Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
US10437149B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10437149-B2 |
| Application number | US-201715655887-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 21, 2017 |
| Priority date | Feb 19, 2015 |
| Publication date | Oct 8, 2019 |
| Grant date | Oct 8, 2019 |
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Provided is a photosensitive resin composition, including: a polymer compound which has a polycyclic structure and a sulfonamide group in a main chain thereof; and an infrared absorbent, wherein the polycyclic structure has at least one structure selected from the group consisting of a fused cyclic hydrocarbon structure and a fused polycyclic aromatic structure.
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What is claimed is: 1. A photosensitive resin composition, comprising: a polymer compound which has a polycyclic structure and a sulfonamide group in a main chain thereof; and an infrared absorbent, wherein the polycyclic structure comprises at least one structure selected from the group consisting of a fused cyclic hydrocarbon structure and a fused polycyclic aromatic structure, wherein the polymer compound comprises a structure represented by any one of the following Formulae A-1 to A-3: wherein, in Formulae A-1 to A-3, R A11 , R A12 , R A21 , R A22 , and R A31 to R A33 each independently represent a hydrogen atom, a sulfonamide group, a hydroxyl group, a carboxy group, an alkyl group, or a halogen atom; Z A11 and Z A21 each independently represent —C(R) 2 —, —O—, —NR—, —S—, or a single bond, wherein R represents a hydrogen atom or an alkyl group; and X A21 represents —C(R′) 2 —, —O—, —NR′—, —S—, or a single bond, wherein R′ represents a hydrogen atom or an alkyl group. 2. The photosensitive resin composition according to claim 1 , wherein the polymer compound comprises a structure represented by any one of the following Formulae B-1 to B-3: wherein, in Formulae B-1 to B-3, R B11 , R B12 , R B21 , R B22 , and R B31 to R B33 each independently represent a hydrogen atom, a sulfonamide group, a hydroxyl group, a carboxy group, an alkyl group, or a halogen atom; Z B11 and Z B21 each independently represent —C(R) 2 —, —O—, —NR—, —S—, or a single bond, wherein R represents a hydrogen atom or an alkyl group; X B21 represents —C(R′) 2 —, —O—, —NR′—, —S—, or a single bond, wherein R′ represents a hydrogen atom or an alkyl group; Q B11 , Q B12 , Q B21 , Q B22 , Q B31 , and Q 32 each independently represent an alkylene group, an arylene group, a divalent saturated alicyclic hydrocarbon group, a divalent unsaturated alicyclic hydrocarbon group, or a divalent group formed by a plurality of these groups being linked to each other; and nB11, nB12, nB21, nB22, nB31, and nB32 each independently represent an integer of 1 or larger. 3. The photosensitive resin composition according to claim 2 , wherein the polymer compound comprises a structure represented by the following Formula C-1 or C-2 as the structure represented by Formula B-1 or comprises a structure represented by the following Formula C-3 or C-4 as the structure represented by Formula B-2: wherein, in Formulae C-1 to C-4, R C11 , R C12 , R C21 , R C22 , R C31 , R C32 , R C41 , and R C42 each independently represent a hydrogen atom, a sulfonamide group, a hydroxyl group, a carboxy group, an alkyl group, or a halogen atom; Q C11 , Q C12 , Q C21 , Q C22 , Q C31 , Q C32 , Q C41 , and Q C42 each independently represent an alkylene group, an arylene group, a divalent saturated alicyclic hydrocarbon group, a divalent unsaturated alicyclic hydrocarbon group, or a divalent group formed by a plurality of these groups being linked to each other; and nC11, nC12, nC21, nC22, nC31, nC32, nC41, and nC42 each independently represent an integer of 1 or larger. 4. The photosensitive resin composition according to claim 3 , wherein the polymer compound comprises the structure represented by Formula C-1 or C-2. 5. The photosensitive resin composition according to claim 1 , wherein the polymer compound further comprises an alkyleneoxy group in the main chain thereof. 6. The photosensitive resin composition according to claim 1 , wherein the polymer compound further comprises at least one selected from the group consisting of a urea bond, a urethane bond, an imide bond, an amide bond, a carbonate bond, and a linking group formed by two or more of these bonds being bonded to each other, in the main chain thereof. 7. A planographic printing plate precursor, comprising: a support having a hydrophilic surface; and an image recording layer which comprises the photosensitive resin composition according to claim 1 , on the support. 8. The planographic printing plate precursor according to claim 7 , which is a positive type planographic printing plate precursor. 9. The planographic printing plate precursor according to claim 7 , which is a positive type planographic printing plate precursor, wherein the image recording layer comprises a lower layer and an upper layer in this order, on the support having a hydrophilic surface, and wherein at least one of the lower layer or the upper layer comprises the photosensitive resin composition. 10. The planographic printing plate precursor according to claim 7 , further comprising an undercoat layer between the support having a hydrophilic surface and the image recording layer. 11. A method for producing a planographic printing plate, comprising in the following order: image-wise exposing the planographic printing plate precursor according to claim 7 ; and performing development using an alkali aqueous solution having a pH of 8.5 to 13.5. 12. A polymer compound, comprising a structure represented by any one of the following Formulae B-1, B-2, B-3 and B-6: wherein, in Formulae B-1, B-2, B-3 and B-6, R B11 , R B12 , R B21 , R B22 , R B31 to R B33 , and R B61 to R B63 each independently represent a hydrogen atom, a sulfonamide group, a hydroxyl group, a carboxy group, an alkyl group, or a halogen atom; Z B11 and Z B21 each independently represent —C(R) 2 —, —O—, —NR—, —S—, or a single bond, wherein R represents a hydrogen atom or an alkyl group; X B21 represents —C(R′) 2 —, —O—, —NR′—, —S—, or a single bond, wherein R′ represents a hydrogen atom or an alkyl group; Q B11 , Q B12 , Q B21 , Q B22 , Q B31 , Q 32 , Q B61 , and Q B62 each independently represent an alkylene group, an arylene group, a divalent saturated alicyclic hydrocarbon group, a divalent unsaturated alicyclic hydrocarbon group, or a divalent group formed by a plurality of these groups being linked to each other; and nB11, nB12, nB21, nB22, nB31, nB32, nB61, and nB62 each independently represent an integer of 1 or larger. 13. The polymer compound according to claim 12 , which comprises a structure represented by the following Formula C-1 or C-2 as the structure represented by Formula B-1 or comprises a structure represented by the following Formula C-3 or C-4 as the structure represented by Formula B-2: wherein, in Formulae C-1 to C-4, R C11 , R C12 , R C21 , R C22 , R C31 , R C32 , R C41 , and R C42 each independently represent a hydrogen atom, a sulfonamide group, a hydroxyl group, a carboxy group, an alkyl group, or a halogen atom; Q C11 , Q C12 , Q C21 , Q C22 , Q C31 , Q C32 , Q C41 , and Q C42 each independently represent an alkylene group, an arylene group, a divalent saturated alicyclic hydrocarbon group, a divalent unsaturated alicyclic hydrocarbon group, or a divalent group formed by a plurality of these groups being linked to each other; and nC11, nC12, nC21, nC22, nC31, nC32, nC41, and nC42 each independently represent an integer of 1 or larger. 14. The polymer compound according to claim 13 , which comprises the structure represented by Formula C-1 or C-2. 15. The polymer compound according to claim 12 , comprising an a
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characterised by structural details, e.g. protective layers, backcoat layers or several imaging layers · CPC title
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