High-performance electronics cooling system

Patent metadata

Field	Value
Publication number	US-10433461-B2
Application number	US-201715797996-A
Country	US
Kind code	B2
Filing date	Oct 30, 2017
Priority date	Oct 30, 2017
Publication date	Oct 1, 2019
Grant date	Oct 1, 2019

Abstract

A cooling system for an electronic circuit package is provided. The cooling system includes a heat transfer plate positioned in thermal contact with an electronic circuit package surface and forming the bottom surface of an evaporative region of the cooling system. The cooling system also includes a plurality of condensing tubes in fluid communication with, and extending away from, the evaporative region, such that the evaporative region and the condensing tubes together form a single, uninterrupted, sealed enclosure. The cooling system also includes a fluid within the sealed enclosure. The cooling system also includes a plurality of spacers filling gaps between the heat transfer plate and the condensing tubes, such that each spacer is configured as an independent component to allow the passage of fluid through the interior space of each spacer. The cooling system also includes a plurality of wicks, where each wick is positioned partially within a corresponding spacer to which it is fluidically coupled.

First claim

What is claimed is:

1. A cooling system for an electronic circuit package, comprising:
a heat transfer plate positioned in thermal contact with an electronic circuit package surface, wherein the heat transfer plate forms a bottom surface of an evaporative region of the cooling system;
a plurality of condensing tubes in fluid communication with, and extending away from, the evaporative region, such that the evaporative region and condensing tubes together form a single, uninterrupted, sealed enclosure;
a fluid disposed within the sealed disclosure;
a plurality of spacers substantially filling gaps between the heat transfer plate and respective condensing tubes, wherein each of the spacers is configured as an independent component to allow the passage of fluid through an interior space of each spacer; and
a plurality of wicks, each wick positioned partially within a corresponding spacer to which a corresponding condensing tube is fluidically coupled.

2. The cooling system of claim 1 , wherein at a least a portion of each wick contacts the heat transfer plate.

3. The cooling system of claim 2 , wherein the portion of each wick in contact with the heat transfer plate is oriented substantially parallel to the heat transfer plate.

4. The cooling system of claim 2 , wherein the portion of each wick in contact with the heat transfer plate covers less than three-quarters of a cross sectional area of an end of a corresponding spacer.

5. The cooling system of claim 2 , wherein the portion of each wick in contact with the heat transfer plate substantially covers an end of its corresponding spacer and extends in a direction parallel to the heat transfer plate beyond an edge of the corresponding spacer.

6. The cooling system of claim 1 , wherein each wick comprises a metal mesh.

7. The cooling system of claim 1 , wherein each spacer extends at least partially into a corresponding condensing tube.

8. The cooling system of claim 1 , wherein an inner surface of each condensing tube defines a plurality of grooves.

9. The cooling system of claim 1 , wherein the heat transfer plate comprises a plurality of fins extending away from the heat transfer plate within the sealed enclosure.

10. The cooling system of claim 9 , wherein the plurality of fins are arranged in an irregular fashion.

11. The cooling system of claim 10 , wherein the plurality of fins are arranged based on a variation in heat generation across the electronic circuit package surface in thermal contact with the heat transfer plate.

12. The cooling system of claim 1 , wherein at least a portion of the sealed enclosure is coated with a copper powder.

13. The cooling system of claim 12 , wherein the copper powder has a particle size of about 0.1 mm.

14. The cooling system of claim 12 , wherein the copper powder forms a coating having a thickness of about 0.3 mm.

15. The cooling system of claim 14 , wherein the copper powder coating coats a plurality of fins extending away from the heat transfer plate within the sealed enclosure.

16. The cooling system of claim 14 , wherein the copper powder coating coats at least one of the heat transfer plate and a surface of the evaporative region opposite the heat transfer plate within the sealed enclosure.

17. The cooling system of claim 12 , wherein the interiors of the condensing tubes are free from the copper powder coating.

18. The cooling system of claim 1 , wherein a diameter of each spacer flares outward proximate to the heat transfer plate.

19. The cooling system of claim 1 , wherein a portion of each spacer extends closer to the heat transfer plate than a remainder of the spacer.

20. The cooling system of claim 1 , wherein the condensing tubes are positioned about a perimeter of the sealed enclosure.

Assignees

• Google Llc

Inventors

• Farshchian Soheil
• Samadiani Emad

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• F28F2240/00

  Spacing means · CPC title

• F28F2215/06

  Hollow fins; fins with internal circuits · CPC title

• F28D15/046 Primary

  characterised by the material or the construction of the capillary structure · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title