Multilayer electronic component including a composite body and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10431386-B2
Application number	US-201615292813-A
Country	US
Kind code	B2
Filing date	Oct 13, 2016
Priority date	Jan 14, 2016
Publication date	Oct 1, 2019
Grant date	Oct 1, 2019

Abstract

A multilayer electronic component includes a main body including an active region in which a plurality of internal electrodes are stacked with respective dielectric layers interposed therebetween, and upper and lower cover regions disposed above and below the active region, respectively, external electrodes disposed on external surfaces of the main body and electrically connected to the plurality of internal electrodes, and a composite body disposed below the lower cover region of the main body and lower portions of the external electrodes.

First claim

What is claimed is:

1. A multilayer electronic component comprising:
a main body including an active region in which a plurality of internal electrodes are stacked with respective dielectric layers interposed therebetween, and upper and lower cover regions disposed above and below the active region, respectively;
external electrodes disposed on external surfaces of the main body and electrically connected to the plurality of internal electrodes; and
a composite body disposed below the lower cover region of the main body and lower portions of the external electrodes,
wherein the composite body comprises a dielectric material having a same composition as that of a dielectric material contained in the lower cover region of the main body,
wherein the composite body further comprises a resin, and
wherein a content of the resin is at least 6 wt % based on 100 wt % of the dielectric material.

2. The multilayer electronic component of claim 1 , wherein the dielectric material includes one or more of a barium titanate (BaTiO 3 )-based powder and a strontium titanate (SrTiO 3 )-based powder.

3. The multilayer electronic component of claim 1 , wherein the content of the resin is at most 200 wt % based on 100 wt % of the dielectric material.

4. The multilayer electronic component of claim 1 , wherein the resin is a heat-resistant resin.

5. The multilayer electronic component of claim 1 , wherein the resin includes one or more selected from the group consisting of an epoxy resin, a phenoxy resin, a polyimide resin, a polyamideimide resin, a polyether imide resin, a polysulfone resin, a polyethersulfone resin, a polyphenylene ether resin, and polycarbonate resin, a polyetherether ketone resin, and a polyester resin.

6. The multilayer electronic component of claim 1 , wherein the upper cover region of the main body has a thickness equal to or greater than that of the lower cover region of the main body.

7. The multilayer electronic component of claim 1 , wherein the composite body is arranged such that at least a portion of at least one of the upper cover region, the lower cover region, or at least one of the external electrodes, is exposed.

8. The multilayer electronic component of claim 1 , wherein an entirety of a lower surface of the external electrodes substantially contacts the composite body.

9. A multilayer electronic component comprising:
a main body including an active region in which a plurality of internal electrodes are stacked with respective dielectric layers interposed therebetween, and upper and lower cover regions disposed above and below the active region, respectively;
external electrodes disposed on external surfaces of the main body and electrically connected to the plurality of internal electrodes; and
a composite body disposed below the lower cover region of the main body and lower portions of the external electrodes,
wherein the composite body comprises a dielectric material which includes one or more of a barium titanate (BaTiO 3 )-based powder or a strontium titanate (SrTiO 3 )-based powder,
wherein the composite body further comprises a resin, and
wherein a content of the resin is at least 6 wt % based on 100 wt % of the dielectric material.

10. The multilayer electronic component of claim 9 , wherein the dielectric material contained in the composite body has the same composition as that of a dielectric material contained in the lower cover region of the main body.

11. The multilayer electronic component of claim 9 , wherein a thickness of the composite body is greater than a thickness of at least one of the external electrodes.

12. The multilayer electronic component of claim 9 , wherein the content of the resin is at most 200 wt % based on 100 wt % of the dielectric material.

13. The multilayer electronic component of claim 9 , wherein the resin is a heat-resistant resin.

14. The multilayer electronic component of claim 9 , wherein the resin includes one or more selected from the group consisting of an epoxy resin, a phenoxy resin, a polyimide resin, a polyamideimide resin, a polyether imide resin, a polysulfone resin, a polyethersulfone resin, a polyphenylene ether resin, a polycarbonate resin, a polyetherether ketone resin, and a polyester resin.

15. The multilayer electronic component of claim 9 , wherein the upper cover region of the main body has a thickness equal to or greater than that of the lower cover region of the main body.

16. The multilayer electronic component of claim 9 , wherein an entirety of a lower surface of the external electrodes substantially contacts the composite body.

Assignees

• Samsung Electro Mech

Inventors

• Kim Byung Soo
• Park Moon Soo
• Lee Jong Ho
• Hong Hyuk Jin

Classifications

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G2/065 Primary

  for surface mounting, e.g. chip capacitors · CPC title

• H01G4/40

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title