Chip card module and method for producing a chip card module

Patent metadata

Field	Value
Publication number	US-10440825-B2
Application number	US-201715620866-A
Country	US
Kind code	B2
Filing date	Jun 13, 2017
Priority date	Jun 13, 2016
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.

First claim

What is claimed is:

1. A chip card module, comprising:
a chip card module contact array having six contact pads that are arranged in a first row and a second row, each of the first row and the second row comprising three contact pads, the three contact pads of the first row being arranged in accordance with positions for contacts C 1 , C 2 , and C 3 in ISO 7816-2, and the three contact pads of the second row being arranged in accordance with positions for contacts C 5 , C 6 , and C 7 in ISO 7816-2, and
three additional contact pads that are arranged between the two rows;
wherein each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows; and
at least one chip;
wherein the at least one chip is electrically conductively connected to each of the associated contact pads by each respective additional contact pad electrically conductively connected to the associated contact pad;
wherein the chip card module further comprises a main region and a removable region removable from the chip card module;
wherein the at least one chip, three contact pads from the first row and the three additional contact pads are arranged in the main region and the three contact pads from the second row are arranged in the removable region.

2. The chip card module of claim 1 ,
wherein the associated contact pad from the row is the respective contact pad from the row that is directly adjacent to the additional contact pad.

3. The chip card module of claim 2 ,
wherein the row has the ISO 7816 contact pads C 1 , C 2 and C 3 , and the three additional contact pads have a first additional contact pad, a second additional contact pad and a third additional contact pad, wherein the first additional contact pad is electrically conductively connected to the contact pad C 1 , the second additional contact pad is electrically conductively connected to the contact pad C 2 , and the third additional contact pad is electrically conductively connected to the contact pad C 3 .

4. The chip card module of claim 2 ,
wherein the row has the ISO 7816 contact pads C 5 , C 6 and C 7 , and the three additional contact pads have a first additional contact pad, a second additional contact pad and a third additional contact pad, wherein the first additional contact pad is electrically conductively connected to the contact pad C 5 , the second additional contact pad is electrically conductively connected to the contact pad C 6 , and the third additional contact pad is electrically conductively connected to the contact pad C 7 .

5. The chip card module of claim 1 ,
wherein the chip card module is designed such that a functionality of the chip card module is maintained when the removable region is removed from the main region.

6. The chip card module of claim 1 , further comprising:
at least one assembly from a group of assemblies, the group consisting of:
a passive electronic assembly; and
an antenna;

wherein the at least one assembly is arranged in the main region.

7. The chip card module of claim 1 ,
wherein the at least one chip has a security controller and a frontend assembly;
wherein the security controller and the frontend assembly are arranged in a manner stacked on top of one another.

8. The chip card module of claim 1 , further comprising:
a separating region that is arranged between the main region and the removable region;
wherein the separating region is free of electronic assemblies.

9. The chip card module of claim 8 ,
wherein the electrically conductive connections of each additional contact pad to the respective associated contact pad of the row run through the separating region.

10. The chip card module of claim 8 ,
wherein the separating region is marked.

11. A method for producing a chip card module, the method comprising:
arranging a chip card module contact array having six contact pads arranged in a first row and a second row, each row having three contact pads, the three contact pads of the first row being arranged in accordance with positions for contacts C 1 , C 2 , and C 3 in ISO 7816-2, and the three contact pads of the second row being arranged in accordance with positions for contacts C 5 , C 6 , and C 7 in ISO 7816-2;
arranging three additional contact pads between the two rows;
electrically conductively connecting each of the additional contact pads to a respective associated contact pad from a row from the two rows; electrically conductively attaching at least one chip to each of the associated contact pads by each respective additional contact pad electrically conductively connected to the associated contact pad and forming a main of the chip card module comprising the at least one chip, three contact pads from the first row, and three additional contact pads and forming a removable region removable from the chip card module comprising the three contact pads from the second row.

12. The chip card module of claim 2 ,
wherein a number of additional contact pads is exactly three.

13. The chip card module of claim 2 , wherein an electrical communication conduit directly connects an edge of each additional contact pad to an edge of each respective associated contact pad.

Assignees

• Infineon Technologies Austria Ag

Inventors

• Pueschner Frank
• Stampka Peter
• Pohl Jens
• Janke Marcus

Classifications

• H05K2201/10719

  Land grid array [LGA] · CPC title

• H05K1/11 Primary

  Printed elements for providing electric connections to or between printed circuits · CPC title

• G06K19/07722

  the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title

• G06K19/07739

  comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor · CPC title

• H05K2201/09445

  Pads for connections not located at the edge of the PCB, e.g. for flexible circuits · CPC title