Substrate assembly, display substrate motherboard, display substrate, and production method, display

Patent metadata

Field	Value
Publication number	US-10440820-B2
Application number	US-201715716305-A
Country	US
Kind code	B2
Filing date	Sep 26, 2017
Priority date	Dec 28, 2016
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

Embodiments of this disclosure provide a substrate assembly, a display substrate motherboard, a display substrate, and a production method, and a display, and relate to the technical field of flexible display. The damage of the support substrate and the flexible base substrate upon separation may be avoided, and the bulging phenomenon of the connecting layer occurred at a high temperature may be prevented. This substrate assembly comprises a support substrate as well as a connecting layer and a flexible base substrate which are sequentially formed on the support substrate, wherein the material of the connecting layer comprises an organic layered material, and the molecule constituting the organic layered material comprises a hydrophilic group. The substrate assembly is used for producing a flexible display substrate.

First claim

What is claimed is:

1. A substrate assembly, comprising a support substrate as well as a connecting layer and a flexible base substrate which are sequentially formed on the support substrate, wherein the connecting layer is composed of an organic layered material, a molecule constituting the organic layered material comprises a hydrophilic group, and the organic layered material is a material composed of two or more sheet layers, wherein an interior of each two-dimensional layer of the two or more sheet layers is bonded via a chemical bond and there is only a Van-der-Waals force between adjacent layers.

2. The substrate assembly according to claim 1 , wherein the molecule constituting the organic layered material is an organic linear molecule.

3. The substrate assembly according to claim 2 , wherein the organic linear molecule is a small molecule or an oligomer.

4. The substrate assembly according to claim 1 , wherein the connecting layer has a thickness in a range of 10 to 100 nm.

5. The substrate assembly according to claim 1 , wherein the molecule constituting the organic layered material comprises a group capable of being ionized by a polar solvent comprising a hydroxy group.

6. The substrate assembly according to claim 1 , wherein the hydrophilic group is capable of being ionized by a polar solvent comprising a hydroxy group.

7. The substrate assembly according to claim 1 , wherein the hydrophilic group is one or more selected from the group consisting of a hydroxy group, an aldehyde group, a carboxy group, an amino group, a phosphoric acid group, and a sulfonic acid group.

8. The substrate assembly according to claim 1 , wherein a border of the flexible base substrate is within a border of the connecting layer when looking from a direction vertical to a surface of the flexible base substrate.

9. A flexible display substrate motherboard, comprising the substrate assembly of claim 1 as well as a display element formed on the flexible base substrate of the substrate assembly and an encapsulating layer encapsulating the display element.

10. A flexible display substrate, which is obtained by peeling the flexible base substrate of the flexible display substrate motherboard according to claim 9 from the support substrate.

11. A flexible display, comprising the flexible display substrate of claim 10 .

12. A production method of a flexible display substrate, comprising the steps of:
a) forming a connecting layer on a support substrate, wherein the connecting layer is composed of an organic layered material, and a molecule constituting the organic layered material comprises a hydrophilic group, and the organic layered material is a material composed of two or more sheet layers, wherein an interior of each two-dimensional layer of the two or more sheet layers is bonded via a chemical bond and there is only a Van-der-Waals force between adjacent layers;
b) sequentially forming a flexible base substrate and a display element on the connecting layer;
c) forming an encapsulating layer encapsulating the display element to obtain a flexible display substrate motherboard; and
d) placing the flexible display substrate motherboard in an atmosphere of a polar solvent comprising a hydroxy group to allow the organic layered material to be swollen and separated under action of the polar solvent, so that the support substrate and the flexible base substrate are separated to obtain a flexible display substrate.

13. The production method according to claim 12 , wherein in step d), the method further comprises the step of:
subjecting the flexible display substrate motherboard to heating or ultrasonication.

14. The production method according to claim 12 , wherein in step a), the method comprises the step of:
coating a solution in which an organic material is dissolved on the support substrate, and precipitating an organic layered material on the support substrate using a crystallization process to form the connecting layer, wherein a molecule constituting the organic material comprises a hydrophilic group.

15. The production method according to claim 14 , wherein the molecule constituting the organic layered material is an organic linear molecule.

16. The production method according to claim 15 , wherein the organic linear molecule is a small molecule or an oligomer.

17. The production method according to claim 14 , wherein the connecting layer has a thickness in a range of 10 to 100 nm.

18. The production method according to claim 14 , wherein the hydrophilic group is capable of being ionized by a polar solvent comprising a hydroxy group.

Assignees

• Boe Technology Group Co Ltd
• Hefei Xinsheng Optoelectronics Technology Co Ltd

Inventors

• Jia Wenbin
• Sun Li
• Hsu Minghung

Classifications

• H05K1/056

  the metal substrate being covered by an organic insulating layer · CPC title

• H05K3/007

  Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence) · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H01L51/5253

  Electricity · mapped topic

• H01L51/003

  Electricity · mapped topic