Method of producing display panels

US10434617B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10434617-B2
Application numberUS-201615577036-A
CountryUS
Kind codeB2
Filing dateMay 20, 2016
Priority dateMay 27, 2015
Publication dateOct 8, 2019
Grant dateOct 8, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of collectively producing display panels each having an outline a part of which is curved includes a bonded substrate forming process of bonding substrates in a pair one of which has thin film patterns and forming a bonded substrate 50 , a layering process of layering multiple bonded substrates 50 via curing resin 60 and curing the curing resin 60 , a grinding process of collectively grinding the substrates in a pair and the curing resin 60 that are outside the thin film pattern on each of the bonded substrates 50 B that are layered on each other along the outline and collectively forming edge surfaces of the display panels each having the curved outline, and a separation process of separating each of the bonded substrates 50 B that are layered on each other from the curing resin 60.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of collectively producing display panels each having an outline a part of which is curved, the method comprising: a bonded substrate forming process of bonding substrates in a pair one of which has thin film patterns and forming a bonded substrate; a layering process of layering multiple bonded substrates via curing resin and curing the curing resin after the bonded substrate forming process, the curing resin containing: (A) a polyfunctional (meth)acrylate oligomer/polymer and/or a polyfunctional (meth)acrylate monomer, (B) aromatic mono(meth)acrylate not having a hydroxyl group, a carboxyl group, and an epoxy group and/or alicyclic mono(meth)acrylate not having a hydroxyl group, a carboxyl group, and an epoxy group, (C) a radical photopolymerization initiator, (D) a radical thermal polymerization initiator, (E) a polymerization accelerator, and (F) thermally expandable microcapsules, as a first agent containing at least the radical photopolymerization initiator and a second agent containing at least the radical thermal polymerization initiator; a grinding process of collectively grinding the substrates in a pair and the curing resin that are outside the thin film pattern on each of the bonded substrates that are layered on each other along the outline and collectively forming edge surfaces of the display panels each having the curved outline, the grinding process being performed after the layering process; and a separation process of separating each of the bonded substrates that are layered on each other from the curing resin after the grinding process. 2. The method of producing the display panels according to claim 1 , wherein in the layering process, the curing resin is disposed only a portion near a portion of the bonded substrate overlapping the outline in a plan view. 3. The method of producing the display panels according to claim 1 , wherein in the layering process, the curing resin includes multiple types of resin that are cured by mixing. 4. The method of producing the display panels according to claim 3 , wherein in the layering process, every time another bonded substrate is layered on the bonded substrate with using the curing resin having photo curing properties, light is spotlighted to portions of the bonded substrates that are layered on each other and the portions are outside each of the thin film patterns in a plan view and the curing resin in the portions is cured. 5. The method of producing the display panels according to claim 1 , wherein in the layering process, dummy substrates in a pair having plate surfaces greater than that of the bonded substrate are prepared and after the bonded substrates are layered on each other, the bonded substrates that are layered are sandwiched by the dummy substrates in a pair via the curing resin. 6. The method of producing the display panels according to claim 1 , wherein in the layering process, the curing resin containing spacers each having a spherical shape and thermally expandable microcapsules that are expandable greater than a diameter of the spacers is used, and in the separation process, heat is applied to the curing resin to expand the microcapsules. 7. The method of producing the display panels according to claim 6 , wherein in the layering process, the microcapsules that are expandable at a temperature of 100° C. or lower are used, and in the separation process, the bonded substrates that are layered are immersed in boiling water. 8. The method of producing the display panels according to claim 7 , wherein in the layering process, the curing resin is disposed on only a part of a plate surface of the bonded substrate and a sheet member having a certain thickness is disposed on another part of the plate surface. 9. The method of producing the display panels according to claim 1 , further comprising: an etching process of removing a part of edge surfaces of the bonded substrates that are layered with etching after the grinding process and before the separation process.

Assignees

Inventors

Classifications

  • curable · CPC title

  • based on liquid crystals, e.g. single liquid crystal display cells · CPC title

  • Gaskets; Spacers; Sealing of cells · CPC title

  • of television picture tube viewing panels, headlight reflectors or the like · CPC title

  • of optical work, e.g. lenses, prisms {(control of the position of the tool for bevelling optical work B24B47/225)} · CPC title

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What does patent US10434617B2 cover?
A method of collectively producing display panels each having an outline a part of which is curved includes a bonded substrate forming process of bonding substrates in a pair one of which has thin film patterns and forming a bonded substrate 50 , a layering process of layering multiple bonded substrates 50 via curing resin 60 and curing the curing resin 60 , a grinding process of collecti…
Who is the assignee on this patent?
Sharp Kk, Denka Company Ltd
What technology area does this patent fall under?
Primary CPC classification B24B5/042. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 08 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).