Rectangular rolled copper foil, flexible flat cable, rotary connector, and method of manufacturing rectangular rolled copper foil

US10439347B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10439347-B2
Application numberUS-201715717188-A
CountryUS
Kind codeB2
Filing dateSep 27, 2017
Priority dateApr 1, 2015
Publication dateOct 8, 2019
Grant dateOct 8, 2019

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A rectangular rolled copper foil includes copper or a copper alloy having a 0.2% yield strength of greater than or equal to 250 MPa. In a cross section perpendicular to a rolling direction, an area ratio of crystal grains oriented at a deviation angle of less than or equal to 12.5° from a Cube orientation is greater than or equal to 8%.

First claim

Opening claim text (preview).

What is claimed is: 1. A rectangular rolled copper foil comprising copper or a copper alloy having a 0.2% yield strength of greater than or equal to 250 MPa, wherein, in a cross section perpendicular to a rolling direction, an area ratio of crystal grains oriented at a deviation angle of less than or equal to 12.5° from a Cube orientation is greater than or equal to 8% and less than or equal to 90%, wherein a lattice defect is introduced in a structure of a matrix of the rectangular rolled copper foil, and an average crystal particle diameter of the rectangular rolled copper foil is 1 μm to 10 μm. 2. The rectangular rolled copper foil according to claim 1 , wherein the rectangular rolled copper foil is a copper alloy comprising a total of less than or equal to 1.5% by mass of one or two or more elements selected from the group consisting of Mg, Zn, Sn, P, Cr, Si, Zr, Ti, and Fe, with the balance being copper and inevitable impurities; and wherein in a case Mg is present in the copper alloy the Mg is present between 0.01 to 0.2% by mass, wherein in a case Zn is present in the copper alloy the Zn is present between 0.01 to 0.5% by mass, wherein in a case Sn is present in the copper alloy the Sn is present between 0.01 to 1.5% by mass, wherein in a case Ag is present in the copper alloy the Ag is present between 0.01 to 0.1% by mass, wherein in a case P is present in the copper alloy the P is present between 0.001 to 0.05% by mass, wherein in a case Cr is present in the copper alloy the Cr is present between 0.1 to 0.5% by mass, wherein in a case Si is present in the copper alloy the Si is present between 0.01 to 0.1% by mass, wherein in a case Zr is present in the copper alloy the Zr is present between 0.01 to 0.2% by mass, wherein in a case Ti is present in the copper alloy the Ti is present between 0.01 to 0.2% by mass, and wherein in a case Fe is present the copper alloy the Fe is present between 0.01 to 0.2% by mass. 3. The rectangular rolled copper foil according to claim 1 , wherein the rectangular rolled copper foil is a copper alloy comprising a total of less than or equal to 1.0% by mass of one or two or more elements selected from the group consisting of Mg, Zn, Sn, P, Cr, Si, Zr, Ti, and Fe, with the balance being copper and inevitable impurities; and wherein in a case Mg is present in the copper alloy the Mg is present between 0.01 to 0.2% by mass, wherein in a case Zn is present in the copper alloy the Zn is present between 0.01 to 0.5% by mass, wherein in a case Sn is present in the copper alloy the Sn is present between 0.01 to 1.0% by mass, wherein in a case Ag is present in the copper alloy the Ag is present between 0.01 to 0.1% by mass, wherein in a case P is present in the copper alloy the P is present between 0.001 to 0.05% by mass, wherein in a case Cr is present in the copper alloy the Cr is present between 0.1 to 0.5% by mass, wherein in a case Si is present in the copper alloy the Si is present between 0.01 to 0.1% by mass, wherein in a case Zr is present in the copper alloy Zr is present between 0.01 to 0.2% by mass, wherein in a case Ti is present in the copper alloy the Ti is present between 0.01 to 0.2% by mass, and wherein in a case Fe is present in the copper alloy the Fe is present between 0.01 to 0.2% by mass. 4. The rectangular rolled copper foil according to claim 1 , wherein a 0.2% yield strength of greater than or equal to 250 MPa is maintained even in a state where heat treatment has been conducted under a condition of C=20 and in a range of P=7000 to 9000, where P is a Larson-Miller parameter defined by P=T(C+log tr), T represents absolute temperature (K), tr represents rupture time (h), and C represents a material constant. 5. A flexible flat cable comprising the rectangular rolled copper foil according to claim 1 . 6. A rotary connector comprising the flexible flat cable according to claim 5 , the rotary connector being applicable to a bent portion of the flexible flat cable having a bend radius of less than or equal to 6 mm.

Assignees

Inventors

Classifications

  • Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working (apparatus for mechanical working of metal B21, B23, B24) · CPC title

  • mainly consisting of metals or alloys · CPC title

  • Apparatus or processes specially adapted for manufacturing conductors or cables · CPC title

  • for rolling foils which present special problems, e.g. because of thinness · CPC title

  • Composite · CPC title

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What does patent US10439347B2 cover?
A rectangular rolled copper foil includes copper or a copper alloy having a 0.2% yield strength of greater than or equal to 250 MPa. In a cross section perpendicular to a rolling direction, an area ratio of crystal grains oriented at a deviation angle of less than or equal to 12.5° from a Cube orientation is greater than or equal to 8%.
Who is the assignee on this patent?
Furukawa Electric Co Ltd, Furukawa Automotive Systems Inc
What technology area does this patent fall under?
Primary CPC classification B21B3/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 08 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).