Method for producing a semiconductor module
US-10032743-B2 · Jul 24, 2018 · US
US10438871B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10438871-B2 |
| Application number | US-201615773633-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 29, 2016 |
| Priority date | Dec 3, 2015 |
| Publication date | Oct 8, 2019 |
| Grant date | Oct 8, 2019 |
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A conductor track which is designed in particular for use with ultrasonic welding. The invention also relates to an associated method and to an associated use.
Opening claim text (preview).
The invention claimed is: 1. An electrical conductor track formed from a continuous section of material, comprising: a contact location provided on the continuous section of material, which is designed to be connected to an electrical contact by ultrasonic welding, a bonding location provided on the continuous section of material, which is designed to bond a bonding wire onto the conductor track, and at least one ultrasonic wave interruption element, which, when ultrasound is coupled in at the contact location, attenuates a propagation of ultrasonic waves along the continuous section of material from the contact location to the bonding location, the at least one ultrasonic wave interruption element comprising a hole through the continuous section of material, the hole surrounded on all sides by the continuous section of material. 2. The electrical conductor track as claimed in claim 1 , wherein the hole is arranged on a connecting line between the bonding location and the contact location. 3. The electrical conductor track as claimed in claim 1 , further comprising: a plurality of ultrasonic wave interruption elements, which, when ultrasound is used at the contact location, each attenuate a propagation of ultrasonic waves from the contact location to the bonding location. 4. The electrical conductor track as claimed in claim 1 , wherein the electrical conductor track is part of a chip package, which contains a sensor. 5. The electrical conductor track as claimed in claim 1 , which is part of a leadframe. 6. An electrical conductor track formed from a continuous section of material, comprising: a contact location provided on the continuous section of material, which is designed to be connected to an electrical contact by ultrasonic welding, a bonding location provided on the continuous section of material, which is designed to bond a bonding wire onto the conductor track, and at least one ultrasonic wave interruption element, which, when ultrasound is coupled in at the contact location, attenuates a propagation of ultrasonic waves along the continuous section of material from the contact location to the bonding location, wherein the ultrasonic wave interruption element is a notch. 7. An electrical conductor track formed from a continuous section of material, comprising: a contact location provided on the continuous section of material, which is designed to be connected to an electrical contact by ultrasonic welding, a bonding location provided on the continuous section of material, which is designed to bond a bonding wire onto the conductor track, and at least one ultrasonic wave interruption element, which, when ultrasound is coupled in at the contact location, attenuates a propagation of ultrasonic waves along the continuous section of material from the contact location to the bonding location, wherein the ultrasonic wave interruption element is an angled portion. 8. An electrical conductor track formed from a continuous section of material, comprising: a contact location provided on the continuous section of material, which is designed to be connected to an electrical contact by ultrasonic welding, a bonding location provided on the continuous section of material, which is designed to bond a bonding wire onto the conductor track, and at least one ultrasonic wave interruption element, which, when ultrasound is coupled in at the contact location, attenuates a propagation of ultrasonic waves along the continuous section of material from the contact location to the bonding location, wherein the ultrasonic wave interruption element is an offset portion. 9. A method for connecting an electrical conductor track to an electrical contact, the electrical contract tract comprising: a contact location, a bonding location, and at least one ultrasonic wave interruption element, the method comprising: providing the electrical conductor track, applying the electrical contact to the contact location, and coupling ultrasound in at the contact location to connect the electrical contact to the electrical conductor track, wherein, when the ultrasound is coupled in at the contact location, the ultrasonic wave interruption element attenuates propagation of ultrasonic waves from the contact location to the bonding location. 10. The method as claimed in claim 9 , wherein a central line of the ultrasound in-coupling does not run through the bonding location. 11. The method as claimed in claim 9 , wherein a bonding wire is bonded at the bonding location of the electrical conductor track. 12. The method as claimed in claim 11 , wherein a central line of the ultrasound in-coupling does not run through the bonding location. 13. A method of ultrasonic welding an electrical contact to an electrical conductor track, comprising propagating ultrasonic waves to a bonding location of the conductor track and reducing the ultrasonic waves by at least one ultrasound wave interruption element.
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
Ultrasonic bonding, e.g. thermosonic bonding · CPC title
not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title
Plan-view shape, i.e. in top view · CPC title
Subject matter not provided for in other groups of this subclass · CPC title
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