Methods and systems for in-and out-of-die monitoring and characterization of multi-component tablets and for detecting and monitoring stiction and tooling material modifications on punch and die surfaces

Patent metadata

Field	Value
Publication number	US-10429352-B2
Application number	US-201715473869-A
Country	US
Kind code	B2
Filing date	Mar 30, 2017
Priority date	Mar 20, 2006
Publication date	Oct 1, 2019
Grant date	Oct 1, 2019

Abstract

The present invention relates to a methods and systems for monitoring and/or characterizing multi-component tablets and for monitoring punch and die surfaces and, more particularly, to methods and systems for in-die and out-of-die monitoring and/or characterizing multi-component tablets based on acoustic and vibrational spectroscopy and for detecting and monitoring stiction and tooling material modifications on punch and die surfaces during compaction based on acoustic/ultrasonic waves.

First claim

What is claimed is:

1. A method of detecting or monitoring powder materials sticking, tooling material mechanical property changes, or tooling geometric modifications at least one punch or die surface during compaction comprising the steps of:
transmitting a first set of acoustic or ultrasonic waves onto the surfaces of said at least one punch or die surface;
receiving a second set of acoustic or ultrasonic waves from said at least one punch or die surface;
analyzing data received from said second set of acoustic or ultrasonic waves;
determining a vibration resonance frequency of said at least one punch or die surface based on said analyzed data; and
determining a material accumulation level, geometric deformation level, or a material defect state of said at least one punch or die surface based on said determined vibration resonance frequency.

2. The method of claim 1 , further comprising the step of obtaining acoustic or ultrasonic reflection coefficients, or acoustic or ultrasonic reflection transmission coefficients of said at least one punch or die surface.

3. The method of claim 2 , wherein said step of determining further comprises the step of comparing said determined resonance frequency of said at least one punch or die surface with an original resonance frequency of said at least one punch or die surface.

4. A system for detecting or monitoring powder materials sticking, tooling material mechanical property changes, or tooling geometric modifications at least one punch or die surface during compaction comprising:
a first transducer configured to transmit a first set of acoustic or ultrasonic waves onto the surfaces of said at least one punch or die surface and to receive a second set of acoustic waves from said at least one punch or die surface;
a digitizing oscilloscope configured to receive and analyze second set of acoustic or ultrasonic wave data from said first transducer;
a non-transitory computer-readable storage medium having program code for determining a vibration resonance frequency of said at least one punch or die surface based on said analyzed data, and for determining a material accumulation level, geometric deformation level, or a material defect state of said at least one punch or die surface based on said determined vibration resonance frequency or a measured surface reflection and transmission coefficients.

5. The system of claim 4 , wherein said non-transitory computer-readable storage medium further has program code for comparing said determined resonance frequency or the measured surface reflection and transmission coefficients of said at least one punch or die surface with an original resonance frequency of said at least one punch or die surface.

Assignees

• Cetinkaya Cetin
• Univ Clarkson

Inventors

• Cetinkaya Cetin

Classifications

• G01N29/12 Primary

  by measuring frequency or resonance of acoustic waves {(measuring frequency or resonant frequency of mechanical vibrations or acoustic waves in general G01H1/06, G01H3/04, G01H13/00; acoustic resonators G10K11/04; vibration or shock testing of structures G01M7/00)} · CPC title

• B30B11/005 Primary

  Control arrangements · CPC title