Camera module and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10440247-B2
Application number	US-201715635152-A
Country	US
Kind code	B2
Filing date	Jun 27, 2017
Priority date	Mar 28, 2016
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral encapsulating support structure and to prevent the fluid material from flowing to the photosensitive area of the photosensitive sensor.

First claim

What is claimed is:

1. A camera module, comprising:
at least a circuit board;
at least an optical lens;
at least an insulating member which is a solidified adhesive having a stickiness after solidification;
at least a photosensitive sensor, wherein said insulating member is provided on said photosensitive sensor insulating a photosensitive area from a non-photosensitive area of said photosensitive sensor; and
at least an integral encapsulating support structure, integrally covering and enclosing at least a portion of said non-photosensitive area of said photosensitive sensor and at least an upper surface of said circuit board, wherein said integral encapsulating support structure, said photosensitive sensor, and said circuit board form an integral structure and said optical lens is supported along a photosensitive path of said photosensitive sensor, while said photosensitive sensor is electrically connected with said circuit board.

2. The camera module, as recited in claim 1 , further comprising a camera lens supporter, wherein said camera lens supporter is coupled on said integral encapsulating support structure and said optical lens is supported on said camera lens supporter.

3. The camera module, as recited in claim 2 , wherein said integral encapsulating support structure integrally extends to form said camera lens supporter.

4. The camera module, as recited in claim 1 , further comprising a driver, wherein said driver is supported on said integral encapsulating support structure and electrically connected with said circuit board, wherein said optical lens is mounted on said driver.

5. The camera module, as recited in claim 4 , further comprising at least a filter element which is disposed on top of said integral encapsulating support structure.

6. The camera module, as recited in claim 4 , wherein said circuit board comprises a set of resistance-capacitance components which is electrically connected on said circuit board and being covered, enclosed and wrapped up by said integral encapsulating support structure.

7. The camera module, as recited in claim 1 , further comprising at least a filter element which is disposed on top of said integral encapsulating support structure.

8. The camera module, as recited in claim 1 , wherein said circuit board comprises a set of resistance-capacitance components which is electrically connected on said circuit board and being covered, enclosed and wrapped up by said integral encapsulating support structure.

9. The camera module, as recited in claim 1 , wherein said insulating member is protruded from said photosensitive sensor.

10. The camera module, as recited in claim 1 , wherein said insulating member has an elasticity and flexibility.

11. The camera module, as recited in claim 10 , wherein said integral encapsulating support structure covers an outer peripheral surface of said insulating member.

12. The camera module, as recited in claim 1 , wherein said integral encapsulating support structure covers an outer peripheral surface of said insulating member.

13. A camera module, comprising:
at least a circuit board;
at least an optical lens;
at least an insulating member which is formed by a solidified material having a stickiness after solidification;
at least a photosensitive sensor;
at least a filter element, which is overlappingly provided on top of said photosensitive sensor, while said insulating member is provided on at least an outer periphery of said filter element; and
an integral encapsulating support structure enclosing and covering said circuit board and an outer area of said filter element, wherein after said integral encapsulating support structure is molded to form, said integral encapsulating support structure, said filter element, said photosensitive sensor, and said circuit board form an integral structure, wherein said optical lens is disposed along a photosensitive path of said photosensitive sensor and said photosensitive sensor is electrically connected with said circuit board.

14. The camera module, as recited in claim 13 , further comprising a camera lens supporter, wherein said camera lens supporter is provided on said integral encapsulating support structure and said optical lens is supported on said camera lens supporter.

15. The camera module, as recited in claim 13 , further comprising a driver, wherein said driver is supported on said integral encapsulating support structure and is electrically connected to said circuit board, wherein said optical lens is mounted on said driver.

16. A manufacturing method of a camera module, comprising the steps of:
(a) electrically connecting at least a photosensitive sensor with at least a circuit board;
(b) placing said circuit board and said photosensitive sensor in a formation mold;
(c) providing an insulating member formed by a solidified material having a stickiness after solidification between said photosensitive sensor and a bottom surface of an upper mold of said formation mold and positioning said insulating member at the periphery around at least a photosensitive area of said photosensitive sensor;
(d) forming an integral encapsulating support structure by a molding material received in the formation mold to enclose and cover at least a portion of a nonphotosensitive area of said photosensitive sensor and said circuit board and integrally combines with said photosensitive sensor and said circuit board to form an integral structure after said molding material is solidified; and
(e) supporting at least an optical lens along a photosensitive path of said photosensitive sensor to produce said camera module.

17. The manufacturing method, as recited in claims 16 , wherein said upper mold of said formation mold has an inner groove provided with respect to said photosensitive area of said photosensitive sensor to prevent said upper mold from directly contacting with said photosensitive area.

18. The manufacturing method, as recited in claims 17 , wherein a covering film is provided on said bottom surface of said upper mold of said formation mold.

19. The manufacturing method, as recited in claims 16 , wherein a covering film is provided on said bottom surface of said upper mold of said formation mold.

20. The manufacturing method, as recited in claim 16 , wherein in the step (d), said molding material encloses and covers said circuit board, said non-photosensitive area of said photosensitive sensor outside said insulating member, and the peripheral surface of said insulating member.

21. The manufacturing method, as recited in claim 16 , wherein before the step (e), further comprising a step of:
providing at least a filter element on top of said integral encapsulating support structure and positioning said filter element between said photosensitive sensor and said optical lens.

22. The manufacturing method, as recited in claim 21 , wherein the step (c) comprises a step of applying along the periphery around at least said photosensitive sensor to form said insulating member on said periphery of said photosensitive sensor after said insulating member is solidified to insulate said photosensitive area from said non-photosensitive area of said photosensitive sensor during molding, that prevents said upper mold from directly contacting with said photosensitive area and prevents said molding material from flowing to said photosensitive area of said photosensitive sensor, wherein the adhesive is solidified with damp, heat, UV lighting, or other solidifying reaction.

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Zhao Bojie
• Tanaka Takehiko
• Huang Zhen
• Guo Nan

Classifications

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/50

  Constructional details · CPC title

• H05K3/284

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title