System and method to determine and control wellbore stability
US-2024263553-A1 · Aug 8, 2024 · US
US10428606B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10428606-B2 |
| Application number | US-201715647936-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 12, 2017 |
| Priority date | Jul 12, 2017 |
| Publication date | Oct 1, 2019 |
| Grant date | Oct 1, 2019 |
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Multiple wires run parallel to one another. Each of wires is spaced apart from each adjacent wire at a distance less than a width of an encased microchip. Each of the plurality of wires includes a plurality of straight segments in a plane and bent segments that connect two of the plurality of straight segments. For each of the wires, each bent segments includes a first end, a second end, and a curved portion curved away from the plane. The first end is connected to at least one of the straight segments and separated from the second end a distance greater than the width of the encased microchip. The curved portion includes a diameter greater than the width of the encased microchip.
Opening claim text (preview).
What is claimed is: 1. A wire screen comprising: a plurality of wires running parallel, each of the plurality of wires is spaced apart from each adjacent wire at a distance less than a width of an encased microchip, and each of the plurality of wires includes a plurality of straight segments in a plane and each of a plurality of bent segments connects two of the plurality of straight segments, at least one of the plurality of bent segments of each wire being positioned between two straight segments of the same wire; and for each of the plurality of the wires, each bent segments in the plurality of segments includes a first end, a second end, and a curved portion curved away from the plane, the first end connected to at least one of the plurality of straight segments and separated from the second end a distance greater than the width of the encased microchip, and the curved portion includes a diameter greater than the width of the encased microchip. 2. The wire screen of claim 1 , further comprising: a plurality of support wires aligned across and attached to the plurality of segments. 3. The wire screen of claim 2 , wherein the plurality of support wires comprises four or more support wires. 4. The wire screen of claim 1 , wherein the distance between the first end and the second end and the diameter of the curved portion is five millimeters or greater. 5. The wire screen of claim 1 , wherein each bent segment further comprises: a continuously decreasing radius that circles back toward the plane; and a third bend at the second end that brings the wire to be in-line and parallel with the plane. 6. The wire screen of claim 5 , wherein a gap between the first end and the second end is ten percent larger than the encased microchip. 7. The wire screen of claim 1 , wherein the plurality of bent segments is a first plurality of bent segments and the encased microchip is a first encased microchip, the wire screen further comprising: a second plurality of bent segments, each bent segment in the second plurality of segments includes a third end, a fourth end, and a curved portion curved away from the plane, the third end connected to at least one of the plurality of straight segments and separated from the fourth end a distance greater than the width of a second encased microchip, and the curved portion includes a diameter greater than the width of the second encased microchip. 8. The wire screen of claim 7 , wherein the second encased microchip is a different size than the first microchip. 9. The wire screen of claim 1 , wherein the screen comprises a substantially rectangular cross-section.
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