conductive film and has the dispersed conductive particles into a surface having the first opening of the transfer mold to transfer and bond the spacers to the first insulating adhesion layer; and further layering the second insulating adhesion layer.

5. The production method according to claim 4 , wherein another insulating adhesion layer is layered on another surface of the first insulating adhesion layer.

6. The anisotropic conductive film according to claim 1 , wherein the anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer, the conductive particles are dispersed in the first insulating adhesion layer, and the spacers are regularly arranged on a surface of the second insulating adhesion layer on a side of the first insulating adhesion layer.

7. A production method of the anisotropic conductive film according to claim 6 , the production method comprising: storing each of the spacers in a first opening for storing a spacer of a transfer mold having the first opening at a position corresponding to the central part of the anisotropic conductive film in the width direction; pushing the second insulating adhesion layer that constitutes the anisotropic conductive film into a surface having the first opening of the transfer mold to transfer and bond the spacers to the second insulating adhesion layer; and further layering the first insulating adhesion layer that constitutes the anisotropic conductive film and has the dispersed conductive particles.

8. The anisotropic conductive film according to claim 1 , wherein the anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer, and the conductive particles and the spacers are each regularly arranged on a surface of the first insulating adhesion layer on a side of the second insulating adhesion layer.

9. A production method of the anisotropic conductive film according to claim 8 , the method comprising: storing each of the spacers in a first opening for storing a spacer of a transfer mold having the first opening at a position corresponding to the central part of the anisotropic conductive film in the width direction and a second opening for storing a conductive particle at a part other than the position; subsequently storing each of the conductive particles in the second opening; pushing the first insulating adhesion layer that constitutes the anisotropic conductive film and has the dispersed conductive particles into a surface having the first and second openings of the transfer mold to transfer and bond the spacers to the first insulating adhesion layer; and further layering the second insulating adhesion layer.

10. The anisotropic conductive film according to claim 1 , wherein the anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer, the conductive particles are regularly arranged on a surface of the first insulating adhesion layer on a side of the second insulating adhesion layer, and the spacers are regularly arranged on a surface of the second insulating adhesion layer on a side of the first insulating adhesion layer.

11. A method for producing the anisotropic conductive film according to claim 10 , the method comprising:
storing each of the spacers in a first opening for storing a spacer of a first transfer mold having the first opening at a position corresponding to the central part of the anisotropic conductive film in the width direction, and pushing the first insulating adhesion layer that constitutes the anisotropic conductive film into a surface having the first opening of the first transfer mold to transfer and bond the spacers to the first insulating adhesion layer;
storing each of the conductive particles in a second opening for storing a conductive particle of a second transfer mold having the second opening at a position corresponding to a part other than the central part of the anisotropic conductive film in the width direction, and pushing the second insulating adhesion layer that constitutes the anisotropic conductive film into a surface having the second opening of the second transfer mold to transfer and bond the conductive particles to the second insulating adhesion layer; and
layering the first insulating adhesion layer to which the spacers have been transferred and bonded and the second insulating adhesion layer to which the conductive particles have been transferred and bonded so that the spacers and the conductive particles are located inside.

12. A production method of the anisotropic conductive film according to claim 1 , the method comprising: storing each of the spacers in a first opening for storing a spacer of a transfer mold having the first opening at a position corresponding to the central part of the anisotropic conductive film in the width direction; and pushing an insulating adhesion layer that constitutes the anisotropic conductive film into a surface having the first opening of the transfer mold to transfer and bond the spacers to the insulating adhesion layer.

13. A connection structure in which a first electronic component is subjected to anisotropic conductive connection to a second electronic component through the anisotropic conductive film according to claim 1 .

14. A method for connecting a first electronic component and a second electronic component by anisotropic conductive connection through the anisotropic conductive film according to claim 1 , the method comprising:
temporarily bonding the anisotropic conductive film to the second electronic component; mounting the first electronic component on the temporarily bonded anisotropic conductive film; and thermocompression-bonding them from a side of the first electronic component.

15. A production method of an anisotropic conductive film contain

Assignees

• Dexerials Corp

Inventors

• Araki Yuta
• Ishimatsu Tomoyuki

Classifications

• C09J11/02

  Non-macromolecular additives · CPC title

• C08K7/00

  Use of ingredients characterised by shape · CPC title

• C08K2201/001

  Conductive additives · CPC title

• B32B2307/20

  having particular electrical or magnetic properties, e.g. piezoelectric · CPC title

• B32B27/06 Primary

  as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)} · CPC title