Microstructured reconfigurable composite material
US-9643379-B1 · May 9, 2017 · US
Porous plate-shaped filler
US10442739B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10442739-B2 |
| Application number | US-201615221903-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 28, 2016 |
| Priority date | Jan 31, 2014 |
| Publication date | Oct 15, 2019 |
| Grant date | Oct 15, 2019 |
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- Title
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Abstract
Official abstract text for this publication.
Provided is a porous plate-shaped filler that can be used as a material for a heat-insulation film having excellent heat insulation performance. In a porous plate-shaped filler 1 having a plate shape, an aspect ratio is 3 or higher, a minimum length is 0.5 to 50 μm, and an overall porosity is 20 to 90%, and the porosity is lower in the circumferential part than in the center part. When this porous plate-shaped filler 1 of the present invention is contained in a heat-insulation film, the infiltration of a matrix into the filler is reduced, and thus the thermal conductivity can be lowered. Therefore, even a thin heat-insulation film can have a greater heat-insulation effect than before.
First claim
Opening claim text (preview).
The invention claimed is: 1. A porous plate-shaped filler having a plate shape with major surfaces each of which contains a plurality of pores, a length to thickness aspect ratio of 3 or higher, a thickness of 0.5 to 50 μm, an overall porosity of 20 to 90%, and a porosity of a center part of 30 to 90%, wherein the porosity is lower in a circumferential part than in the center part. 2. The porous plate-shaped filler according to claim 1 , wherein the center part and the circumferential part have the same type of material for a base material. 3. The porous plate-shaped filler according to claim 1 , wherein the center part and the circumferential part have a different type of material for a base material. 4. The porous plate-shaped filler according to claim 1 , wherein the type of material of the circumferential part contains at least one of a fluororesin, a silicone resin, a polyimide resin, a polyamide resin, an acrylic resin, and an epoxy resin. 5. The porous plate-shaped filler according to claim 1 , wherein the circumferential part has a porosity which is lower by 10% or more than the center part. 6. The porous plate-shaped filler according to claim 1 , wherein an average pore diameter is smaller in the circumferential part than in the center part. 7. The porous plate-shaped filler according to claim 1 , wherein an average pore diameter of the circumferential part is 0.1 μm or less. 8. The porous plate-shaped filler according to claim 1 , wherein the thickness of the circumferential part is 1 μm or more.
Assignees
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Classifications
Removal thereof · CPC title
Polyvinylacetals, e.g. polyvinylbutyral [PVB] · CPC title
Products showing a density-gradient · CPC title
Carbonaceous materials, e.g. coal, carbon, graphite, hydrocarbons · CPC title
inorganic · CPC title
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- What does patent US10442739B2 cover?
- Provided is a porous plate-shaped filler that can be used as a material for a heat-insulation film having excellent heat insulation performance. In a porous plate-shaped filler 1 having a plate shape, an aspect ratio is 3 or higher, a minimum length is 0.5 to 50 μm, and an overall porosity is 20 to 90%, and the porosity is lower in the circumferential part than in the center part. When this p…
- Who is the assignee on this patent?
- Ngk Insulators Ltd
- What technology area does this patent fall under?
- Primary CPC classification C04B38/009. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Oct 15 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).