Copper alloy for electric and electronic device, copper alloy sheet for electric and electronic device, conductive component for electric and electronic device, and terminal
US-2015325327-A1 · Nov 12, 2015 · US
US10439347B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10439347-B2 |
| Application number | US-201715717188-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 27, 2017 |
| Priority date | Apr 1, 2015 |
| Publication date | Oct 8, 2019 |
| Grant date | Oct 8, 2019 |
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A rectangular rolled copper foil includes copper or a copper alloy having a 0.2% yield strength of greater than or equal to 250 MPa. In a cross section perpendicular to a rolling direction, an area ratio of crystal grains oriented at a deviation angle of less than or equal to 12.5° from a Cube orientation is greater than or equal to 8%.
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What is claimed is: 1. A rectangular rolled copper foil comprising copper or a copper alloy having a 0.2% yield strength of greater than or equal to 250 MPa, wherein, in a cross section perpendicular to a rolling direction, an area ratio of crystal grains oriented at a deviation angle of less than or equal to 12.5° from a Cube orientation is greater than or equal to 8% and less than or equal to 90%, wherein a lattice defect is introduced in a structure of a matrix of the rectangular rolled copper foil, and an average crystal particle diameter of the rectangular rolled copper foil is 1 μm to 10 μm. 2. The rectangular rolled copper foil according to claim 1 , wherein the rectangular rolled copper foil is a copper alloy comprising a total of less than or equal to 1.5% by mass of one or two or more elements selected from the group consisting of Mg, Zn, Sn, P, Cr, Si, Zr, Ti, and Fe, with the balance being copper and inevitable impurities; and wherein in a case Mg is present in the copper alloy the Mg is present between 0.01 to 0.2% by mass, wherein in a case Zn is present in the copper alloy the Zn is present between 0.01 to 0.5% by mass, wherein in a case Sn is present in the copper alloy the Sn is present between 0.01 to 1.5% by mass, wherein in a case Ag is present in the copper alloy the Ag is present between 0.01 to 0.1% by mass, wherein in a case P is present in the copper alloy the P is present between 0.001 to 0.05% by mass, wherein in a case Cr is present in the copper alloy the Cr is present between 0.1 to 0.5% by mass, wherein in a case Si is present in the copper alloy the Si is present between 0.01 to 0.1% by mass, wherein in a case Zr is present in the copper alloy the Zr is present between 0.01 to 0.2% by mass, wherein in a case Ti is present in the copper alloy the Ti is present between 0.01 to 0.2% by mass, and wherein in a case Fe is present the copper alloy the Fe is present between 0.01 to 0.2% by mass. 3. The rectangular rolled copper foil according to claim 1 , wherein the rectangular rolled copper foil is a copper alloy comprising a total of less than or equal to 1.0% by mass of one or two or more elements selected from the group consisting of Mg, Zn, Sn, P, Cr, Si, Zr, Ti, and Fe, with the balance being copper and inevitable impurities; and wherein in a case Mg is present in the copper alloy the Mg is present between 0.01 to 0.2% by mass, wherein in a case Zn is present in the copper alloy the Zn is present between 0.01 to 0.5% by mass, wherein in a case Sn is present in the copper alloy the Sn is present between 0.01 to 1.0% by mass, wherein in a case Ag is present in the copper alloy the Ag is present between 0.01 to 0.1% by mass, wherein in a case P is present in the copper alloy the P is present between 0.001 to 0.05% by mass, wherein in a case Cr is present in the copper alloy the Cr is present between 0.1 to 0.5% by mass, wherein in a case Si is present in the copper alloy the Si is present between 0.01 to 0.1% by mass, wherein in a case Zr is present in the copper alloy Zr is present between 0.01 to 0.2% by mass, wherein in a case Ti is present in the copper alloy the Ti is present between 0.01 to 0.2% by mass, and wherein in a case Fe is present in the copper alloy the Fe is present between 0.01 to 0.2% by mass. 4. The rectangular rolled copper foil according to claim 1 , wherein a 0.2% yield strength of greater than or equal to 250 MPa is maintained even in a state where heat treatment has been conducted under a condition of C=20 and in a range of P=7000 to 9000, where P is a Larson-Miller parameter defined by P=T(C+log tr), T represents absolute temperature (K), tr represents rupture time (h), and C represents a material constant. 5. A flexible flat cable comprising the rectangular rolled copper foil according to claim 1 . 6. A rotary connector comprising the flexible flat cable according to claim 5 , the rotary connector being applicable to a bent portion of the flexible flat cable having a bend radius of less than or equal to 6 mm.
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working (apparatus for mechanical working of metal B21, B23, B24) · CPC title
mainly consisting of metals or alloys · CPC title
Apparatus or processes specially adapted for manufacturing conductors or cables · CPC title
for rolling foils which present special problems, e.g. because of thinness · CPC title
Composite · CPC title
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