Processing device and processing method

Patent metadata

Field	Value
Publication number	US-10442032-B2
Application number	US-201515300207-A
Country	US
Kind code	B2
Filing date	Jan 26, 2015
Priority date	Mar 31, 2014
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser oscillator having a plurality of vertical cavity surface-emitting laser diode chips that output laser light having a wavelength of 1,070 nm or less, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix; a guidance optical system that guides the laser light output from the laser oscillator; and a control device that controls the output of the laser oscillator.

First claim

The invention claimed is:

1. A processing device that processes a member to be processed by irradiating the member to be processed with a laser, the device comprising:
a laser oscillator including a plurality of vertical cavity surface-emitting laser elements that output a laser having a wavelength of no greater than 1,070 nm, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix;
a guidance optical system that guides the laser outputted from the laser oscillator; and
a control device that controls the output of the laser oscillator.

2. The processing device according to claim 1 , comprising
a plurality of the laser oscillators,
wherein the plurality of laser oscillators are arranged so that laser output surfaces thereof are adjacent to each other.

3. The processing device according to claim 2 , wherein the plurality of laser oscillators are arranged in a matrix.

4. The processing device according to claim 2 , wherein the plurality of laser oscillators are arranged in a single row.

5. A processing device that processes a member to be processed, the device comprising:
a processing head that processes the member to be processed;
a heating head that heats the member to be processed, the heating head including a laser oscillator, which has a plurality of vertical cavity surface-emitting laser diode chips that output a laser and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix, and a guidance optical system that guides the laser outputted from the laser oscillator; and
a control device that controls the heating of the member to be processed by controlling the output of the laser oscillator.

6. The processing device according to claim 5 , wherein the processing head processes the member to be processed by irradiating the member to be processed with a laser.

7. The processing device according to claim 5 , wherein the heating head is fixed to the processing head.

8. The processing device according to claim 1 , wherein the guidance optical system focuses the laser outputted from the plurality of vertical cavity surface-emitting laser diode chips onto the member to be processed.

9. The processing device according to claim 1 , wherein the guidance optical system includes a focusing unit that focuses the laser outputted from the plurality of vertical cavity surface-emitting laser diode chips, and an optical fiber cable on which the laser focused by the focusing unit is incident and that transmits the laser.

10. The processing device according to claim 1 , wherein the laser oscillator includes a cooling mechanism that cools the substrate.

11. The processing device according to claim 1 , wherein the control device controls a laser power distribution of the vertical cavity surface-emitting laser diode chips of the laser oscillator.

12. The processing device according to claim 1 , wherein the processing is one of three-dimensional printing, cladding, welding, surface treatment, boring a hole, cutting, and engraving.

13. A processing method for processing a member to be processed by irradiating the member to be processed with a laser, the method comprising:
outputting a laser having a wavelength of no greater than 1,070 nm from a plurality of vertical cavity surface-emitting laser diode chips arranged in a matrix on a surface; and
processing the member to be processed by guiding the outputted laser using a guidance optical system.

14. A processing method for processing a member to be processed by irradiating the member to be processed with a laser, the method comprising:
heating the member to be processed by outputting a laser from a plurality of vertical cavity surface-emitting laser diode chips arranged in a matrix on a surface and guiding the outputted laser using a guidance optical system; and
processing the member to be processed using a processing head.

15. The processing device according to claim 6 , wherein the heating head is fixed to the processing head.

16. The processing device according to claim 2 , wherein the guidance optical system focuses the laser outputted from the plurality of vertical cavity surface-emitting laser diode chips onto the member to be processed.

17. The processing device according to claim 3 , wherein the guidance optical system focuses the laser outputted from the plurality of vertical cavity surface-emitting laser diode chips onto the member to be processed.

18. The processing device according to claim 4 , wherein the guidance optical system focuses the laser outputted from the plurality of vertical cavity surface-emitting laser diode chips onto the member to be processed.

19. The processing device according to claim 5 , wherein the guidance optical system focuses the laser outputted from the plurality of vertical cavity surface-emitting laser diode chips onto the member to be processed.

20. The processing device according to claim 6 , wherein the guidance optical system focuses the laser outputted from the plurality of vertical cavity surface-emitting laser diode chips onto the member to be processed.

Assignees

• Mitsubishi Heavy Ind Ltd

Inventors

• Goya Saneyuki
• Muta Kenji
• Watanabe Toshiya
• Ishide Takashi

Classifications

• B23K26/0624

  using ultrashort pulses, i.e. pulses of 1 ns or less · CPC title

• B23K26/0884

  in at least three axial directions, e.g. manipulators, robots · CPC title

• B23K26/34

  Laser welding for purposes other than joining · CPC title

• H01S5/042

  Electrical excitation {; Circuits therefor (monolithically integrated laser drive components H01S5/0261)} · CPC title

• B23K26/082

  Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head · CPC title