Bulk amorphous alloy heat sink

Patent metadata

Field	Value
Publication number	US-10433463-B2
Application number	US-201114352381-A
Country	US
Kind code	B2
Filing date	Oct 20, 2011
Priority date	Oct 20, 2011
Publication date	Oct 1, 2019
Grant date	Oct 1, 2019

Abstract

Embodiments herein relate to a heat sink having nano- and/or micro-replication directly embossed in a bulk solidifying amorphous alloy comprising a metal alloy, wherein the heat sink is configured to transfer heat out of the heat sink by natural convection by air or forced convection by air, or by fluid phase change of a fluid and/or liquid cooling by a liquid. Other embodiments relate apparatus having the heat sink. Yet other embodiments relate to methods of manufacturing the heat sink and apparatus having the heat sink.

First claim

What is claimed:

1. A method of forming a heat sink, comprising:
heating at least a first portion of a bulk solidifying amorphous alloy component comprising an amorphous phase of a bulk solidifying amorphous alloy to a first temperature greater than a glass transition temperature (Tg) of the bulk solidifying amorphous alloy and below a melting temperature (Tm) of the bulk solidifying amorphous alloy;
while the first portion of the bulk solidifying amorphous alloy component is at the first temperature, embossing, with a mold or a stamp, nano- and/or micro-scale features on a surface of the bulk solidifying amorphous alloy component;
cooling the first portion of the bulk solidifying amorphous alloy component to a second temperature below Tg; and
after embossing the nano- and/or micro-scale features, crystallizing at least a second portion of the bulk solidifying amorphous alloy component along the surface, thereby converting an amount of the amorphous phase in the second portion to a crystalline phase.

2. The method of claim 1 , wherein the embossing comprises embossing the nano- and/or micro-scale features with the stamp.

3. The method of claim 2 , wherein the stamp has a negative image of the nano- and/or micro-scale features.

4. The method of claim 1 , wherein the mold has a negative image of the nano- and/or micro-scale features.

5. The method of claim 1 , wherein during the embossing, a temperature of the bulk solidifying amorphous alloy is below Tg or above Tg, except that a localized temperature in an area to be embossed is at the first temperature.

6. The method of claim 1 , wherein:
the method further comprises inserting the bulk solidifying amorphous alloy into the mold; and
the operation of embossing the nano- and/or micro-scale features comprises applying force on the bulk solidifying amorphous alloy via the mold.

7. The method of claim 1 , wherein the bulk solidifying amorphous alloy is described by the following molecular formula: (Zr, Ti) a (Ni, Cu, Fe) b (Be, Al, Si, B) c , wherein “a” is in the range of from 30 to 75, “b” is in the range of from 5 to 60, and “c” is in the range of from 0 to 50 in atomic percentages.

8. The method of claim 1 , wherein the bulk solidifying amorphous alloy is described by the following molecular formula: (Zr, Ti) a (Ni, Cu) b (Be) c , wherein “a” is in the range of from 40 to 75, “b” is in the range of from 5 to 50, and “c” is in the range of from 5 to 50 in atomic percentages.

9. The method of claim 1 , wherein the bulk solidifying amorphous alloy can sustain strains up to 1.5% or more without any permanent deformation or breakage.

10. The method of claim 1 , wherein the nano- and/or micro-scale features define a channel for transporting a fluid therethrough.

11. The method of claim 10 , wherein the fluid comprises a liquid.

12. The method of claim 1 , wherein the method is carried out without wet processing or etching.

13. The method of claim 1 , further comprising coating a conductive layer on a surface of the heat sink.

14. The method of claim 1 , further comprising thermally bonding the heat sink to an object by superplastic forming of the heat sink.

15. The method of claim 14 , wherein the object is an electronic device, a cooling fan and/or a thermoelectric cooling device.

16. The method of claim 14 , further comprising thermally bonding a bulk solidifying amorphous alloy cover layer between the heat sink and the object.

17. The method of claim 1 , wherein a surface of the bulk solidifying amorphous alloy component is heated to produce the crystalline phase.

18. The method of claim 1 , wherein the heat sink is configured to transfer heat out of the heat sink by natural convection by air, forced convection by air, fluid phase change of a fluid and/or liquid cooling by a liquid.

19. The method of claim 1 , wherein the operation of converting at least the second portion of the bulk solidifying amorphous alloy from the amorphous phase to the crystalline phase comprises:
heating at least the second portion of the bulk solidifying amorphous alloy component; and
cooling the second portion of the bulk solidifying amorphous alloy component at a rate selected to crystallize at least the second portion of the bulk solidifying amorphous alloy component.

20. A heat sink comprising:
a metal alloy structure of unitary construction comprising:
a first portion comprising a bulk solidifying amorphous alloy having an amorphous phase;
a second portion having a crystalline phase; and
nano- and/or micro-scale features embossed on a surface of the metal alloy structure; wherein
the heat sink is configured to transfer heat by natural convection by air or forced convection by air; and
the crystalline phase is formed along the surface of the metal alloy structure.

21. An apparatus comprising the heat sink of claim 20 and an electronic device thermally coupled to the heat sink.

22. The apparatus of claim 21 , wherein the electronic device is an IC chip.

23. The heat sink of claim 20 , wherein the second portion comprises at least 90% by volume of the crystalline phase.

24. A heat sink comprising:
a component formed of a unitary metal structure and comprising:
at least one of nano- or micro-scale features formed at a crystalline surface of the component and configured to dissipate heat; and
a base portion comprising an amorphous phase of a bulk solidifying amorphous alloy and having a thermal conductivity lower than a thermal conductivity of the crystalline surface and a same chemical composition as the crystalline surface.

25. An apparatus comprising the heat sink of claim 24 and an electronic device thermally coupled to the heat sink.

26. The apparatus of claim 25 , wherein the electronic device is an IC chip.

27. The apparatus of claim 25 , further comprising a cooling device thermally coupled to the heat sink.

28. The apparatus of claim 27 , wherein the cooling device is a cooling fan and/or a thermoelectric cooling device.

Assignees

• Prest Christopher D
• Poole Joseph
• Stevick Joseph W
• Pham Quoc Tran
• Waniuk Theodore Andrew
• Crucible Intellectual Prop Llc
• Apple Inc

Inventors

• Prest Christopher D
• Poole Joseph
• Stevick Joseph W
• Pham Quoc Tran
• Waniuk Theodore Andrew

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/43

  by flowing gases, e.g. forced air cooling · CPC title

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title