Stack-type image sensor

Patent metadata

Field	Value
Publication number	US-10438989-B2
Application number	US-201715801418-A
Country	US
Kind code	B2
Filing date	Nov 2, 2017
Priority date	Apr 24, 2017
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

A stack-type image sensor include a first substrate comprising a photoelectric conversion element and a storage transistor connecting the photoelectric conversion element to a charge storage element; and a second substrate comprising a transfer transistor connecting the charge storage element to a floating diffusion, wherein the first substrate and the second substrate are stacked. The charge storage element comprises: a first electrode and a second electrode positioned adjacent to the first electrode and having a sidewall facing a sidewall of the first electrode, wherein the first electrodes and the second electrodes comprise at least one bonding pad formed in the first or second substrate; and a dielectric layer inserted between the sidewall of the first electrode and the sidewall of the second electrode, which face each other.

First claim

What is claimed is:

1. A stack-type image sensor, comprising:
a first substrate comprising a photoelectric conversion element and a storage transistor connecting the photoelectric conversion element to a charge storage element; and
a second substrate comprising a transfer transistor connecting the charge storage element to a floating diffusion,
wherein the first substrate and the second substrate are stacked,
wherein the charge storage element comprises:
a first electrode and a second electrode positioned adjacent to the first electrode and having a sidewall facing a sidewall of the first electrode, wherein the first electrodes and the second electrodes comprise at least one bonding pad formed in the first or second substrate; and
a dielectric layer inserted between the sidewall of the first electrode and the sidewall of the second electrode, which face each other.

2. The stack-type image sensor of claim 1 , wherein the first electrode is formed in each of the first and second substrates, and comprises bonding pads that are in contact with each other.

3. The stack-type image sensor of claim 2 , wherein the bonding pads that are in contact with each other have substantially the same planar shape.

4. The stack-type image sensor of claim 1 , wherein the second electrode has a ground potential.

5. The stack-type image sensor of claim 1 , wherein the second electrode comprises a bonding pad formed in the first substrate or a bonding pad formed in the second substrate.

6. The stack-type image sensor of claim 1 , wherein the second electrode is formed in each of the first and second substrates, and comprises bonding pads that are in contact with each other.

7. The stack-type image sensor of claim 6 , wherein the bonding pads that are in contact with each other have different planar shapes.

8. A stack-type image sensor, comprising:
a first substrate including a first semiconductor substrate including a photoelectric conversion element, a first interlayer dielectric layer formed over the first semiconductor substrate, a first bonding pad formed in the first interlayer dielectric layer and connected to the photoelectric conversion element through a storage transistor, and a second bonding pad formed in the first interlayer dielectric layer and positioned adjacent to the first bonding pad; and
a second substrate including a second semiconductor substrate, a second interlayer dielectric layer formed over the second semiconductor substrate, and a third bonding pad formed in the second interlayer dielectric layer and connected to a floating diffusion through a transfer transistor,
wherein the first and second substrates are stacked and bonded to each other such that the first and third bonding pads are in contact with each other.

9. The stack-type image sensor of claim 8 , further comprising:
a fourth bonding pad formed in the second interlayer dielectric layer of the second substrate and being in contact with the second bonding pad.

10. The stack-type image sensor of claim 9 , wherein the fourth bonding pad is positioned adjacent to the third bonding pad, the third and fourth bonding pads are positioned at the same level in a direction vertical to a stacked structure of the first and second substrates, and the fourth bonding pad has a sidewall facing a sidewall of the third bonding pad in a direction horizontal to the stacked structure of the first and second substrates.

11. The stack-type image sensor of claim 10 , wherein the fourth bonding pad surrounds a part of the sidewalls of the third bonding pad, or surrounds the whole sidewalls of the third bonding pad.

12. The stack-type image sensor of claim 10 , wherein the second interlayer dielectric layer is inserted between the sidewall of the third bonding pad and the sidewall of the fourth bonding pad, which face each other.

13. The stack-type image sensor of claim 9 , wherein the fourth bonding pad has a ground potential.

14. The stack-type image sensor of claim 9 , wherein the second and fourth bonding pads have different planar shapes.

15. The stack-type image sensor of claim 8 , wherein the first and second bonding pads are positioned at the same level in a direction vertical to a stacked structure of the first and second substrates, and the second bonding pad has a sidewall facing a sidewall of the first bonding pad in a direction horizontal to the stacked structure of the first and second substrates.

16. The stack-type image sensor of claim 8 , wherein the first interlayer dielectric layer is inserted between a sidewall of the first bonding pad and a sidewall of the second bonding pad, which face each other.

17. The stack-type image sensor of claim 8 , wherein the second bonding pad has a ground potential.

18. The stack-type image sensor of claim 8 , wherein the second bonding pad surrounds a part of sidewalls of the first bonding pad, or surrounds the whole sidewalls of the first bonding pad.

19. The stack-type image sensor of claim 8 , wherein the first and third bonding pads have the same planar shape.

20. The stack-type image sensor of claim 8 , further comprising:
a bonding insulating layer formed over a bonding surface between the first and second substrates,
wherein the first and third bonding pads are electrically connected through the bonding insulating layer.

Assignees

• Sk Hynix Inc

Inventors

• Kim Yeounsoo
• Woo Donghyun

Classifications

• H04N25/79

  Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors · CPC title

• H01L31/02

  Electricity · mapped topic

• H04N5/379

  Electricity · mapped topic

• H01L27/146

  Electricity · mapped topic

• H01L27/14806 Primary

  Electricity · mapped topic