Power module

Patent metadata

Field	Value
Publication number	US-10439505-B2
Application number	US-201715661689-A
Country	US
Kind code	B2
Filing date	Jul 27, 2017
Priority date	Jul 27, 2017
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

A power module includes a first circuit structure having a first bus substrate. The first bus structure has a first side on which is disposed a first circuit element. A second circuit structure has a second bus substrate and a second side on which is disposed a second circuit element. The first circuit structure and the second circuit structure are oriented in a stacked configuration such that the first side is disposed facing the second side, and the first circuit element partially overlaps the second circuit element. An output bus is disposed between the first circuit structure and the second circuit structure.

First claim

What is claimed is:

1. An electric vehicle comprising:
a direct current (DC) power source with a DC electric power output;
a module that is coupled to receive the DC electric power output of the DC power source, the module having an alternating current (AC) electric power output; and
an electric motor that is coupled to receive the AC electric power output, the electric motor having a driving torque output that is coupled to drive at least one wheel of the vehicle, wherein
the module comprises a power module including a first circuit structure and a second circuit structure, the first circuit structure and the second circuit structure are stacked relative to an output structure, and wherein a first circuit element of the first circuit structure at least partially overlaps a second circuit element of the second circuit structure;
a first thermal conductor disposed between the first circuit structure and the output member to provide direct thermal coupling of the first circuit structure and the output member, a second thermal conductor disposed between the second circuit structure and the output member to provide direct thermal coupling of the second circuit structure and the output member; and wherein
the first thermal conductor forms at least a first thermally conductive path from the first circuit element and the output member to a first exterior portion of the power module, and the second thermal conductor forms at least a second thermally conductive path from the second circuit element and the output member to a second exterior portion of the power module.

2. The electric vehicle of claim 1 , wherein each of the first circuit element and the second circuit element comprises one of an insulated-gate bipolar transistor (IGBT), a metal oxide field effect transistor (MOSFET) and a gate turn off thyristor (GTO).

3. The electric vehicle of claim 1 , wherein the first circuit structure comprises a first DC bus member and the second circuit structure comprises a second DC bus member.

4. The electric vehicle of claim 3 , wherein each of the first DC bus member and the second DC bus member comprises a copper substrate.

5. The electric vehicle of claim 3 , wherein the first circuit element is formed on the first DC bus member and the second circuit element is formed on the second circuit member.

6. The electric vehicle of claim 1 , wherein the output structure comprises an alternative current (AC) bus disposed between the first circuit structure and the second circuit structure, the first circuit element and the second circuit element each being operably coupled to the AC bus.

7. The electric vehicle of claim 6 , wherein the AC bus is three phase.

8. A power module comprising:
a first circuit structure; and
a second circuit structure;
wherein the first circuit structure and the second circuit structure are stacked relative to an output structure,
wherein a first circuit element of the first circuit structure at least partially overlaps a second circuit element of the second circuit structure;
a first thermal conductor disposed between the first circuit structure and the output structure to provide direct thermal coupling of the first circuit structure and the output structure, and a second thermal conductor disposed between the second circuit structure and the output structure to provide direct thermal coupling of the second circuit structure and the output structure; and wherein
the first thermal conductor forms at least a first conductive path from the first circuit element and the output member to a first exterior portion of the power module, and the second thermal conductor forms at least a second conductive path from the second circuit element and the output member to a second exterior portion of the power module.

9. The power module of claim 8 , wherein each of the first circuit element and the second circuit element comprises one of an insulated-gate bipolar transistor (IGBT), a metal oxide field effect transistor (MOSFET) and a gate turn off thyristor (GTO).

10. The power module of claim 8 , wherein the first circuit structure comprises a first DC bus member and the second circuit structure comprises a second DC bus member.

11. The power module of claim 10 , wherein each of the first DC bus member and the second DC bus member comprises a copper substrate.

12. The power module of claim 10 , wherein the first circuit element is formed on the first DC bus member and the second circuit element is formed on the second circuit member.

13. The power module of claim 8 , the output structure comprises an alternative current (AC) bus disposed between the first circuit structure and the second circuit structure, the first circuit element and the second circuit element each being operably coupled to the AC output structure.

14. The power module of claim 13 , wherein the AC bus is three phase.

15. A power module comprising:
a first circuit structure having a first bus substrate, the first bus structure having a first side on which is disposed a first circuit element;
a second circuit structure having a second bus substrate, the second bus structure having a second side on which is disposed a second circuit element; and wherein,
the first circuit structure and the second circuit structure being oriented in a stacked configuration, the first side is disposed facing the second side, and the first circuit element partially overlaps the second circuit element, and an output bus being disposed between the first circuit structure and the second circuit structure;
a first thermal conductor disposed between the first circuit structure and the output structure to provide direct thermal coupling of the first circuit element and the output structure, and a second thermal conductor disposed between the second circuit element and the output structure to provide direct thermal coupling of the second circuit element and the output structure; and wherein
the first thermal conductor forms at least a first conductive path from the first circuit element and the output member to a first exterior portion of the power module, and the second thermal conductor forms at least a second conductive path from the second circuit element and the output member to a second exterior portion of the power module.

16. The power module of claim 15 , wherein each of the first circuit element and the second circuit element comprises one of an insulated-gate bipolar transistor (IGBT), a metal oxide field effect transistor (MOSFET) and a gate turn off thyristor (GTO).

17. The power module of claim 15 , the output bus comprising an alternative current (AC) output bus.

Assignees

• Gm Global Tech Operations Llc

Inventors

• Young Ronald W
• Ward Terence G
• Jaksic Marko

Classifications

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H02M7/003 Primary

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

• H02P2101/45

  for motor vehicles, e.g. car alternators · CPC title

• H02P27/06

  using DC to AC converters or inverters (H02P27/05 takes precedence) · CPC title

• B60L2210/40

  DC to AC converters · CPC title