Carrier tape, method for manufacturing same, and method for manufacturing RFID tag

Patent metadata

Field	Value
Publication number	US-10433470-B2
Application number	US-201715679333-A
Country	US
Kind code	B2
Filing date	Aug 17, 2017
Priority date	Nov 7, 2014
Publication date	Oct 1, 2019
Grant date	Oct 1, 2019

Abstract

A method for manufacturing a carrier tape housing a plurality of electronic components with seal materials includes forming housing holes in tape-shaped main body with first and second principal surfaces along a longitudinal direction of the tape-shaped main body, the housing holes penetrating from the first principal surface to the second principal surface, affixing an adhesive layer of a tape-shaped seal material to the second principal surface of the tape-shaped main body to cover the housing holes, forming cuts in the tape-shaped seal material to separate portions defining and functioning as the seal materials including portions at least partially overlapping with the respective housing holes in a planar view from the other portions, and providing chip-shaped electronic component into each of the housing holes of the tape-shaped main body and fixing the electronic component to the adhesive layer of the seal material exposed in each of the housing holes.

First claim

What is claimed is:

1. A carrier tape housing a plurality of electronic components with seal materials, the carrier tape comprising:
a tape-shaped main body including a first principal surface and a second principal surface and including a plurality of housing holes penetrating from the first principal surface to the second principal surface along a longitudinal direction;
a plurality of seal materials each having an adhesive layer on one principle surface and affixed to the second principal surface of the tape-shaped main body such that the adhesive layer is exposed in at least a portion of each of the housing holes; and
a plurality of chip-shaped electronic components housed in the respective housing holes and fixed to the adhesive layers of the respective seal materials; wherein
the seal materials have rigidity higher than the tape-shaped main body.

2. The carrier tape of claim 1 , wherein the electronic components are components defining RFID tags and each includes an RFIC chip and a substrate with the RFIC chip mounted thereon.

3. The carrier tape of claim 2 , wherein the substrate is a substrate of an RFID tag and includes a power feeding circuit that performs impedance matching between an antenna element and the RFIC chip.

4. The carrier tape of claim 1 , wherein a tape-shaped cover material is affixed to the first principal surface of the tape-shaped main body to cover the plurality of the housing holes housing the electronic components.

5. The carrier tape of claim 1 , wherein the electronic component includes a terminal electrode on a surface on the side opposite to a fixation surface fixed to the adhesive layer of the seal material.

6. A carrier tape housing a plurality of electronic components with seal materials, the carrier tape comprising:
a tape-shaped main body including a first principal surface and a second principal surface and including a plurality of housing holes penetrating from the first principal surface to the second principal surface along a longitudinal direction;
a plurality of seal materials each having an adhesive layer on one principle surface and affixed to the second principal surface of the tape-shaped main body such that the adhesive layer is exposed in at least a portion of each of the housing holes; and
a plurality of chip-shaped electronic components housed in the respective housing holes and fixed to the adhesive layers of the respective seal materials; wherein
the electronic components are components defining RFID tags and each includes an RFIC chip and a substrate with the RFIC chip mounted thereon; and
the substrate is a substrate of an RFID tag and includes a power feeding circuit that performs impedance matching between an antenna element and the RFIC chip.

7. The carrier tape of claim 6 , wherein the seal materials have rigidity higher than the tape-shaped main body.

8. The carrier tape of claim 6 , wherein a tape-shaped cover material is affixed to the first principal surface of the tape-shaped main body to cover the plurality of the housing holes housing the electronic components.

9. The carrier tape of claim 6 , wherein the electronic component includes a terminal electrode on a surface on the side opposite to a fixation surface fixed to the adhesive layer of the seal material.

Assignees

• Murata Manufacturing Co

Inventors

• Kato Noboru
• Komaki Kunihiro

Classifications

• G09F3/00

  Labels, tag tickets, or similar identification or indication means (medals or badges A44C3/00; making labels B31D1/02; sheets temporarily attached together B42F; labelling B65C; labels on record carriers G11B23/38, G11B23/40); Seals; Postage or like stamps · CPC title

• G06K19/077

  Constructional details, e.g. mounting of circuits in the carrier · CPC title

• H05K1/185

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title

• H05K13/003 Primary

  Placing of components on belts holding the terminals · CPC title

• G06K19/07775

  the antenna being on-chip · CPC title