Micro flexible force sensor

Patent metadata

Field	Value
Publication number	US-10436664-B2
Application number	US-201715604194-A
Country	US
Kind code	B2
Filing date	May 24, 2017
Priority date	May 24, 2017
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

Embodiments relate generally to a sensor device, method, and system are provided for housing a sensor. An example force sensor includes an actuation element, a sense die, and a universal housing for holding a sense die. The universal housing has a top wall, a bottom wall, two side walls, and a back wall that define a cavity. The sense die is disposed within the cavity. The top wall defines an aperture having a first central axis therethrough. The housing defines an opening between the top wall and bottom wall extending from an exterior of the housing to the cavity. The opening has a second central axis and is configured to receive the sense die therethrough. At least a portion of the actuation element extends from the cavity through the aperture. The first central axis is orthogonal to the second central axis.

First claim

What is claimed is:

1. A sensor, comprising:
an actuation element;
a sense die; and
a housing comprising a top wall and a bottom wall, wherein the top wall and the bottom wall define a cavity therebetween,
wherein the top wall defines an aperture extending therethrough, the aperture having a first central axis,
wherein the housing defines an opening between the top wall and the bottom wall extending from an exterior of the housing to the cavity,
wherein the opening has a second central axis and is configured to receive the sense die therethrough, and
wherein at least a portion of the actuation element extends from the cavity through the aperture, and wherein the first central axis of the aperture is orthogonal to the second central axis of the opening.

2. The sensor of claim 1 , wherein the actuation element is disposed within the housing, and wherein the actuation element is operable to receive a force and transfer the force to the sense die.

3. The sensor of claim 1 , wherein a plug is disposed within the opening, wherein the plug is configured to retain the sense die within the housing.

4. The sensor of claim 1 , further comprising a plurality of electrical connections disposed on an interior surface of one or more of plurality of walls, wherein the plurality of electrical connections comprise at least one of electrical traces formed by laser selective plating, molded metallic studs, or combinations thereof.

5. The sensor of claim 4 , wherein the sense die is electrically coupled to the plurality of electrical connections using SMT mounting or soldered connections.

6. A housing for holding a sense die, comprising:
a top wall, wherein the top wall defines an aperture extending therethrough, and wherein the aperture having a first central axis;
a bottom wall comprising one or more electrical connections; and
two sidewalls configured to hold the top wall and the bottom wall, wherein the top wall, the bottom wall, and the two sidewalls form a cavity wherein an opening is defined between the top wall and the bottom wall extending from an exterior of the housing to the cavity, wherein the opening has a second central axis and is configured to receive the sense die therethrough, and
wherein the first central axis of the aperture is orthogonal to the second central axis of the opening.

7. The housing of claim 6 , wherein the aperture is configured to hold an actuation element, wherein the actuation element is configured to actuate the sense die based on a force realized by the actuation element and transferred to the sense die.

8. The housing of claim 6 , further comprising a back wall configured to hold the sense die within the housing and prevent environmental contamination to the sense die.

9. The housing of claim 6 , further comprising a die stop configured to hold the sense die at a desired position within the housing, and wherein the die stop is located on an interior face of at least one of the bottom wall, an interior face of the top wall, an interior face of the at least one of the two sidewalls, or combinations thereof.

10. The housing of claim 6 , further comprising a plug, wherein the plug is configured to fit snugly inside the cavity between the at least one of the two sidewalls, the top wall, and the bottom wall of the housing.

11. The housing of claim 6 , wherein the one or more electrical connections electrically mate with one or more bond pads of the sense die.

12. The housing of claim 6 , wherein the one or more electrical connections are configured to receive signals corresponding to an amount of force transmitted by an actuation element and sensed by the sense die.

13. A method of assembling a sensor housing, the method comprising:
forming a housing, wherein the housing comprising a top wall, and a bottom wall defining a cavity therebetween,
wherein the top wall defining an aperture extending therethrough, the aperture having a first central axis,
wherein the housing defining an opening between the top wall and the bottom wall extending from an exterior of the housing to the cavity, and wherein the opening has a second central axis and is configured to receive a sense die therethrough; and
forming electrical connections;
wherein:
the electrical connections are located on a bottom of the housing, and
the first central axis of the aperture is orthogonal to the second central axis of the opening.

14. The method of claim 13 , wherein the housing is formed by injection molding.

15. The method of claim 13 , further comprising an actuation element, wherein the actuation element is operable to receive a force and transfer the force to the sense die positioned within the housing.

16. The method of claim 13 , wherein the aperture is configured for interaction with an actuation element.

17. The method of claim 13 , wherein the electrical connections comprise at least one of laser selective plating of electrical traces, creating metal traces and over molding the metal traces onto the housing, using insert molded metal studs, or combinations thereof.

18. The method of claim 13 , wherein the sense die comprises a diaphragm based die or a slab die.

19. The method of claim 13 , further comprising a plug configured to fit snugly inside the cavity to prevent the sense die from retracting back outside the housing.

20. The method of claim 13 , further comprising a die stop configured to hold the sense die at a desired position within the housing.

Assignees

• Honeywell Int Inc

Inventors

• Machir James F
• Wade Richard
• Patch Jason Dennis

Classifications

• G01L19/0627

  Protection against aggressive medium in general · CPC title

• G01L19/141 Primary

  Monolithic housings, e.g. molded or one-piece housings · CPC title

• G01L5/0038

  applying a pushing force · CPC title

• G01L19/0069

  from the sensor to its support · CPC title

• G01L9/0052

  of piezoresistive elements (circuits therefor G01L9/06) · CPC title