Pressure-sensitive adhesive composition

Patent metadata

Field	Value
Publication number	US-10435596-B2
Application number	US-201414654265-A
Country	US
Kind code	B2
Filing date	Sep 24, 2014
Priority date	Sep 24, 2013
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.

First claim

What is claimed is:

1. A pressure-sensitive adhesive film comprising a pressure-sensitive adhesive composition, the composition comprising a pressure-sensitive adhesive resin comprising a polyisobutylene resin, and a photoinitiator, and the film satisfying the following Equations 1 and 2:
X≤1000 ppm  [Equation 1]

Y≤250 ppm,  [Equation 2]

wherein X in Equation 1 is an amount of volatile organic compounds which is measured by maintaining 50 mg of the film at 80° C. for 30 minutes, and using purge and trap-gas chromatography/mass spectrometry, and
Y in Equation 2 is an amount of ionic substances contained in the composition, which is obtained by measuring 50 mg of the film according to ASTM D 7359:2008,
wherein a moisture content of the film formed of the pressure-sensitive adhesive composition is 0.01 to 1.0 wt %, and the moisture content of the film is measured according to ASTM D3451-06 (2012) after maintaining 50 mg of the film under conditions of 25° C. and a relative humidity of 50% for 24 hours.

2. The pressure-sensitive adhesive film of claim 1 , wherein the ionic substance is halogen ions.

3. The pressure-sensitive adhesive film of claim 1 , wherein the pressure-sensitive adhesive resin has a halogen ion content of less than 300 ppm when measured according to ASTM D 7359:2008.

4. The pressure-sensitive adhesive film of claim 1 , further comprising an organic solvent of which a boiling point is 100° C. or less.

5. The pressure-sensitive adhesive film of claim 1 , wherein the photoinitiatior is a photo-radical initiator.

6. The pressure-sensitive adhesive film of claim 1 , further comprising a tackifier resin having an acid value of 1 KOH mg/g or less.

7. The pressure-sensitive adhesive film of claim 6 , wherein the tackifier resin is included at 5 to 100 parts by weight with respect to 100 parts by weight of the pressure-sensitive adhesive resin.

8. The pressure-sensitive adhesive film of claim 1 , further comprising a silane coupling agent at less than 2 parts by weight with respect to 100 parts by weight of the pressure-sensitive adhesive resin.

9. An organic electronic device, comprising:
a substrate;
an organic electronic element formed on the substrate; and
the pressure-sensitive adhesive film of claim 1 encapsulating the organic electronic element.

10. The organic electronic device of claim 9 , wherein the organic electronic element is an organic light emitting diode.

11. A method of preparing an organic electronic device, comprising applying the pressure-sensitive adhesive film of claim 1 on a substrate on which an organic electronic element is formed to cover the organic electronic element.

12. The pressure-sensitive adhesive film of claim 5 , wherein the photo-radical initiator does not comprise a cationic initiator.

13. The pressure sensitive adhesive film of claim 1 , further comprising a polyfunctional acrylate.

14. The pressure sensitive adhesive film of claim 6 , wherein the tackifier resin comprises a hydrogenated terpene-based resin, a hydrogenated ester-based resin, or a hydrogenated dicyclopentadiene-based resin.

Assignees

• Lg Chemical Ltd

Inventors

• Cho Yoon Gyung
• Yoo Hyun Jee
• Bae Kyung Yul
• Chang Suk Ky
• Shim Jung Sup

Classifications

• C09J11/02

  Non-macromolecular additives · CPC title

• C09J123/20 Primary

  having four to nine carbon atoms · CPC title

• C08K3/34

  Silicon-containing compounds · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C09J7/30 Primary

  characterised by the adhesive composition · CPC title