Assembly and lighting device comprising the assembly

Patent metadata

Field	Value
Publication number	US-10433418-B2
Application number	US-201615781140-A
Country	US
Kind code	B2
Filing date	Nov 28, 2016
Priority date	Dec 8, 2015
Publication date	Oct 1, 2019
Grant date	Oct 1, 2019

Abstract

An assembly ( 1 ) is disclosed, comprising at least one electrical device ( 5 ) and at least one carrier substrate ( 2 ) arranged to support the at least one electrical device ( 5 ). The at least one carrier substrate ( 2 ) is arranged with at least one tubular structure ( 6 ), which is at least in part hollow and arranged so as to permit passage of fluid through the at least one carrier substrate ( 2 ), for example between a first side ( 3 ) of the carrier substrate ( 2 ) and a second side ( 4 ) of the carrier substrate ( 2 ), and wherein the at least one tubular structure ( 6 ) is arranged such that it has an extension so that it protrudes a predefined distance from at least one of the first side ( 3 ) and the second side ( 4 ). A lighting device comprising the assembly ( 1 ) and a method ( 30 ) for manufacturing the assembly ( 1 ) are also disclosed.

First claim

The invention claimed is:

1. An assembly comprising:
at least one electrical device;
at least one carrier substrate arranged to support the at least one electrical device, the at least one carrier substrate comprising a metal core printed circuit board;
wherein the at least one carrier substrate is arranged with at least one tubular structure which is at least in part hollow, the tubular structure extending between a first end and a second end and having an opening at each of the ends to thereby permit passage of fluid through the at least one carrier substrate between a first side of the at least one carrier substrate and a second side of the at least one carrier substrate,
wherein the at least one tubular structure is arranged such that it has an extension so that it protrudes a predefined distance from at least one of the first side and the second side, and
wherein the at least one tubular structure is constituted by an integrally arranged portion of the at least one carrier substrate and comprises or is constituted by a deep-drawn, stamped-out or punched-through portion of the at least one carrier substrate.

2. The assembly according to claim 1 , wherein the at least one carrier substrate is arranged with an arrangement of a plurality of tubular structures, each tubular structure being at least in part hollow and arranged so as to permit passage of fluid through the at least one carrier substrate between the first side and the second side, and wherein each tubular structure is arranged such that it has an extension so that it protrudes a predefined distance from at least one of the first side and the second side.

3. The assembly according to claim 2 , wherein the at least one carrier substrate is arranged such that the plurality of tubular structures are regularly distributed on the first side and/or the second side.

4. The assembly according to claim 2 , wherein the at least one carrier substrate is arranged such that the plurality of tubular structures are irregularly distributed on the first side and/or the second side.

5. The assembly according to claim 2 , comprising a plurality of electrical devices, wherein the assembly is arranged such that it is constituted by a plurality of substantially identical sub-assemblies, each sub-assembly comprising a part or portion of the at least one carrier substrate and at least one of the plurality of electrical devices and being arranged with at least one of the plurality of tubular structures.

6. The assembly according to claim 1 , wherein the at least one electrical device comprises at least one light-emitting element, and wherein the assembly further comprises at least one optical element arranged to receive light emitted by the at least one light-emitting element and output optically modified light.

7. The assembly according to claim 1 , wherein the at least one carrier substrate is provided with at least one indentation.

8. A lighting device comprising an assembly according to claim 1 , wherein the at least one electrical device comprises at least one light-emitting element.

9. The assembly according to claim 1 , wherein the fluid is air.

10. A method for manufacturing an assembly comprising at least one electrical device and at least one carrier substrate arranged to support the at least one electrical device, the at least one carrier substrate comprising a metal core printed circuit board, and the method comprising:
arranging the at least one carrier substrate with at least one tubular structure which is at least in part hollow, the tubular structure extending between a first end and a second end and having an opening at each of the ends to thereby permit passage of fluid through the at least one carrier substrate between a first side of the at least one carrier substrate and a second side of the at least one carrier substrate, wherein the at least one tubular structure is arranged such that it has an extension so that it protrudes a predefined distance from at least one of the first side and the second side,
wherein the arranging of the at least one carrier substrate with the at least one tubular structure comprises deep-drawing, stamping out, or punching through at least a portion of the at least one carrier substrate, whereby the at least one tubular structure is constituted by an integrally arranged portion of the at least one carrier substrate.

11. A method of claim 10 wherein the fluid is air.

Assignees

• Signify Holding Bv

Inventors

• Dijken Durandus Kornelius
• Eggink Hendrik Jan

Classifications

• H05K1/0209

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• F21V29/83

  the elements having apertures, ducts or channels, e.g. heat radiation holes · CPC title

• H05K2201/064

  Fluid cooling, e.g. by integral pipes · CPC title

• H05K1/0272 Primary

  Adaptations for fluid transport, e.g. channels, holes · CPC title

• H05K1/0204

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title