Roughened substrate support

US10434629B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10434629-B2
Application numberUS-201514675379-A
CountryUS
Kind codeB2
Filing dateMar 31, 2015
Priority dateJul 27, 2012
Publication dateOct 8, 2019
Grant dateOct 8, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure generally relates to a substrate support for use in a substrate processing chamber. A roughened substrate support reduces arcing within the chamber and also contributes to uniform deposition on the substrate. A substrate support may have a substrate support body having a surface roughness of between about 707 micro-inches and about 834 micro-inches. The substrate support may have an anodized coating on the substrate support.

First claim

Opening claim text (preview).

The invention claimed is: 1. A substrate support, comprising: a substrate support body having a surface roughness of between about 707 micro-inches and about 834 micro-inches; and an anodized coating on the substrate support, wherein the surface roughness of the substrate support body translates to the anodized coating. 2. The substrate support of claim 1 , wherein the substrate support body comprises aluminum. 3. The substrate support of claim 1 , wherein the anodized coating is between about 23 μm thick and about 27 μm thick. 4. The substrate support of claim 1 , wherein the substrate support body has an inner surface, wherein the inner surface has a surface roughness, wherein the surface roughness translates to the anodized coating. 5. The substrate support of claim 1 , further comprising a substrate, wherein the anodized coating has an outer surface having a surface finish configured to promote uniform thickness of films deposited on the substrate. 6. The substrate support of claim 5 , wherein the surface finish has a roughness of about 707 micro-inches to about 847 micro-inches. 7. The substrate support of claim 1 , wherein the substrate support body comprises roughened plateaus and roughened valleys. 8. The substrate support of claim 1 , wherein the substrate support body comprises peaks and edges for contacting a substrate. 9. A substrate support comprising a roughened substrate support body, the roughened substrate support body formed by a bead blasting process, the bead blasting process comprising: bead blasting a surface of the substrate support in a first process where the beads have a first grit size; bead blasting the surface of the substrate support in a second process where the beads have a second grit size that is smaller than the first grit size, wherein the second process further comprises: scanning a nozzle across the surface of the substrate support in a first direction; shifting the nozzle along the surface of the substrate support in a second direction; scanning the nozzle across the surface of the substrate support in a third direction; rotating the substrate support about 90 degrees; scanning the nozzle across the surface of the substrate support in the first direction; shifting the nozzle along the surface of the substrate support in the second direction; and scanning the nozzle across the surface of the substrate support in the third direction; and anodizing the substrate support body to form an anodized coating, wherein the bead blasted surface of the roughened substrate support body translates to the anodized coating, and wherein the roughened substrate support body has a surface roughness of between about 707 micro-inches and about 834 micro-inches. 10. A substrate support comprising a roughened substrate support body and a substrate, the roughened substrate support body formed by a bead blasting process, the bead blasting process comprising: bead blasting a surface of the substrate support in a first process where the beads have a first grit size; bead blasting the surface of the substrate support in a second process where the beads have a second grit size that is smaller than the first grit size, wherein the second process further comprises: scanning a nozzle across the surface of the substrate support in a first direction; shifting the nozzle along the surface of the substrate support in a second direction; scanning the nozzle across the surface of the substrate support in a third direction; rotating the substrate support about 90 degrees; scanning the nozzle across the surface of the substrate support in the first direction; shifting the nozzle along the surface of the substrate support in the second direction; and scanning the nozzle across the surface of the substrate support in the third direction; and anodizing the substrate support body to form an anodized coating, wherein the bead blasted surface of the roughened substrate support body translates to the anodized coating, wherein the anodized coating has an outer surface having a surface finish configured to promote uniform thickness of films deposited on the substrate, and wherein the surface finish has a roughness of about 707 micro-inches to about 847 micro-inches.

Assignees

Inventors

Classifications

  • characterised by a coating, a hardness or a material · CPC title

  • Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods · CPC title

  • characterised by material of construction or surface finish of the means for supporting the substrate · CPC title

  • B24C1/06Primary

    for producing matt surfaces, e.g. on plastic materials, on glass · CPC title

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US10434629B2 cover?
The present disclosure generally relates to a substrate support for use in a substrate processing chamber. A roughened substrate support reduces arcing within the chamber and also contributes to uniform deposition on the substrate. A substrate support may have a substrate support body having a surface roughness of between about 707 micro-inches and about 834 micro-inches. The substrate support …
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification B24C1/06. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 08 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).