Semiconductor device

Patent metadata

Field	Value
Publication number	US-10438865-B2
Application number	US-201615778635-A
Country	US
Kind code	B2
Filing date	Feb 4, 2016
Priority date	Feb 4, 2016
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

It is an object of the present invention to provide a semiconductor device that has sufficient insulation properties between a screw and a heat dissipation plate, and is smaller and less costly. A semiconductor device of the present invention includes the following: a housing containing a semiconductor element; a heat dissipation plate disposed on a bottom surface of the housing, and provided to partly extend beyond the housing to reach the outside; an electrode electrically connected to the semiconductor element, and provided to partly protrude from the housing to the outside in parallel with the heat dissipation plate; and a screw with which an exposed portion of the electrode, protruding from the housing is joined to a busbar. The heat dissipation plate has a thickness lack portion in a location of the heat dissipation plate, the location at least facing the screw, the location being on a screw side.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a housing containing a semiconductor element;
a heat dissipation plate disposed on a bottom surface of the housing, and provided to partly extend beyond the housing to reach an outside;
an electrode electrically connected to the semiconductor element, and provided to partly protrude from the housing to the outside in parallel with the heat dissipation plate; and
a screw penetrating the partly protruded portion of the electrode, and joined to an external terminal,
wherein the heat dissipation plate comprises a thickness lack portion at least at a location facing the screw, and the thickness lack portion is thinner than the other portions of the heat dissipation plate, at a side facing the screw.

2. The semiconductor device according to claim 1 , wherein the heat dissipation plate comprises the thickness lack portion all across a site in which the heat dissipation plate extends to reach the outside, the site including the location facing the screw.

3. The semiconductor device according to claim 1 , wherein the heat dissipation plate comprises the thickness lack portion only in the location facing the screw.

4. The semiconductor device according to claim 1 , wherein at least a portion of each of the screw and the thickness lack portion directly face each other.

5. A semiconductor device comprising:
a housing containing a semiconductor element;
a heat dissipation plate disposed on a bottom surface of the housing, and provided to partly extend beyond the housing to reach an outside;
an electrode electrically connected to the semiconductor element, and provided to partly protrude from the housing to the outside in parallel with the heat dissipation plate; and
a screw penetrating the partly protruded portion of the electrode, and joined to an external terminal,
wherein the heat dissipation plate includes an opening at a location overlying the screw when viewed from a side at the heat dissipation plate facing opposite the screw, and a width of the opening is greater than a width of a head of the screw.

6. The semiconductor device according to claim 5 , wherein the heat dissipation plate comprises a cutout in the location facing the screw.

7. The semiconductor device according to claim 5 , wherein the opening surrounds the location facing the screw.

8. The semiconductor device according to claim 5 , wherein at least a portion of the screw is viewable through the opening from the side at the heat dissipation plate facing opposite the screw.

Assignees

• Mitsubishi Electric Corp

Inventors

• Taguchi Koichi
• Hata Yuki

Classifications

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W40/10

  Arrangements for heating · CPC title

• H10W76/47 Primary

  Solid or gel fillings · CPC title

• H10W76/15

  Containers comprising an insulating or insulated base · CPC title