Conductive film

Patent metadata

Field	Value
Publication number	US-10434748-B2
Application number	US-201815977773-A
Country	US
Kind code	B2
Filing date	May 11, 2018
Priority date	Nov 13, 2015
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

A conductive film includes a film substrate and a conductive material layer. The conductive material layer is provided on a first substrate surface of the film substrate. A plurality of through holes penetrating the film substrate and the conductive material layer in a thickness direction are formed in the conductive film. The conductive material layer has a plurality of conductive portions, and the conductive portions are present between adjacent layer opening portions. The number of the conductive portion is 400 per 1 mm2, and an opening ratio of the conductive material layer is at least 40%.

First claim

What is claimed is:

1. A conductive film comprising:
a film substrate; and
a conductive material layer provided on a film substrate surface on one side of the film substrate,
wherein a plurality of through holes penetrating the film substrate and the conductive material layer in a thickness direction are formed,
wherein the conductive material layer has conductive portions between adjacent opening portions, the number of conductive portions is at least 400 per 1 mm 2 , and an opening ratio of the conductive material layer is at least 40%, and
wherein the film substrate includes a hydrophobic polymer, and the hydrophobic polymer includes any one of polybutadiene, polyisoprene, a polydimethylsiloxane derivative, or polyisobutylene.

2. The conductive film according to claim 1 , wherein a thickness of the film substrate is in a range of 0.2 μm to 20 μm.

3. The conductive film according to claim 1 , wherein the plurality of through holes are regularly arranged along the film substrate surface on one side.

4. The conductive film according to claim 3 , wherein the film substrate has a honeycomb-like structure in a case of being seen in a vertical direction of the film substrate surface on one side.

5. The conductive film according to claim 4 , wherein a thickness of a partition between the adjacent through holes gradually decreases toward a center of the film substrate in a thickness direction.

6. The conductive film according to claim 5 , wherein the partition has a partition wall opening portion on the center of the film substrate in the thickness direction.

7. The conductive film according to claim 1 , wherein the conductive material layer is formed of gold, and a thickness of the conductive material layer is in a range of 10 nm to 50 nm.

8. The conductive film according to claim 1 , wherein the conductive material layer is a member formed by a sputtering method.

9. The conductive film according to claim 1 , further comprising:
a gel layer or an elastomer layer on a film substrate surface on the other side of the film substrate.

Assignees

• Fujifilm Corp

Inventors

• Ito Koju
• Kohashi Souichi
• Yabu Hiroshi
• Nagamine Kuniaki
• Nishizawa Matsuhiko

Classifications

• B32B2266/122

  Hydrogel, i.e. a gel containing an aqueous composition · CPC title

• B32B2307/20

  having particular electrical or magnetic properties, e.g. piezoelectric · CPC title

• B32B2307/412

  Transparent · CPC title

• B32B25/16

  comprising polydienes {homopolymers} or poly-halodienes {homopolymers (B32B25/12 takes precedence)} · CPC title

• B32B25/14

  comprising {synthetic rubber copolymers (B32B25/18 and B32B25/20 take precedence)} · CPC title