Pump power consumption enhancement

US10428807B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10428807-B2
Application numberUS-201213692552-A
CountryUS
Kind codeB2
Filing dateDec 3, 2012
Priority dateDec 9, 2011
Publication dateOct 1, 2019
Grant dateOct 1, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Methods and apparatus for reducing the power consumption of a pump are provided herein. In some embodiments, a pump power consumption reduction system for use in a substrate processing system may include a vacuum chamber having an exhaust port; a valve; a first pump having a pump inlet port coupled to the exhaust port via the valve and a pump exhaust port to couple the first pump to an exhaust handling system; and a second pump coupled to the pump exhaust port to selectively reduce an exhaust pressure of the first pump.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of reducing a power consumption of a first pump coupled directly to a vacuum chamber in a substrate processing system, the method comprising: measuring the power consumption of the first pump interposed directly between the vacuum chamber and a second pump; comparing the power consumption that was measured to a first predetermined power consumption of the first pump, the first predetermined power consumption based on the power consumption of the first pump at idle; and activating the second pump coupled directly to an exhaust port of the first pump upon the power consumption that was measured of the first pump falling below the first predetermined power consumption of the first pump such that the power consumption of the first pump is reduced. 2. The method of claim 1 , wherein the first pump is an integrated point of use pump. 3. The method of claim 1 , wherein the second pump is a multi-stage pump with a primary flow path connected to the exhaust port of the first pump and with a secondary flow path parallel to and directionally synchronized with the primary flow path and connected to a gas source that produces a gas flow in the secondary flow path, wherein the gas flow in the secondary flow path creates a vacuum in the primary flow path which is regulated by a gas source pressure. 4. The method of claim 1 , wherein the second pump is a roughing pump. 5. The method of claim 1 , wherein the method further comprises de-activating the second pump upon the power consumption that was measured of the first pump falling below a second predetermined power consumption of the first pump. 6. A method of reducing a power consumption of a first pump coupled to a vacuum chamber in a substrate processing system, the method comprising: measuring a pressure within at least one of an exhaust port or an inlet port of the first pump; comparing the power consumption that was measured within the at least one of the exhaust port or the inlet port to a first predetermined pressure; bypassing a second pump, separate from the first pump, coupled to the exhaust port of the first pump when an exhaust capacity of the first pump is above a maximum intake capacity of the second pump such that the exhaust capacity of the first pump is unimpeded; and connecting and activating the second pump upon the pressure that was measured exceeding the first predetermined pressure such that an exhaust pressure of the first pump is reduced. 7. The method of claim 6 , wherein the first pump is an integrated point of use pump. 8. The method of claim 6 , wherein the second pump is a multi-stage pump with a primary flow path connected to the exhaust port of the first pump and with a secondary flow path parallel to and directionally synchronized with the primary flow path and connected to a gas source that produces a gas flow in the secondary flow path, wherein the gas flow in the secondary flow path creates a vacuum in the primary flow path which is regulated by a gas source pressure. 9. The method of claim 6 , wherein the second pump is a roughing pump. 10. The method of claim 6 , wherein the method further comprises de-activating the second pump upon the pressure that was measured falling below a second predetermined pressure. 11. The method of claim 5 , further comprising: re-activating the second pump when the power consumption that was measured reaches a third predetermined power consumption of the first pump that is greater than the second predetermined power consumption of the first pump. 12. The method of claim 6 , further comprising: determining the first predetermined pressure based on a lowest pressure obtained from the first pump during a pump down period of the vacuum chamber. 13. The method of claim 10 , further comprising: re-activating the second pump when the power consumption that was measured reaches a third predetermined power consumption of the first pump that is greater than the second predetermined power consumption of the first pump.

Assignees

Inventors

Classifications

  • to obtain high vacuum · CPC title

  • Control using electricity (regulating by means of floats actuating electric switches F04B49/04) · CPC title

  • by means of valves · CPC title

  • F04B7/00Primary

    Piston machines or pumps characterised by having positively-driven valving · CPC title

  • F04B37/06Primary

    for evacuating by thermal means · CPC title

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What does patent US10428807B2 cover?
Methods and apparatus for reducing the power consumption of a pump are provided herein. In some embodiments, a pump power consumption reduction system for use in a substrate processing system may include a vacuum chamber having an exhaust port; a valve; a first pump having a pump inlet port coupled to the exhaust port via the valve and a pump exhaust port to couple the first pump to an exhaust …
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification F04B7/00. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Oct 01 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).