Coil electronic component and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10431368-B2
Application number	US-201615253130-A
Country	US
Kind code	B2
Filing date	Aug 31, 2016
Priority date	Dec 30, 2015
Publication date	Oct 1, 2019
Grant date	Oct 1, 2019

Abstract

A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.

First claim

What is claimed is:

1. A coil electronic component comprising:
a magnetic body,
wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on a surface of the substrate, a first coil shaped plating layer disposed between the patterned insulating films, and a second coil shaped plating layer disposed directly on the first plating layer, and
wherein a total thickness of the first and second coil shaped plating layers on the surface of the substrate exceeds a height of the patterned insulating films on the surface of the substrate,
wherein a width of a portion of the second coil shaped plating layer arranged outside an area between the patterned insulating films is less than or equal to a width of the area between the patterned insulating films.

2. The coil electronic component of claim 1 , wherein the magnetic body further includes a cover insulating layer disposed on the insulating films and the second coil shaped plating layer.

3. The coil electronic component of claim 2 , wherein the cover insulating layer is formed of a material different from that of the insulating films.

4. The coil electronic component of claim 1 , wherein the first coil shaped plating layer is integrally formed as a single plating layer.

5. The coil electronic component of claim 1 , wherein the first coil shaped plating layer has a rectangular shape.

6. The coil electronic component of claim 1 , wherein the first coil shaped plating layer has a thickness of 200 μm or more, and an aspect ratio of 1.0 or more.

7. The coil electronic component of claim 1 , wherein the insulating film has a width of 1 μm to 20 μm.

8. The coil electronic component of claim 1 , wherein the second coil shaped plating layer is an anisotropic plating layer.

9. The coil electronic component of claim 1 , wherein the second coil shaped plating layer has a round or curved upper surface.

10. A coil electronic component comprising:
a magnetic body,
wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on a surface of the substrate, a base conductor layer disposed on the surface of the substrate between the patterned insulating films, a first plating layer disposed on the base conductor layer between the patterned insulating films, and a second plating layer disposed on the first plating layer, and
wherein the base conductor layer extends between and contacts opposing walls of the patterned insulating films on the surface of the substrate,
wherein a width of a portion of the second plating layer arranged outside an area between the patterned insulating films is less than or equal to a width of the area between the patterned insulating films.

11. The coil electronic component of claim 10 , wherein the base conductor layer and first plating layer have a same width as each other between the opposing walls of the patterned insulating films.

12. The coil electronic component of claim 10 , wherein the magnetic body further includes a cover insulating layer disposed on the insulating films and the second plating layer.

13. The coil electronic component of claim 12 , wherein the cover insulating layer is formed of a material different from that of the insulating films.

14. The coil electronic component of claim 10 , wherein the first plating layer is integrally formed as a single plating layer.

15. The coil electronic component of claim 10 , wherein the first plating layer has a rectangular shape.

16. The coil electronic component of claim 10 , wherein the first plating layer has a thickness of 200 μm or more, and an aspect ratio of 1.0 or more.

17. The coil electronic component of claim 10 , wherein the insulating film has a width of 1 μm to 20 μm.

18. The coil electronic component of claim 10 , wherein the first plating layer is an isotropic plating layer and the second plating layer is an anisotropic plating layer.

19. The coil electronic component of claim 10 , wherein the first plating layer has a substantially planar upper surface and the second plating layer has a round or curved upper surface.

Assignees

• Samsung Electro Mech

Inventors

• Choi Woon Chul
• Oh Ji Hye
• Jung Jung Hyuk
• Ryu Han Wool

Classifications

• H01F2017/048

  with encapsulating core, e.g. made of resin and magnetic powder · CPC title

• H01F41/046

  structurally combined with ferromagnetic material · CPC title

• H01F27/245

  made from sheets, e.g. grain-oriented (H01F27/26 takes precedence) · CPC title

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F27/255

  made from particles (H01F27/26 takes precedence) · CPC title